JPH0394095A - Tin and tin alloy plated material - Google Patents
Tin and tin alloy plated materialInfo
- Publication number
- JPH0394095A JPH0394095A JP32617188A JP32617188A JPH0394095A JP H0394095 A JPH0394095 A JP H0394095A JP 32617188 A JP32617188 A JP 32617188A JP 32617188 A JP32617188 A JP 32617188A JP H0394095 A JPH0394095 A JP H0394095A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tin
- stress
- hardness
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 title claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 107
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000010008 shearing Methods 0.000 abstract description 3
- 238000007665 sagging Methods 0.000 abstract description 2
- 239000002932 luster Substances 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000006835 compression Effects 0.000 description 8
- 238000007906 compression Methods 0.000 description 8
- 229940098779 methanesulfonic acid Drugs 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- LEMQFBIYMVUIIG-UHFFFAOYSA-N trifluoroborane;hydrofluoride Chemical compound F.FB(F)F LEMQFBIYMVUIIG-UHFFFAOYSA-N 0.000 description 4
- 239000012190 activator Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 3
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- -1 Methanesulfonic acid Tin Methanesulfonate Lead Methanesulfonic acid Chemical compound 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003648 hair appearance Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、錫および錫合金めっき伺の改良に関するもの
で、特にめっき材のプレス加工性の改善に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to improvement of tin and tin alloy plating surfaces, and particularly to improvement of press workability of plated materials.
［従来の技術］
錫および錫合金は、りん青銅、黄銅等の銅合金にめっき
され、プレス加工を受けた後、端子コネクター等の電子
部品に利用される。[Prior Art] Tin and tin alloys are plated onto copper alloys such as phosphor bronze and brass, and after being pressed, are used for electronic components such as terminal connectors.
［発明が解決しようとする課ｆｆｉ］
従来の錫および錫合金めっき材はプレス剪断加上１時に
月料エッヂ部のだれ部から剪断四にかけてのめっきが剥
離してヒゲ状になる、いゎゆるヒゲバリという異常が発
生する。このヒゲバリは電子部品として組み込まれた時
に回路短絡の原因となり好ましくない。[Issue to be solved by the inventionffi] In conventional tin and tin alloy plated materials, the plating peels off from the sagging part of the edge part of the metal plate to the shearing part 4 when press shearing is applied, resulting in a so-called whisker-like condition. An abnormality called beard burr occurs. This burr is undesirable because it causes a short circuit when it is assembled as an electronic component.
また、プレス時にもヒゲバリが脱落して、プレス金型に
付着し、押し込み等の原因ともなる。In addition, during pressing, the burr falls off and adheres to the press mold, causing push-in and the like.
押し込みが発坐した場合には、プレス作業を中断し、金
型清掃もしくは金型交換を行う必要があり、作業効率が
悪化する。If the pressing occurs, it is necessary to interrupt the press operation and clean or replace the mold, which deteriorates work efficiency.
このように、錫および錫合金めっきのプレス加工時のヒ
ゲバリ発生は、電子部品としての信頼性、プレス作業の
効率化という点から強く解決が望まれている。As described above, there is a strong desire to solve the occurrence of burrs during press processing of tin and tin alloy plating from the viewpoint of reliability as an electronic component and efficiency of press work.
［課題を解決するための手段］
本発明者は、かかる状況に鑑みて、錫および錫合金めっ
き材のプレス加工性を改善すべく鋭意研究を重ねてきた
。その結果、錫および錫合金めっき月のめっき゛応力並
びにめっき硬さを調整することにより所期の目的が達成
されることを見出し、ここに本発明を完或するに至った
。[Means for Solving the Problems] In view of the above situation, the present inventor has conducted extensive research to improve the press workability of tin and tin alloy plated materials. As a result, it was discovered that the desired object could be achieved by adjusting the plating stress and plating hardness of tin and tin alloy plating, and the present invention was completed.
すなわち、本発明はめっき応力が５ｋｇ／ｉｕｎ ’以
下でめっき硬さが１５１１ｖ以下であることを特徴とす
る錫および錫合金めっき利である。That is, the present invention is a tin and tin alloy plating product characterized in that the plating stress is 5 kg/iun' or less and the plating hardness is 1511 V or less.
めっき応力とは、めっきを施すことにより、めっき昇面
にかかる応力のことであって、一般的にはめっきの層厚
が厚くなればなる程、めっき応力は大きくなる。通常の
光沢めっきでは、めっき応力は５〜８ｋｇ／ｍｍ ２程
度となる。また、めっき硬さは通常低荷重でマイクロビ
ッカース硬度計で測定するか、断面でヌーブで測定する
が、従来のめっきでは浴組戒やめっき条件によっても異
なるが、中にはＩＩ ｖ ２ ０以上のものもある。Plating stress is stress applied to a plated surface by applying plating, and generally, the thicker the plating layer, the greater the plating stress. In normal bright plating, the plating stress is about 5 to 8 kg/mm2. In addition, plating hardness is usually measured with a micro-Vickers hardness tester under low load, or measured with a cross section using a noob, but in conventional plating, it varies depending on the bath composition and plating conditions, but some hardness is higher than II v 20. There are also some.
めっき応力並びにめっき硬さを下げる手段としては、例
えばリフロー処理の如き熱処理が挙げられる。リフロー
処理とはめっきを加熱溶融して再凝固させることにより
、表面光沢等の表面品質を得る処理のことである。かか
る熱処理によってめっき応力並びにめっき硬さは緩和さ
れるため、めっき応力、めっき硬さを押える手法とめっ
き後の熱処理は重要である。As a means for reducing plating stress and plating hardness, for example, heat treatment such as reflow treatment can be used. Reflow treatment is a process that obtains surface quality such as surface gloss by heating, melting, and resolidifying plating. Since plating stress and plating hardness are alleviated by such heat treatment, methods for suppressing plating stress and plating hardness and heat treatment after plating are important.
一般に銅合金上の錫および錫合金めっきには、下地めっ
きとして、銅めっきやニッケルめっきが用いられるが、
本発明では下地めっきの種類や厚さ等を規定しない。ま
た、めっき浴はホウフッ化浴、硫酸浴、メタンスルホン
酸浴、２ープロパノールフルホン酸浴、アルカノールス
ルホン酸浴、アルカンスルホン酸浴、フェノールスルホ
ン酸浴等のどれを用いても良い。Generally, copper plating or nickel plating is used as a base plating for tin and tin alloy plating on copper alloys.
The present invention does not specify the type, thickness, etc. of the base plating. Further, as the plating bath, any of a borofluoride bath, a sulfuric acid bath, a methanesulfonic acid bath, a 2-propanolsulfonic acid bath, an alkanolsulfonic acid bath, an alkanesulfonic acid bath, a phenolsulfonic acid bath, etc. may be used.
錫および錫合金めっきは、通常１〜６μｍ程度で使用さ
れる。本発明においても基本的にこのめっき厚で使用さ
れるが、この範囲外のめっき厚でも、プレス加エ性につ
いては問題ない。Tin and tin alloy plating is usually used in a thickness of about 1 to 6 μm. Although this plating thickness is basically used in the present invention, there is no problem with press workability even if the plating thickness is outside this range.
ただし、これよりも薄いめっきでは、半口］付性、耐食
性が劣り、また厚いめっきでは生産効率が悪いために実
用的ではない。However, plating thinner than this has poor adhesion and corrosion resistance, and thicker plating is not practical because of poor production efficiency.
以上のようにして作製しためっき応力が５ｋｇ／ｆｆｉ
ＩＩ１２以下およびめっき硬さ１５Ｈｖ以下である錫お
よび錫合金めっきは、プレス加工を行なってもヒゲバリ
は生じない。The plating stress produced as above was 5kg/ffi.
Tin and tin alloy plating with II12 or less and plating hardness of 15 Hv or less will not cause burrs even when pressed.
ヒゲバリはめつきとめつき後に発生する母材とめっきと
の拡散により生じた拡散層との界面より、祠料エッジ部
のめっきが剥離することにより発生する。この拡散層と
めっき層は、その硬さや強度等の機楓的性質が異なるた
め、めっき中の残留応力が高い場合、その応力が拡散層
とめっき層の界面に集中し、剥離し易くなる。Burr occurs when the plating on the abrasive edge part peels off from the interface between the plating and the diffusion layer caused by the diffusion between the base material and the plating that occurs after plating. The diffusion layer and the plating layer have different mechanical properties such as hardness and strength, so if the residual stress in the plating is high, the stress concentrates on the interface between the diffusion layer and the plating layer, making it easy to peel off.
この状態でプレス加工を受けると最も応力を受けるダレ
部から剪断部にかけてのめっきが剥離し、ヒゲバリとな
る。そこで、本発明ではめっき応力並びにめっき硬さを
低下させることにより密着性を高めてヒゲバリの発生を
抑えた。When pressed in this state, the plating from the sag area to the sheared area that receives the most stress will peel off, resulting in burrs. Therefore, in the present invention, the occurrence of burrs is suppressed by increasing adhesion by reducing plating stress and plating hardness.
［実施例］
以下に、火施例並びに比較例により本発明を具体的に説
明する。[Example] The present invention will be specifically explained below using practical examples and comparative examples.
実施例１
次に示す各組成の下地めっき浴、上地めっき浴、同リフ
ロー浴並びにめっき条件を組合せてめっきサンプルを作
成し、プレス加工後のヒゲパリ発牛状況を調査した。母
Ｊｒ４にはりん青銅および黄銅を用いた。まためっき応
力はスパイラルめっき応力系を用いて測定した。めっき
硬さ５
はビイッカース硬度計を用いて測定した。Example 1 Plating samples were prepared by combining the following base plating baths, top plating baths, reflow baths, and plating conditions, and the appearance of hair after pressing was investigated. Phosphor bronze and brass were used for the mother Jr4. Furthermore, plating stress was measured using a spiral plating stress system. Plating hardness 5 was measured using a Biickers hardness meter.
■．下地めっき浴
ａ．銅めっき
硫酸銅浴 硫酸 １００ｇ／１硫酸銅（５
水塩）１４０ｇ／１
浴温２０℃、電流密度２Ａ／ｄｎ＋ ’ｂ．ニッケルめ
っき
ワット浴 硫酸ニッケル（６水塩）
２４ｏｇ／１
塩化ニッケル（６水塩）
４５ｇ／１
ほう酸 ４０ｇ／１
浴温４５℃、電流密度５Ａ／ｄ＋ｎ ２■．上地めっき
浴
ａ．錫めっき
（１）ホウフッ化浴 ホウフッ化第１錫（４５％）２０
０ｇ／１
ホウフッ化水素酸（４２％）
２４０ｇ／１
光汎剤 ３０ｍｌ／１
６
浴温２５℃、電流密度２Ａ／ｄｍ ’
めっき応力 ２． １ｋｇ／＋ｎｍ ’めっき硬さ
７．４１Ｉｖ
（２）硫酸浴 硫酸第１錫
硫酸
界面活性剤
浴温２０℃、電流密度 ３Ａ／ｄｍ ２めっき応力 圧
縮 １．２ｋｇ／ｍｍ２めっき硬さ １２１１ｖ
ｂ．錫めっきりフロー浴
硫酸浴 硫酸第１錫
硫酸
昇面活性剤
浴温２０℃、電流密度３八／ｄｎ＋ ２リフロー処理後
めっき応力 Ｏｋｇ／ＩＩｌｍ ２めっき硬さ ９．
７１１ｖ
Ｃ．半田めっき（半田：錫・鉛合金）
（１） ９ ： １半田ホウフツ化浴
ホウフッ化第１錫（４５％） ２００ｇ／１ホウフッ化
鉛（４５％） ２０ｇ／１７
１３０ｇ／］
７０ｇ／］
２ｇ／１
ＧＯｇ／１
７０ｇ／１
２ｇ／１
ホウフッ化水素酸（４２％） ２４０ｇ／１光沢剤（ｕ
Ｔ Ｂ ５１３’ Ｙ ） ３０ｇ／１浴温２５
℃、電流密度２ＡｌｄＩｌｌ２めっき応力 圧縮０．５
ｋｇ／ｎｕｎ２めっき硬さ ７．４Ｈｖ
（２） ９ ： １半田アルカノールスルホン酸浴アル
カノールスルホン酸錫７５ｇ／１
アルカノールスルホン酸鉛 ５ｇ／１
アルカノールスルホン酸 １００ｇ／１界面活性剤
１０ｇ／１
浴温２０℃、電流密度３Ａ／ｄｉ ２
めっき応力 ０．７ｋｇ／ｎｕｎ２
めっき硬さ ＩＯ．２１Ｉｖ
（３） ６ ： ４半１１１メタンスルホン酸浴メタン
スルホン酸錫
メタンスルホン酸鉛
メタンスルホン酸
昇面活性剤
浴温２０℃、電流密度３Ａ／ｄＩＩ１２めっき応力 圧
縮１．５ｋｇ／ｎ＋ｍ２８
５ｏｇ／１
１２ｇ／１
１００ｇ／１
１０ｇ／１
めっき砂さ １２．３１ｌｖ
ｄ．半川めっき りフロー浴
（＋） ９ ： １半田ホウフッ化浴
ホウフッ化第１錫（４５％） ２００ｇ／１ホウフッ化
鉛（４５％） ２０ｇ／１ホウフッ化水素酸（４
２％） ２４０ｇ／］光沢剤（ＶＴＢ ５１３Ｙ）
３０ｇ／１浴温２５℃、ｆじ流畜度２Ａ／ｄ＋ｎ’リ
フロー処理後めっき応力Ｏｋｇ／ｎｕｎ ２めっき硬さ
１０．３１｛ｖ
（２） ９ ： １半田メタンスルホン酸浴メタンスル
ホン酸錫
メタンスルホン酸鉛
メタンスルホン酸
界面活性剤
浴温２０℃、電流密度３Ａ／ｄｍ ２
リフロー処理後めっき応力Ｏｋｇ／ｍｍ ’（３）
６ ： ４半山メタンスルホン酸浴メタンスルホン酸錫
７５ｇ／１
アルカノールスルホン酸鉛２０ｇ／１
９
５０ｇ７１
３．６ｇ／１
１００ｇ／１
１０ｇ／１
アルカノールスルホン酸 １００ｇ／１異而活性剤
１０ｇ／１浴温２０℃、電流密度３Ａ／ｄ
＋ｎ ２リフロー処理後めっき応力Ｏｋｇ／ｎ＋ｍ ’
めっき硬さＬ２．２Ｈｖ
以上の浴および条件を組合せて、下地、上地めっきの厚
さを以下のようにしてめっきサンプルを作成した。■． Base plating bath a. Copper plating copper sulfate bath Sulfuric acid 100g/1 copper sulfate (5
water salt) 140g/1 Bath temperature 20℃, current density 2A/dn+ 'b. Nickel plating Watt bath Nickel sulfate (hexahydrate) 24og/1 Nickel chloride (hexahydrate) 45g/1 Boric acid 40g/1 Bath temperature 45°C, current density 5A/d+n 2■. Top plating bath a. Tin plating (1) Borofluoride bath Stannous borofluoride (45%) 20
0g/1 Hydrofluoroboric acid (42%) 240g/1 Photonic agent 30ml/1 6 Bath temperature 25°C, current density 2A/dm' Plating stress 2. 1kg/+nm 'Plating hardness
7.41Iv (2) Sulfuric acid bath Stannous sulfate sulfate surfactant Bath temperature 20°C, current density 3A/dm 2 Plating stress Compression 1.2 kg/mm 2 Plating hardness 1211v b. Tin clear flow bath Sulfuric acid bath Stannous sulfate Sulfuric acid surface activator Bath temperature 20°C, current density 38/dn+ 2 Plating stress after reflow treatment Okg/IIlm 2 Plating hardness 9.
711vC. Solder plating (solder: tin/lead alloy) (1) 9: 1 Solder honing bath Stannous borofluoride (45%) 200g/1 Lead borofluoride (45%) 20g/17 130g/] 70g/] 2g/ 1 GOg/1 70g/1 2g/1 fluoroboric acid (42%) 240g/1 Brightener (u
T B 513' Y ) 30g/1 bath temperature 25
°C, current density 2AldIll2 plating stress compression 0.5
kg/nun2 Plating hardness 7.4Hv (2) 9: 1 Solder alkanolsulfonic acid bath Tin alkanolsulfonate 75g/1 Lead alkanolsulfonate 5g/1 Alkanolsulfonic acid 100g/1 Surfactant
10g/1 Bath temperature 20°C, current density 3A/di 2 Plating stress 0.7kg/nun2 Plating hardness IO. 21Iv (3) 6: 4 Half 111 Methanesulfonic acid bath Methanesulfonic acid Tin Methanesulfonate Lead Methanesulfonic acid Surface raising activator Bath temperature 20℃, current density 3A/dII12 Plating stress Compression 1.5kg/n+m28 5og/1 12g /1 100g/1 10g/1 Plating sand 12.31lv d. Hankawa plating flow bath (+) 9: 1 Solder borofluoride bath Stannous borofluoride (45%) 200g/1 Lead borofluoride (45%) 20g/1 Hydrofluoroboric acid (4
2%) 240g/] Brightener (VTB 513Y)
30g/1 bath temperature 25℃, f flow density 2A/d+n' plating stress after reflow treatment Okg/nun 2 plating hardness 10.31 {v (2) 9:1 solder methanesulfonic acid bath methanesulfonic acid tin methane Lead sulfonate methanesulfonic acid surfactant Bath temperature 20℃, current density 3A/dm 2 Plating stress after reflow treatment Okg/mm' (3)
6: 4 half-mount methanesulfonic acid bath Tin methanesulfonate 75g/1 Lead alkanolsulfonate 20g/1 9 50g71 3.6g/1 100g/1 10g/1 Alkanolsulfonic acid 100g/1 Differential activator
10g/1 bath temperature 20℃, current density 3A/d
+n 2 Plating stress after reflow treatment Okg/n+m'
A plating sample was prepared using a combination of a bath having a plating hardness of L2.2Hv or more and conditions, with the thickness of the base and top plating as shown below.
下地めっき ０．５μｍ， ２μｍ
上地めっき １μｍ， ２μｍ、４μｍこのように
して作成しためっきサンプルをプレス加上し、ヒゲバリ
発生の有無を調査したところ、ヒゲバリは認められなか
った。Base plating: 0.5 μm, 2 μm Top plating: 1 μm, 2 μm, 4 μm When the plating samples thus prepared were pressed and investigated for the occurrence of burrs, no burrs were observed.
比較例１
上地つきに下記に示す組成のめっき浴並びに条件を用い
た以外はすべて実施例１と同様にして試験を行った。Comparative Example 1 A test was conducted in the same manner as in Example 1, except that the plating bath having the composition shown below and the conditions were used for overcoating.
ａ，錫めっき
（１）ホウフッ化浴
ホウフッ化第１錫（４５％） ２００ｇ／１１０
ホウフッ化水素酸（４２％）
光沢剤 Ｎｏ．Ｉ
Ｎｏ．２
ホルマリン
浴温２０℃、電流密度３Ａ／ｄｍ ’
メッキ応力圧縮 ６．８ｋｇ／ｍｍ’
めっき硬さ ２５．３１１ｖ
（２）硫酸浴
硫酸第１錫
硫酸
界面活性剤
光沢剤 Ｎｏ．Ｉ
Ｎｏ．２
ホルマリン
浴温ｌ５℃、電流密度２Ａ／ｄｍ ２
めっき応力 圧縮７．２ｋｇ＃ｎｍ’
めっき硬さ １ｇ．２１Ｉｖ
ｂ．半田めっき
（１） ９ ： １半田ホウフッ化浴
ホウフッ化第１錫（４５％）
１１
２４０ｇ／１
４０ｇ／１
ｅｏｃｃ／１
１０ｃｃ／１
４０ｇ／１
１００ｇ／１
５ｇ／１
２０ｇ／１
１０ｃｃ／１
５ｇ／１
２ｏＯｇ／１
ホウフッ化鉛（４５％） ２０ｇ／１ホウフッ化
水素酸（４２％） ２４０ｇ／１光沢剤 Ｎ ｏ． １
４０ｇ／ＩＮ ｏ． ２ ４
０ｃｃ／１ホルマリン １０ｃｃ／１浴温
ｌ５℃、電流密度２Ａ／ｄ＋ｎ ２めっき応力 圧縮８
．２ｋｇ／ＩＩＩＩＩ１’めっき硬さ ２４．５Ｈ
ｖ
（２） ９ ： １半田アルカノールスルホン酸浴アル
カノールスルホン酸錫７５ｇ／１
アルカノールスルホン酸鉛 ５ｇ／１
アルカノールスルホン酸 １００ｇ／１光沢剤 Ｎ ｏ
． １ １０ｇ／ＩＮ ｏ． ２
２０ｃｃ／１ホルマリン １０ｃｃ／
１浴温１５℃、電流密度２Ａ／ｄｍ ’
めっき応力 圧縮５．７ｋｇ／ｍｍ２
（３） ６ ： ４半田アルカノールスルホン酸浴アル
カノールスルホン酸錫７５ｇ／１
アルカノールスルホン酸鉛２０ｇ／１
１２
アルカノールスルホン酸 ＬＯＯｇ／］光沢剤 Ｎ ｏ
． １ １０ｇ／ＩＮ ｏ． ２
２０ｃｃ／１ホルマリン １０ｃｃ
／］浴温１５℃、電流密度２Ａ／ｄｍ ２
めっき応力 圧縮６．５ｋｇ／＋ｎｍ ２めっき硬さ
２ ２ ． ８ Ｈ ｖこれら比較例のめっきでは
プレス加工後にヒゲバリの発生が認められた。a. Tin plating (1) Borofluoride bath Stannous borofluoride (45%) 200g/110 Hydrofluoroboric acid (42%) Brightener No. I No. 2 Formalin bath temperature 20°C, current density 3A/dm' Plating stress compression 6.8 kg/mm' Plating hardness 25.311v (2) Sulfuric acid bath Stannous sulfate sulfate sulfuric acid surfactant Brightener No. I No. 2 Formalin bath temperature 15°C, current density 2A/dm 2 Plating stress Compression 7.2kg#nm' Plating hardness 1g. 21Iv b. Solder plating (1) 9: 1 Solder borofluoride bath Stannous borofluoride (45%) 11 240g/1 40g/1 eocc/1 10cc/1 40g/1 100g/1 5g/1 20g/1 10cc/1 5g /1 2oOg/1 Lead borofluoride (45%) 20g/1 Hydrofluoroboric acid (42%) 240g/1 Brightener No. 1
40g/IN o. 2 4
0cc/1 Formalin 10cc/1 Bath temperature 15℃, current density 2A/d+n 2 Plating stress Compression 8
．． 2kg/III1' plating hardness 24.5H
v (2) 9: 1 Solder alkanolsulfonic acid bath Tin alkanolsulfonate 75g/1 Lead alkanolsulfonate 5g/1 Alkanolsulfonic acid 100g/1 Brightener No
．． 1 10g/IN o. 2
20cc/1 formalin 10cc/
1 Bath temperature 15℃, current density 2A/dm' Plating stress Compression 5.7kg/mm2 (3) 6: 4 solder alkanolsulfonic acid bath Tin alkanolsulfonate 75g/1 Lead alkanolsulfonate 20g/1 12 Alkanolsulfonic acid LOOg /] Brightener No
．． 1 10g/IN o. 2
20cc/1 formalin 10cc
/] Bath temperature 15℃, current density 2A/dm 2 Plating stress Compression 6.5kg/+nm 2 Plating hardness
2 2. 8 Hv In the plating of these comparative examples, occurrence of burrs was observed after press working.
［発明の効果］
本発明品は、プレス加工時のヒゲバリの発生がないため
、電子部品等に応用してその信頼性を高め、かつプレス
作業の効率化をはかることができる。[Effects of the Invention] Since the product of the present invention does not generate burrs during press processing, it can be applied to electronic parts and the like to improve the reliability thereof and improve the efficiency of press work.
手続？］ＩＪ正書〈自発〉 平或１年３月１６日procedure? ] IJ official text (spontaneous) March 16th, 1997
Claims (1)
Ｈｖ以下であることを特徴とする錫および錫合金めっき
材。Plating stress is 5kg/mm^2 or less and plating hardness is 15
A tin and tin alloy plated material characterized by having a plating value of Hv or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32617188A JPH0394095A (en) | 1988-12-26 | 1988-12-26 | Tin and tin alloy plated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32617188A JPH0394095A (en) | 1988-12-26 | 1988-12-26 | Tin and tin alloy plated material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0394095A true JPH0394095A (en) | 1991-04-18 |
Family
ID=18184839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32617188A Pending JPH0394095A (en) | 1988-12-26 | 1988-12-26 | Tin and tin alloy plated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0394095A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008001947A (en) * | 2006-06-22 | 2008-01-10 | Yuken Industry Co Ltd | Tin alloy plating film in which generation of whisker is suppressed and method for forming the same |
| JP2008088477A (en) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | Reflow-sn-plated copper alloy material having excellent whisker resistance |
| JP2016000844A (en) * | 2014-06-11 | 2016-01-07 | 上村工業株式会社 | Electrotinning bath and tin plating film |
-
1988
- 1988-12-26 JP JP32617188A patent/JPH0394095A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008001947A (en) * | 2006-06-22 | 2008-01-10 | Yuken Industry Co Ltd | Tin alloy plating film in which generation of whisker is suppressed and method for forming the same |
| JP2008088477A (en) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | Reflow-sn-plated copper alloy material having excellent whisker resistance |
| JP4740814B2 (en) * | 2006-09-29 | 2011-08-03 | Ｊｘ日鉱日石金属株式会社 | Copper alloy reflow Sn plating material with excellent whisker resistance |
| JP2016000844A (en) * | 2014-06-11 | 2016-01-07 | 上村工業株式会社 | Electrotinning bath and tin plating film |
| KR20170016843A (en) * | 2014-06-11 | 2017-02-14 | 우에무라 고교 가부시키가이샤 | Tin electroplating bath and tin plating film |
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