JPS62174340U - - Google Patents
Info
- Publication number
- JPS62174340U JPS62174340U JP1986062156U JP6215686U JPS62174340U JP S62174340 U JPS62174340 U JP S62174340U JP 1986062156 U JP1986062156 U JP 1986062156U JP 6215686 U JP6215686 U JP 6215686U JP S62174340 U JPS62174340 U JP S62174340U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- backflow
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986062156U JPS62174340U (enExample) | 1986-04-23 | 1986-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986062156U JPS62174340U (enExample) | 1986-04-23 | 1986-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174340U true JPS62174340U (enExample) | 1987-11-05 |
Family
ID=30896158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986062156U Pending JPS62174340U (enExample) | 1986-04-23 | 1986-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174340U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02260547A (ja) * | 1989-03-31 | 1990-10-23 | Polyplastics Co | 電子部品の樹脂封止方法、樹脂封止用成形金型及び電子部品封止成形品 |
-
1986
- 1986-04-23 JP JP1986062156U patent/JPS62174340U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02260547A (ja) * | 1989-03-31 | 1990-10-23 | Polyplastics Co | 電子部品の樹脂封止方法、樹脂封止用成形金型及び電子部品封止成形品 |