JPH0394788U - - Google Patents
Info
- Publication number
- JPH0394788U JPH0394788U JP174190U JP174190U JPH0394788U JP H0394788 U JPH0394788 U JP H0394788U JP 174190 U JP174190 U JP 174190U JP 174190 U JP174190 U JP 174190U JP H0394788 U JPH0394788 U JP H0394788U
- Authority
- JP
- Japan
- Prior art keywords
- guide
- back surface
- lower substrate
- hole
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Connecting Device With Holders (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP174190U JPH0394788U (zh) | 1990-01-12 | 1990-01-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP174190U JPH0394788U (zh) | 1990-01-12 | 1990-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0394788U true JPH0394788U (zh) | 1991-09-26 |
Family
ID=31505636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP174190U Pending JPH0394788U (zh) | 1990-01-12 | 1990-01-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0394788U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010166A (ja) * | 2006-06-27 | 2008-01-17 | Molex Inc | ソケット |
JP2013134854A (ja) * | 2011-12-26 | 2013-07-08 | Enplas Corp | 電気部品用ソケット |
KR101837928B1 (ko) * | 2017-12-13 | 2018-03-21 | (주)진광건설엔지니어링 | 정보통신기기용 모듈의 완충장치 |
-
1990
- 1990-01-12 JP JP174190U patent/JPH0394788U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008010166A (ja) * | 2006-06-27 | 2008-01-17 | Molex Inc | ソケット |
JP4646863B2 (ja) * | 2006-06-27 | 2011-03-09 | モレックス インコーポレイテド | ソケット |
JP2013134854A (ja) * | 2011-12-26 | 2013-07-08 | Enplas Corp | 電気部品用ソケット |
KR101837928B1 (ko) * | 2017-12-13 | 2018-03-21 | (주)진광건설엔지니어링 | 정보통신기기용 모듈의 완충장치 |