JPH0395676U - - Google Patents

Info

Publication number
JPH0395676U
JPH0395676U JP216390U JP216390U JPH0395676U JP H0395676 U JPH0395676 U JP H0395676U JP 216390 U JP216390 U JP 216390U JP 216390 U JP216390 U JP 216390U JP H0395676 U JPH0395676 U JP H0395676U
Authority
JP
Japan
Prior art keywords
circuit pattern
layer
pattern layer
insulating
metal substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP216390U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP216390U priority Critical patent/JPH0395676U/ja
Priority to GB9100480A priority patent/GB2240663A/en
Publication of JPH0395676U publication Critical patent/JPH0395676U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP216390U 1990-01-12 1990-01-12 Pending JPH0395676U (US06633600-20031014-M00021.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP216390U JPH0395676U (US06633600-20031014-M00021.png) 1990-01-12 1990-01-12
GB9100480A GB2240663A (en) 1990-01-12 1991-01-10 Metal base wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP216390U JPH0395676U (US06633600-20031014-M00021.png) 1990-01-12 1990-01-12

Publications (1)

Publication Number Publication Date
JPH0395676U true JPH0395676U (US06633600-20031014-M00021.png) 1991-09-30

Family

ID=31506043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP216390U Pending JPH0395676U (US06633600-20031014-M00021.png) 1990-01-12 1990-01-12

Country Status (1)

Country Link
JP (1) JPH0395676U (US06633600-20031014-M00021.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006187882A (ja) * 2004-12-28 2006-07-20 Chinsei Enami 中綴じ製本装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254039A (ja) * 1985-05-02 1986-11-11 Sony Corp 回路パタ−ン形成方法
JPS622591A (ja) * 1985-06-28 1987-01-08 電気化学工業株式会社 金属ベ−ス混成集積回路基板の製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254039A (ja) * 1985-05-02 1986-11-11 Sony Corp 回路パタ−ン形成方法
JPS622591A (ja) * 1985-06-28 1987-01-08 電気化学工業株式会社 金属ベ−ス混成集積回路基板の製法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006187882A (ja) * 2004-12-28 2006-07-20 Chinsei Enami 中綴じ製本装置
JP4515250B2 (ja) * 2004-12-28 2010-07-28 鎭生 江浪 中綴じ製本装置

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