JPH0395803A - Conductive resin composition for shielding electromagnetic wave - Google Patents
Conductive resin composition for shielding electromagnetic waveInfo
- Publication number
- JPH0395803A JPH0395803A JP1232428A JP23242889A JPH0395803A JP H0395803 A JPH0395803 A JP H0395803A JP 1232428 A JP1232428 A JP 1232428A JP 23242889 A JP23242889 A JP 23242889A JP H0395803 A JPH0395803 A JP H0395803A
- Authority
- JP
- Japan
- Prior art keywords
- carbon black
- less
- resin composition
- weight
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000006229 carbon black Substances 0.000 claims abstract description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 8
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 230000006835 compression Effects 0.000 claims abstract description 5
- 238000007906 compression Methods 0.000 claims abstract description 5
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- 235000019241 carbon black Nutrition 0.000 description 21
- 229910052799 carbon Inorganic materials 0.000 description 11
- 239000002245 particle Substances 0.000 description 8
- 239000011231 conductive filler Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 241000872198 Serjania polyphylla Species 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910021383 artificial graphite Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000004151 quinonyl group Chemical group 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器などの1i磁波シールド材として用
いられる導電性の樹脂組或物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductive resin composition used as a 1i magnetic wave shielding material for electronic equipment and the like.
コンピューターに代表される電子機器類の急速な発展と
これら部品としてプラスチック材の汎用化が定着するに
伴って、機器および部品の静電防止、電磁波シールド等
の対策が重要な!I理となってきている。With the rapid development of electronic devices such as computers and the widespread use of plastic materials for these parts, it is important to take measures such as preventing static electricity and electromagnetic shielding of devices and parts! It has become a principle.
プラスチック材料に静電防止あるいは電磁波シールド機
能を付与する手段としては、対象となるプラスチック面
に導電性物質を塗布、溶射あるいは貼合する方法、プラ
スチック或分中に導電性物質を分散して充填複合した樹
脂組成物を目的形状に威形する方法が知られているが、
前者の方法による場合には二次的に形威した導電物質層
が界面剥離を起こして耐久性を損ねる問題があるほか、
重量増、原価高を招く不都合がある。この点、後者の場
合には導電性物賞がプラスチック組織中に充填された複
合形態を呈するため、前記のような問題は大幅に改善さ
れる利点がある。Methods for imparting antistatic or electromagnetic wave shielding functions to plastic materials include coating, thermal spraying, or laminating a conductive substance on the surface of the target plastic, or dispersing a conductive substance in the plastic to form a filling compound. There is a known method for shaping a resin composition into a desired shape.
In the case of the former method, there is a problem that the conductive material layer that has formed a secondary shape causes interfacial peeling, which impairs durability.
This has the disadvantage of increasing weight and cost. In this respect, the latter case has the advantage that the above-mentioned problems can be greatly improved because the conductive material has a composite form filled in the plastic structure.
従来、この種の充填複合系の樹脂&[l戒物に配合され
る導電性物質として、銅、鉄などの粉末、繊維もしくは
箔片といった金属系フィラー、カーボンブラック、黒鉛
粉末あるいは炭素繊維のようなカーボン系フィラーなど
が実用化されている.これらの導電性物質のうちでは、
軽量性、材料価格等の面からカーボンブラックの適用が
最も有利であるが、現状では静電防止の目的に対しては
十分な導電性能を発揮するものの、tTln波シールド
用としては配合量を極端に多くしない限り実用水準の導
電性を付与することができない.ところが、多量のカー
ボンブラックを配合した樹脂組成物は、分散の均質化が
不十分となるほか、&II戒物の流動性が低下して戒形
が困難となったり戒形品の強度特性が低下するなど加工
性の点で大きなマイナス要因となる。Conventionally, the conductive substances added to this type of filled composite resin and [l precepts] include powders such as copper and iron, metal fillers such as fibers or foil pieces, carbon black, graphite powder, and carbon fibers. Carbon-based fillers have been put into practical use. Among these conductive substances,
The use of carbon black is most advantageous in terms of lightness, material cost, etc. However, although it currently exhibits sufficient conductive performance for the purpose of preventing static electricity, it is difficult to use carbon black in extremely high amounts for tTln wave shielding. Practical level conductivity cannot be achieved unless the amount is increased. However, resin compositions containing a large amount of carbon black not only result in insufficient homogenization of dispersion, but also reduce the fluidity of &II precepts, making it difficult to form precepts, and reducing the strength properties of precepts. This is a major negative factor in terms of workability.
このようなことから、カーポンブラック単独の使用を避
けて他のカーボン系フィラーと併用する試みがなされて
おり、例えば導電性カーボンブラックと粉末状グラファ
イト(特開昭59 − 217737号公報)、コーク
ス粉とカーボンブラック(特開昭60−120758号
公報〉、カーボンブラックと黒鉛(特開昭61− 20
0604号公報〉、カーボンブラックとカーボンファイ
バー(特開昭62 − 70434号公報)などの組合
せが提案されている.
しかしながら、これらの組成によっても優れた加工性と
高性能の電磁波シールド性とを同時に付与させることが
困難であった.
〔発明が解決しようとする課題〕
従来の認識では、導電性フィラーとして適用するカーボ
ンブランクは可及的に比表面積ならびにDBP吸油量が
大きな特性、すなわち粒子径が小さくてストラクチ中一
が発達した性状のものを選定することが重要であるとさ
れていた.発明者は、十分な加工性と電磁波シールド性
能の同時付与を実現すべく鋭意研究を重ねた結果、従来
認識とは逆に比表面積およびDBP吸油量が特定値以下
の領域に属していても低位の比抵抗値をもつカーボンブ
ラックを選定しこれを黒鉛微粉末とともにプラスチック
戒分に配合した樹脂組成物は高度の電磁波シールド性と
相対的に優れた加工性を併有する事実を確認して本発明
を完戒するに至った.
したがって、本発明の目的は、カーボンブラックを含む
カーボン系フィラーを用いて良加工性と高度の電磁波シ
ールド性能を併有し、軽量で量産性に優れる電磁波シー
ルド用導電性樹脂組底物を提供するところにある。For this reason, attempts have been made to avoid using carbon black alone and to use it in combination with other carbon fillers. and carbon black (Japanese Unexamined Patent Publication No. 60-120758), carbon black and graphite (Japanese Unexamined Patent Publication No. 61-20)
No. 0604], combinations of carbon black and carbon fiber (Japanese Unexamined Patent Publication No. 70434/1983) have been proposed. However, even with these compositions, it has been difficult to simultaneously provide excellent workability and high-performance electromagnetic shielding properties. [Problem to be solved by the invention] Conventionally, the carbon blank used as a conductive filler has the characteristics of having a large specific surface area and DBP oil absorption as much as possible, that is, a small particle size and a structure with a highly developed structure. It was considered important to select the As a result of extensive research in order to achieve sufficient workability and electromagnetic shielding performance at the same time, the inventor found that, contrary to conventional wisdom, even if the specific surface area and DBP oil absorption are in the range below a specific value, The present invention was developed based on the fact that a resin composition made by selecting carbon black with a specific resistance value of I have come to the point where I am fully admonished. Therefore, an object of the present invention is to provide a conductive resin assembly for electromagnetic shielding that uses a carbon-based filler containing carbon black, has good processability and high electromagnetic shielding performance, is lightweight, and is excellent in mass production. It's there.
上記の目的を達或するための本発明による電磁波シール
ド用導電性樹脂組或物は、熱可塑性樹脂100重量部に
対し、窒素吸着比表面積50m”/g以下、DBP吸油
量90m/100g以下、圧縮電気比抵抗(5(lkg
/cm”時)0.25Ω側以下の性状特性を有するカー
ボンブラックおよび黒鉛微粉末を合計量として100〜
260重量部の割合で配合してなる組成を構或上の特徴
とするものである.
熱可塑性樹脂としては、ポリプロピレン、ポリエチレン
等のポリオレフィン系樹脂、ポリイミド樹脂、ABS樹
脂、ポリカーボネート樹脂など常用の樹脂類が用いられ
る。To achieve the above object, the conductive resin assembly or material for electromagnetic shielding according to the present invention has a nitrogen adsorption specific surface area of 50 m"/g or less, a DBP oil absorption of 90 m/100 g or less, and Compression electrical resistivity (5 (lkg)
/cm'' time) 100~
The structural feature is that the composition is blended in a proportion of 260 parts by weight. As the thermoplastic resin, commonly used resins such as polyolefin resins such as polypropylene and polyethylene, polyimide resins, ABS resins, and polycarbonate resins are used.
導電性フィラーとなるカーボンブラックには、窒素吸着
比表面積が50m!/g以下でDBP吸油量が90af
fi/100g以下の粒子性状を有し、同時に負荷圧力
50kg/cm”時における圧縮電気比抵抗が0.25
Ωcm以下の選沢的特性を備えるものを適用する.この
理由は、窒素吸着比表面積が50m”/gを越えDBP
吸油量が90−/100gを上廻る従来タイプの粒子性
状では配合量を多くした際の戒形加工性が著しく減退し
、また圧縮電気比抵抗(50kg/cm”時)が0.2
5ΩC■を越えると樹脂戒分に所定の電磁波シールド効
果を与えるに十分な導電性を付与することができなくな
る.
このような性状特性のカーボンブラックは、例えばSR
FあるいはGPF品種など50m”/g以下の窒素吸着
比表面積と90m/100.以下のDBP吸油量の特性
をもつファーネスブラックに熱履歴を与えることによっ
て製造することができる.熱履歴は、カーボンブラック
を窒素、アルゴンなどの不活性ガス中で1000℃以上
、望ましくは1200〜l500℃の温度域で加熱する
ことによっておこなわれる.加熱温度が1000゜Cを
下廻ると導電性の阻害要因となる表面官能基、とくにキ
ノン基等の強固なラジカルを除去することができず、本
発明で特定する性状特性を得ることが困難となる.
上記のカーボンブラックと共用される黒鉛微粉末は、天
然黒鉛あるいは人造黒鉛を平均粒子径10μ慣以下に微
粉砕したものが用いられる.カーボンブラックと黒鉛微
粉末の配合&I或は、重量比(CB : G)として1
:3〜2:1、より望ましくは1:2〜3の範囲に設定
することが好適で、この範囲を外れる場合には高度のt
磁波シールド性能ならびに加工性を同時に付与すること
が困難となる.
これらカーボンブラックと黒鉛微粉末からなる導電性フ
ィラーは、合計量として熱可塑性樹脂100重量部に対
し100〜260重量部の割合で配合される.この配合
割合が100重量部未満では導電性が十分に向上せず、
260重量部を越える高配合領域では可塑化時の流動性
が極端に低下して戒形加工性の減退を招く.
熱可塑性樹脂材料には、上記の特定されたカーボンブラ
ンクと黒鉛微粉末からなる導電性フィラーのほかに、必
要に応じ老化防止剤、難燃剤、シランカップリング剤、
無機質充填剤、滑剤などを添加することにより本発明の
組成をもつt磁波シールド用導電性樹脂m威物を得る.
〔作 用〕
本発明による電磁波シールド用導電性樹脂組成物を構威
する導電性フィラーのうち、カーボンブラックの有する
窒素吸着比表面積5h”/g以下およびDBP吸油fi
90d/100g以下の粒子性状は配合樹脂の或形加工
性を改善するための働きをする.この種の大きな粒子径
とストラクチャ一発達度の低いカーボンブラックは導電
性付与の面では不利となるが、かかる導電性不足分は圧
縮電気比抵抗(50kg/c1) 0 . 25ΩC■
以下の特性によって補填されるとともに良導電性の黒鉛
微粉末の配合で一層効果的に向上する.
したがって、カーボンブラック特有のネットヮーク導電
作用と黒鉛固有の分散導電作用とが相乗して電磁波シー
ルド性能の高度化に寄与し、同時に加工面で有利なカー
ボンブランク粒子性状の機能に基づいて相対的に良好な
成形加工性が付与される。Carbon black, which serves as a conductive filler, has a nitrogen adsorption specific surface area of 50m! /g or less, DBP oil absorption is 90af
It has particle properties of fi/100g or less, and at the same time has a compression electrical resistivity of 0.25 at a load pressure of 50kg/cm.
Those with selective characteristics of Ωcm or less are applied. The reason for this is that DBP has a nitrogen adsorption specific surface area of over 50 m”/g.
In the case of conventional type particles with oil absorption exceeding 90-/100g, the formability is significantly reduced when the blending amount is increased, and the compressive electrical resistivity (at 50kg/cm) is 0.2
If it exceeds 5ΩC■, it will not be possible to impart sufficient conductivity to the resin to provide the desired electromagnetic shielding effect. Carbon black with such physical characteristics is, for example, SR
It can be produced by giving a thermal history to furnace black, such as F or GPF, which has a nitrogen adsorption specific surface area of 50 m"/g or less and a DBP oil absorption of 90 m"/100. This is done by heating the material in an inert gas such as nitrogen or argon at a temperature of 1,000°C or higher, preferably in the range of 1,200 to 1,500°C.If the heating temperature is below 1,000°C, the surface becomes a barrier to conductivity. Functional groups, especially strong radicals such as quinone groups, cannot be removed, making it difficult to obtain the properties specified in the present invention. Artificial graphite that has been finely ground to an average particle size of 10 μm or less is used.A blend of carbon black and fine graphite powder or a weight ratio (CB:G) of 1
:3 to 2:1, more preferably 1:2 to 3. If the ratio is outside this range, the altitude t
It becomes difficult to simultaneously provide magnetic shielding performance and workability. The conductive filler consisting of carbon black and fine graphite powder is blended in a total amount of 100 to 260 parts by weight per 100 parts by weight of the thermoplastic resin. If this blending ratio is less than 100 parts by weight, the conductivity will not be sufficiently improved,
In the high content range exceeding 260 parts by weight, the fluidity during plasticization is extremely reduced, leading to a decrease in formability. In addition to the above-specified carbon blank and a conductive filler made of fine graphite powder, the thermoplastic resin material may contain anti-aging agents, flame retardants, silane coupling agents,
By adding an inorganic filler, a lubricant, etc., a conductive resin for magnetic wave shielding having the composition of the present invention is obtained. [Function] Among the conductive fillers constituting the conductive resin composition for electromagnetic shielding according to the present invention, carbon black has a nitrogen adsorption specific surface area of 5 h"/g or less and DBP oil absorption fi
Particle properties of 90d/100g or less serve to improve the formability of the compounded resin. This type of carbon black with a large particle size and a low degree of structure development is disadvantageous in terms of imparting electrical conductivity, but this lack of electrical conductivity is due to the compression electrical resistivity (50 kg/c1) 0. 25ΩC■
This is compensated for by the following properties, and is further effectively improved by blending fine graphite powder with good conductivity. Therefore, the network conductivity peculiar to carbon black and the dispersion conductivity peculiar to graphite synergize and contribute to the enhancement of electromagnetic shielding performance, and at the same time, it is relatively good based on the functions of carbon blank particle properties that are advantageous in terms of processing. Provides excellent moldability.
以下、本発明の実施例を比較例と対比して説明する。 Examples of the present invention will be described below in comparison with comparative examples.
実施例1〜4、比較例1〜3
導電性フィラーとなるカーボンブラックとしては表1に
示す3種類のものを用い、黒鉛微粉末には平均粒子径8
μ指の人造黒鉛粉末〔東海カーボン■製〕を用いた。Examples 1 to 4, Comparative Examples 1 to 3 Three types of carbon black shown in Table 1 were used as the conductive filler, and the graphite fine powder had an average particle size of 8.
μ-finger artificial graphite powder [manufactured by Tokai Carbon ■] was used.
また、熱可塑性樹脂としては、比重0.90,メルトイ
ンデックス(Ml)30のボリブロビレン〔徳山曹達■
製、115 − 68 )を適用した.表1
表注=1)東海カーボン■製、シースト■.2)ケッチ
ェンブラックEC.
3)東海カーボン■製、シースト3
4)ASTM D−3037に準じて測定。In addition, as a thermoplastic resin, polypropylene [Tokuyama Soda ■] with a specific gravity of 0.90 and a melt index (Ml) of 30 is used.
115-68) was applied. Table 1 Table note = 1) Manufactured by Tokai Carbon ■, Seast ■. 2) Ketjen Black EC. 3) Manufactured by Tokai Carbon ■, Seast 3 4) Measured according to ASTM D-3037.
5)JIS K6211により測定. 6)JIS K1469電気抵抗率測定法で測定。5) Measured according to JIS K6211. 6) Measured using JIS K1469 electrical resistivity measurement method.
上記のポリプロピレン樹脂100重量部にカーボンブラ
ックA,BおよびCと黒鉛微粉末を配合比率を変えて配
合し、ラボブラストミル〔東洋精機■製〕で混練して樹
脂組或物を得た。100 parts by weight of the above polypropylene resin were mixed with carbon blacks A, B and C and fine graphite powder in varying proportions, and kneaded in a Labo Blast Mill (manufactured by Toyo Seiki ■) to obtain a resin composition.
ついで、各樹脂組成物をプレス戒形により縦横15ha
、厚さ2.5問の寸法に成形した。得られた各或形体
につき、アドバンテスト法〔アドバンテスト社製シール
ド評価器、TR17301^使用〕による100〜10
00門Hz範囲のシールド特性、およびJISK721
0 ’熱可塑性プラスチックの流れ試験法」に準じ温
度230゜C+0.2’C、荷重10kgによる流動特
性(加工性)をそれぞれ測定した。Next, each resin composition was pressed into a size of 15 ha in length and width.
, and the thickness was 2.5 mm. For each shape obtained, the score was 100 to 10 according to the Advantest method [using a shield evaluation device manufactured by Advantest, TR17301^].
Shielding characteristics in the Hz range and JISK721
The flow characteristics (processability) were measured at a temperature of 230°C + 0.2'C and a load of 10kg according to ``Flow Test Method for Thermoplastic Plastics''.
それらの結果を、配合条件と対比して表2に示した.
表2の結果から、カーポンブラックAを用いた実施例に
よる樹脂&[l戒物は、カーボンブランクBを用いた比
較例に比べて高度の電磁波シールド性能と相対的に良好
な加工性を併有していることが認められる。The results are shown in Table 2 in comparison with the blending conditions. From the results in Table 2, it can be seen that the resin &[l kaimono according to the example using carbon black A has both high electromagnetic shielding performance and relatively good processability compared to the comparative example using carbon blank B. It is recognized that they are doing so.
更に、実施例4の組成配合物を連統混練機で混練し、射
出或形(180〜220 ’C、射出圧力135kg/
c一)したところ、曲げ強度(JIS K7203)3
80kg/am”の高強度戒形体が寸法安定性よく形或
された。Furthermore, the composition blend of Example 4 was kneaded in a continuous kneader, and injection molded (180-220'C, injection pressure 135 kg/
c) As a result, bending strength (JIS K7203) 3
A high-strength 80 kg/am'' shaped body was formed with good dimensional stability.
以上のとおり、本発明に従えばカーボンブラックを含む
カーボン系の導電性フィラーを用いて、高度の電磁波シ
ールド性能と良好な加工性を同時に備える樹脂組成物を
提供することができる。As described above, according to the present invention, it is possible to provide a resin composition that simultaneously has high electromagnetic shielding performance and good processability by using a carbon-based conductive filler containing carbon black.
したがって、軽量で戒形量産性に冨む電磁波シールド用
樹脂組成物を安価に供給することが可能となる。Therefore, it becomes possible to supply at low cost a resin composition for electromagnetic shielding that is lightweight and highly suitable for mass production.
Claims (2)
積50m^2/g以下、DBP吸油量90ml/100
g以下、圧縮電気比抵抗(50kg/cm^2時)0.
25Ωcm以下の性状特性を有するカーボンブラックお
よび黒鉛微粉末を合計量として100〜260重量部の
割合で配合してなる組成の電磁波シールド用導電性樹脂
組成物。1. Nitrogen adsorption specific surface area 50m^2/g or less, DBP oil absorption 90ml/100 per 100 parts by weight of thermoplastic resin
g or less, compression electrical specific resistance (50 kg/cm^2 o'clock) 0.
A conductive resin composition for electromagnetic shielding, which contains carbon black and fine graphite powder having physical characteristics of 25 Ωcm or less in a total amount of 100 to 260 parts by weight.
比(CB:G)として1:3〜2:1の範囲にある請求
項1記載の電磁波シールド用導電性樹脂組成物。2. The conductive resin composition for electromagnetic shielding according to claim 1, wherein the blending composition of carbon black and graphite fine powder is in a weight ratio (CB:G) of 1:3 to 2:1.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1232428A JPH0395803A (en) | 1989-09-07 | 1989-09-07 | Conductive resin composition for shielding electromagnetic wave |
KR1019900007174A KR950012656B1 (en) | 1989-09-07 | 1990-05-19 | Electric conductive resin product for shielding electromagnetic wave |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1232428A JPH0395803A (en) | 1989-09-07 | 1989-09-07 | Conductive resin composition for shielding electromagnetic wave |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0395803A true JPH0395803A (en) | 1991-04-22 |
Family
ID=16939115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1232428A Pending JPH0395803A (en) | 1989-09-07 | 1989-09-07 | Conductive resin composition for shielding electromagnetic wave |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0395803A (en) |
KR (1) | KR950012656B1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04342758A (en) * | 1991-05-21 | 1992-11-30 | Teijin Chem Ltd | Electroconductive thermoplastic resin composition |
JP2001019891A (en) * | 1999-07-07 | 2001-01-23 | Matsushita Electric Ind Co Ltd | Carbon paste |
JP2002359492A (en) * | 2001-06-01 | 2002-12-13 | Nok Corp | Rubber composition for electromagnetic wave shielding |
WO2006003924A1 (en) * | 2004-06-30 | 2006-01-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Electromagnetic wave absorbent |
JP2009054983A (en) * | 2007-01-17 | 2009-03-12 | Mitsubishi Pencil Co Ltd | Radio wave absorbing material and its manufacturing method |
WO2018143224A1 (en) * | 2017-01-31 | 2018-08-09 | Nti株式会社 | Resin compound and molded product of resin compound |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100526485B1 (en) * | 1997-12-31 | 2006-03-09 | 주식회사 케이씨씨 | Powder Coating Composition Containing Low Temperature Curing Resin |
-
1989
- 1989-09-07 JP JP1232428A patent/JPH0395803A/en active Pending
-
1990
- 1990-05-19 KR KR1019900007174A patent/KR950012656B1/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04342758A (en) * | 1991-05-21 | 1992-11-30 | Teijin Chem Ltd | Electroconductive thermoplastic resin composition |
JP2001019891A (en) * | 1999-07-07 | 2001-01-23 | Matsushita Electric Ind Co Ltd | Carbon paste |
JP2002359492A (en) * | 2001-06-01 | 2002-12-13 | Nok Corp | Rubber composition for electromagnetic wave shielding |
WO2006003924A1 (en) * | 2004-06-30 | 2006-01-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Electromagnetic wave absorbent |
JP2009054983A (en) * | 2007-01-17 | 2009-03-12 | Mitsubishi Pencil Co Ltd | Radio wave absorbing material and its manufacturing method |
WO2018143224A1 (en) * | 2017-01-31 | 2018-08-09 | Nti株式会社 | Resin compound and molded product of resin compound |
Also Published As
Publication number | Publication date |
---|---|
KR950012656B1 (en) | 1995-10-19 |
KR910006389A (en) | 1991-04-29 |
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