JPH0395642U - - Google Patents

Info

Publication number
JPH0395642U
JPH0395642U JP1990002992U JP299290U JPH0395642U JP H0395642 U JPH0395642 U JP H0395642U JP 1990002992 U JP1990002992 U JP 1990002992U JP 299290 U JP299290 U JP 299290U JP H0395642 U JPH0395642 U JP H0395642U
Authority
JP
Japan
Prior art keywords
region
workpiece
bonding
atmospheric gas
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990002992U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087633Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990002992U priority Critical patent/JPH087633Y2/ja
Publication of JPH0395642U publication Critical patent/JPH0395642U/ja
Application granted granted Critical
Publication of JPH087633Y2 publication Critical patent/JPH087633Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990002992U 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造 Expired - Lifetime JPH087633Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990002992U JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990002992U JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Publications (2)

Publication Number Publication Date
JPH0395642U true JPH0395642U (enrdf_load_stackoverflow) 1991-09-30
JPH087633Y2 JPH087633Y2 (ja) 1996-03-04

Family

ID=31506835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990002992U Expired - Lifetime JPH087633Y2 (ja) 1990-01-17 1990-01-17 ワイヤボンディング装置の雰囲気構造

Country Status (1)

Country Link
JP (1) JPH087633Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323433A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd 入場者管理システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006323433A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd 入場者管理システム

Also Published As

Publication number Publication date
JPH087633Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term