JPH0395641U - - Google Patents
Info
- Publication number
- JPH0395641U JPH0395641U JP303990U JP303990U JPH0395641U JP H0395641 U JPH0395641 U JP H0395641U JP 303990 U JP303990 U JP 303990U JP 303990 U JP303990 U JP 303990U JP H0395641 U JPH0395641 U JP H0395641U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- package
- metal frame
- thermosetting resin
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP303990U JPH0395641U (enExample) | 1990-01-17 | 1990-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP303990U JPH0395641U (enExample) | 1990-01-17 | 1990-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0395641U true JPH0395641U (enExample) | 1991-09-30 |
Family
ID=31506881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP303990U Pending JPH0395641U (enExample) | 1990-01-17 | 1990-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0395641U (enExample) |
-
1990
- 1990-01-17 JP JP303990U patent/JPH0395641U/ja active Pending