JPH0395657U - - Google Patents
Info
- Publication number
- JPH0395657U JPH0395657U JP1990002360U JP236090U JPH0395657U JP H0395657 U JPH0395657 U JP H0395657U JP 1990002360 U JP1990002360 U JP 1990002360U JP 236090 U JP236090 U JP 236090U JP H0395657 U JPH0395657 U JP H0395657U
- Authority
- JP
- Japan
- Prior art keywords
- header
- integrated circuit
- semiconductor integrated
- package
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990002360U JPH0395657U (US20030199744A1-20031023-C00003.png) | 1990-01-17 | 1990-01-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990002360U JPH0395657U (US20030199744A1-20031023-C00003.png) | 1990-01-17 | 1990-01-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0395657U true JPH0395657U (US20030199744A1-20031023-C00003.png) | 1991-09-30 |
Family
ID=31506237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990002360U Pending JPH0395657U (US20030199744A1-20031023-C00003.png) | 1990-01-17 | 1990-01-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0395657U (US20030199744A1-20031023-C00003.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005302990A (ja) * | 2004-04-12 | 2005-10-27 | Miyota Kk | パッケージ用ロー材付き封着板およびその製造方法 |
WO2023149251A1 (ja) * | 2022-02-03 | 2023-08-10 | 日本電気硝子株式会社 | 複合体、及びこの複合体を備えた気密パッケージ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232641A (ja) * | 1985-04-09 | 1986-10-16 | Nec Corp | 半導体容器 |
-
1990
- 1990-01-17 JP JP1990002360U patent/JPH0395657U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232641A (ja) * | 1985-04-09 | 1986-10-16 | Nec Corp | 半導体容器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005302990A (ja) * | 2004-04-12 | 2005-10-27 | Miyota Kk | パッケージ用ロー材付き封着板およびその製造方法 |
JP4494849B2 (ja) * | 2004-04-12 | 2010-06-30 | シチズンファインテックミヨタ株式会社 | パッケージ用ロー材付き封着板およびその製造方法 |
WO2023149251A1 (ja) * | 2022-02-03 | 2023-08-10 | 日本電気硝子株式会社 | 複合体、及びこの複合体を備えた気密パッケージ |