JPH0396200U - - Google Patents
Info
- Publication number
- JPH0396200U JPH0396200U JP603290U JP603290U JPH0396200U JP H0396200 U JPH0396200 U JP H0396200U JP 603290 U JP603290 U JP 603290U JP 603290 U JP603290 U JP 603290U JP H0396200 U JPH0396200 U JP H0396200U
- Authority
- JP
- Japan
- Prior art keywords
- cutting blade
- cutting
- cushion material
- blade
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
第１図はこの考案の一実施例としての切断装置
を示し、切断開始前と切断終了直後の状態をそれ
ぞれ示す断面図、第２図ａ及びｂは切断装置の切
断刃側の正面図及び平面図、第３図ａ及びｂは切
断刃側の平面図及び部分正面部、第４図ａ及びｂ
は受け板側の底面図及び部分正面部、第５図は従
来の切断装置で型抜きを行なつた合成樹脂ボード
の斜視図である。
１……切断装置、２……切断刃、３……受け板
、３０……受け溝、４……第１のクツシヨン材、
５……第２のクツシヨン材。
Fig. 1 shows a cutting device as an embodiment of this invention, and is a sectional view showing the state before cutting starts and immediately after cutting, respectively. Fig. 2 a and b are a front view and a plan view of the cutting blade side of the cutting device. Fig. 3 a and b are a plan view and partial front view of the cutting blade side, Fig. 4 a and b
5 is a bottom view and a partial front view of the receiving plate side, and FIG. 5 is a perspective view of a synthetic resin board cut out using a conventional cutting device. DESCRIPTION OF SYMBOLS 1... Cutting device, 2... Cutting blade, 3... Receiving plate, 30... Receiving groove, 4... First cushion material,
5...Second cushion material.
Claims (1)
う切断装置であつて、切断刃の両側に、それぞれ
弾性変形可能な第１及び第２のクツシヨン材が設
けられていると共に、外側の第１のクツシヨン材
の高さは、切断刃の刃の高さと略同じに設けられ
、内側の第２のクツシヨン材は、切断刃から離反
した位置に、上記第１のクツシヨン材より低く設
けられており、さらに、切断刃の受け部材には、
切断刃の刃幅より広い受け溝が設けられているこ
とを特徴とする合成樹脂ボードの切断装置。 This is a cutting device that cuts a die into a predetermined shape from a synthetic resin board, and includes first and second cushion materials that are elastically deformable on both sides of a cutting blade, and an outer first cushion material. The height of the material is set to be approximately the same as the height of the blade of the cutting blade, and the inner second cushion material is provided at a position away from the cutting blade and lower than the first cushion material, and further , for the receiving member of the cutting blade,
A synthetic resin board cutting device characterized by having a receiving groove wider than the width of the cutting blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP603290U JPH0724240Y2 (en) | 1990-01-24 | 1990-01-24 | Cutting machine for synthetic resin boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP603290U JPH0724240Y2 (en) | 1990-01-24 | 1990-01-24 | Cutting machine for synthetic resin boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0396200U true JPH0396200U (en) | 1991-10-01 |
| JPH0724240Y2 JPH0724240Y2 (en) | 1995-06-05 |
Family
ID=31509715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP603290U Expired - Lifetime JPH0724240Y2 (en) | 1990-01-24 | 1990-01-24 | Cutting machine for synthetic resin boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0724240Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013017226A (en) * | 2007-10-09 | 2013-01-24 | Nitto Denko Corp | Method for manufacturing sound passing member using waterproof sound passing film |
| WO2016043266A1 (en) * | 2014-09-19 | 2016-03-24 | 株式会社Ihi | Cutting die device |
-
1990
- 1990-01-24 JP JP603290U patent/JPH0724240Y2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013017226A (en) * | 2007-10-09 | 2013-01-24 | Nitto Denko Corp | Method for manufacturing sound passing member using waterproof sound passing film |
| WO2016043266A1 (en) * | 2014-09-19 | 2016-03-24 | 株式会社Ihi | Cutting die device |
| CN106255578A (en) * | 2014-09-19 | 2016-12-21 | 株式会社Ihi | Cut die device |
| JPWO2016043266A1 (en) * | 2014-09-19 | 2017-04-27 | 株式会社Ihi | Cutting device |
| TWI611890B (en) * | 2014-09-19 | 2018-01-21 | Ｉｈｉ股份有限公司 | Cutting die device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0724240Y2 (en) | 1995-06-05 |