JPH02170995A - Tin and tin alloy plated material - Google Patents
Tin and tin alloy plated materialInfo
- Publication number
- JPH02170995A JPH02170995A JP32189188A JP32189188A JPH02170995A JP H02170995 A JPH02170995 A JP H02170995A JP 32189188 A JP32189188 A JP 32189188A JP 32189188 A JP32189188 A JP 32189188A JP H02170995 A JPH02170995 A JP H02170995A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- plating
- bath
- carbon content
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 title claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 64
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 239000002932 luster Substances 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 15
- 239000002253 acid Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 11
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 8
- 239000004094 surface-active agent Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229940098779 methanesulfonic acid Drugs 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101100342332 Mus musculus Klf16 gene Proteins 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 2
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- -1 Tin methanesulfonate Lead methanesulfonate Methanesulfonic acid Chemical compound 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000004334 fluoridation Methods 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- LLABTCPIBSAMGS-UHFFFAOYSA-L lead(2+);methanesulfonate Chemical compound [Pb+2].CS([O-])(=O)=O.CS([O-])(=O)=O LLABTCPIBSAMGS-UHFFFAOYSA-L 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- CICKVIRTJQTMFM-UHFFFAOYSA-N sulfuric acid;tin Chemical compound [Sn].OS(O)(=O)=O CICKVIRTJQTMFM-UHFFFAOYSA-N 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- LEMQFBIYMVUIIG-UHFFFAOYSA-N trifluoroborane;hydrofluoride Chemical compound F.FB(F)F LEMQFBIYMVUIIG-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
童呈上■肌朋分国
本発明は、錫および錫合金めっき材の改良に関するもの
で、特にめっき材のプレス加工性を改善したものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in tin and tin alloy plated materials, and in particular to improved press workability of the plated materials.
−の ′−と［＋ 占
錫および錫合金めっき材は、りん青銅、黄銅等の銅合金
にめっきされ、プレス加工を受けた後、端子コネクター
等の電子部品に利用される。しかし、従来の錫および錫
合金めっき材は、プレスせんだん加工時に材料エツジ部
分のめっきが剥離してヒゲ状になる、ヒゲバリという異
常が発生する。-''- and [+] Tin and tin alloy plating materials are plated on copper alloys such as phosphor bronze and brass, and after being pressed, are used for electronic parts such as terminal connectors. However, with conventional tin and tin alloy plated materials, an abnormality called burr occurs in which the plating on the edges of the material peels off and becomes like burrs during press shearing.
このヒゲバリは、電子部品として組み込まれた時に回路
短絡の原因となり好ましくない。This burr is undesirable because it causes a short circuit when it is assembled as an electronic component.
また、プレス時にも、このヒゲバリが脱落し、プレス金
型に付着して押し込み等の原因ともなる。Furthermore, during pressing, the burrs fall off and adhere to the press mold, causing indentation.
この押し込みが発生した場合には、金型の清掃を行う必
要があり、作業効率が悪化するという問題がある。When this pushing occurs, it is necessary to clean the mold, which poses a problem of deteriorating work efficiency.
以上の様に、錫および錫合金めっきのプレス時のヒゲバ
リ発生は電子部品としての信幀性、プレス作業の効率化
という点から強く解決が望まれていた。As described above, there has been a strong desire to solve the problem of burrs occurring during pressing of tin and tin alloy plating from the viewpoints of reliability as electronic components and efficiency of pressing operations.
■が”しようとする課
本発明者は、如上の状況に鑑みて、錫および錫合金めっ
き材のプレス加工性を改善するべく鋭意研究を重ねた結
果、錫および錫合金めっきのめっき皮膜中の炭素含有量
を一定量以下に副整することにより、初期の目的が達成
されることを見出し、本発明を完成するに至った。In view of the above circumstances, the inventor of the present invention has conducted intensive research to improve the press workability of tin and tin alloy plated materials, and has found that carbon in the plating film of tin and tin alloy plating is The inventors have discovered that the initial objective can be achieved by adjusting the content to a certain level or less, and have completed the present invention.
すなわち、本発明は、錫および錫合金めっき材において
、めっき皮膜中の炭素含有量を一定量以下にすることに
より、軟土の問題点を解決することを課題とする。That is, an object of the present invention is to solve the problem of soft soil by reducing the carbon content in the plating film to a certain amount or less in tin and tin alloy plated materials.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
課題をＭ伏するための手段
本発明による錫および錫合金めっき材は、そのめっき皮
膜中の炭素含有量が０．０１重贋％以下であることを特
徴とする。Means for Overcoming the Problems The tin and tin alloy plated materials according to the present invention are characterized in that the carbon content in the plating film is 0.01% by weight or less.
本発明による錫および錫合金めっき材では、そのめっき
皮膜中の炭素含有量が０．０１重量％以下であれば良く
、めっき浴種やめっき後の熱処理等については特に規定
されない。例えば、めっき浴については、ホウフッ化浴
、硫酸浴、メタンスルホン酸浴、２−プロパツールスル
ホン酸浴、アルカンスルホン酸浴、アルカノールスルホ
ン酸浴、フェノールスルホン酸浴等のどれを用いても良
い。In the tin and tin alloy plated materials according to the present invention, the carbon content in the plating film may be 0.01% by weight or less, and the type of plating bath, heat treatment after plating, etc. are not particularly specified. For example, as for the plating bath, any of a borofluoride bath, a sulfuric acid bath, a methanesulfonic acid bath, a 2-propanol sulfonic acid bath, an alkanesulfonic acid bath, an alkanolsulfonic acid bath, a phenolsulfonic acid bath, etc. may be used.
めっき後の熱処理には、リフロー処理等用いられるが、
このリフロー処理はめっきを加熱溶融して再凝固させる
ことにより、表面光沢等の表面品質を得るために１行わ
れる処理である９通常、光沢のある錫および錫合金めっ
きを得るには、めっき浴中に光沢剤として有機物を添加
するが、それにより、めっき皮膜中の炭素含有量は多く
なり、プレス加工によるヒゲバリの発生可能性が裔くな
り、一方、めっき皮膜中の炭素含有量を押えると表面光
沢が得にくくなる。そこで、めっき皮膜中の炭素含有量
を０．０１重量％以下として、さらに表面光沢を得る手
法としてリフロー処理は有効である。Reflow treatment is used for heat treatment after plating, but
This reflow treatment is a process performed to obtain surface quality such as surface gloss by heating and melting the plating and resolidifying it.9 Usually, to obtain glossy tin and tin alloy plating, a plating bath is used. Organic matter is added as a brightening agent, but this increases the carbon content in the plating film, increasing the possibility of burrs occurring during press processing.On the other hand, if the carbon content in the plating film is reduced, It becomes difficult to obtain surface gloss. Therefore, reflow treatment is effective as a method for reducing the carbon content in the plating film to 0.01% by weight or less and further obtaining surface gloss.
また、本発明では下地めっきについても、その種類、厚
さについて規定しない。−最に、下地めっきには銅めっ
きやニッケルめっきが０．５〜２ ｐ程度用いられる。Furthermore, the present invention does not specify the type and thickness of the base plating. -Finally, copper plating or nickel plating is used for the base plating in an amount of about 0.5 to 2 p.
錫および錫合金めっきは、通常１〜６μ程度で使用され
、本発明においても基本的にこのめっき厚について使用
されるが、この範囲外のめっき厚でもプレス加工性につ
いては問題はない、ただし、これより薄いめっきでは半
田性、耐食性が劣り、また厚いめっきでは効率が悪いた
め実用的ではない。Tin and tin alloy plating is usually used at a thickness of about 1 to 6 μm, and this plating thickness is basically used in the present invention, but there is no problem with press workability even if the plating thickness is outside this range. However, Plating thinner than this has poor solderability and corrosion resistance, and thicker plating is not practical because it is inefficient.
以上の様にして作成した、めっき皮膜の炭素含有量が０
．０１重量％以下である錫および錫合金めっきはプレス
加工を行ってもヒゲバリは生じない。The carbon content of the plating film created as described above is 0.
．． Tin and tin alloy plating with a content of 0.01% by weight or less does not cause burrs even when pressed.
以下に本発明を実施例により説明する。The present invention will be explained below using examples.
実施例
次に示す各組成のめっき浴を用いて、めっきサンプルを
作成し、プレス加工後のヒゲバリ発生状況を調査した。EXAMPLES Plating samples were prepared using plating baths having the following compositions, and the occurrence of burrs after press working was investigated.
ｊｌ：材にはりん青銅および黄銅を用いた。jl: Phosphor bronze and brass were used as materials.
下地めっき浴
０銅めっき
硫酸銅浴 硫酸 １００ｇ／７！硫酸
銅（５水塩） １４０ｇ／ｌ
浴温 ２０℃、 電流密度 ２Ａ／ｄｉＯニツケルめっ
き
ワット浴 硫酸ニッケル（６水塩） ２４０ ｇ／ｌ
塩化ニッケル（６水塩）４５ｇ７Ｎ
はう酸 ４０ｇ／ｌ
浴温 ４５℃、
上地めっき浴
０錫めっき
電流密度 ５Ａ／ｄｏ？
ｌ）ホウフッ化浴 ホウフッ化第１ｔｌ（４５％）２０
０ｇ／／ホウフフ化水素酸く４２％） ２４０ｇ／ ｌ
！光沢剤 ３０ｍ１／１浴温 ２５℃
、 電流密度 ２Ａ／ｄｎ？めっき皮膜中の炭素含有量
２）硫酸浴 硫酸第一錫
硫酸
界面活性剤
浴温 ２０℃、 電流密度 ３Ａ／ｄｒｒｒめっき皮膜
中の炭素含有ｌ Ｏ，００４％０錫めっき リ
フロー浴
硫酸浴 硫酸第一錫 ６０ｇ／ｌ硫酸
７０ｇ／７！
界面活性剤 ２ｇ／ｊ２
浴温 ２０℃、電流密度３Ａ／ｄｎｒ、リフロー処理め
っき皮膜中の炭素含有ｌ Ｏ，００１％ｏ、ｏ
ｏｓ ％
６０ｇ／１
１Ｑｇ／１
２ｇ／（１
０半田めっき（半田：錫鉛合金）
１．）９：１半田ホウフツ化浴
ホウフッ化第１錫（４５％）
ホウフッ化鉛 （４５％）
ホウフッ化水素酸（４２％）
ＵＴＢ ５１３Ｙ （光沢剤）
浴温 ２５℃、 電流密度 ２Ａ／ｄｍめっき皮膜中の
炭素含有ｌ Ｏ，００５％２）９：１半田アル
力ノ〜ルスルホン酸浴アルカノールスルホン酸ＳＲ７５
ｇ／ｊ！アルカノールスルホン酸鉛 ５ｇ／ ｊ！アル
カノールスルホン酸 １０ｈ／ １界面活性剤
１０ｇ／ １浴温２０℃、 電流密度 ３Ａ／ｄ
ｒ＋？めっき皮膜中の炭素含有量
３）６：４半田メタンスルホン酸浴
メタンスルホン酸錫
メタンスルホン酸鉛
メタンスルホン酸
２００ｇ／ ｌｌ
２９ｇ／ｊ！
２４０ｇ／ Ｚ
３０Ｗｉ／ｌ１
５０ｇ／ １
１２ｇ／ １
１００ｇ／１
０．００７ ％
界面活性剤 Ｌｏｇ／ Ｉｌ浴温 ２０℃
、 電流密度 ３Ａ／ｄｒｒｆめっき皮膜中の炭素含有
ｌ Ｏ，００４％０半田めっきりフロー処理
１）ＩＩ半田ホウフッ化浴
ホウフッ化第１錫（４５％） ２００ｇ／ １ホウフツ
化鉛 （４５％） ２０ｇ／ｊ！ホウフン化水素酸
（４２％） ２４０ｇ／ ＩＵＴＢ ５１３Ｙ （光沢
剤） ３０ｒｎｌ／１浴温 ２５℃、電流密度２Ａ／
ｄｎ？、リフロー処理めっき皮膜中の炭素含有量
０．００２％２）ＬＬ半田メタンスルホン酸浴
メタンスルホン酸錫 ５０ｇ／ １メタンスルホン
酸鉛 ３．６ｇ／ １メタンスルホン酸 １
００ｇ／β界面活性剤 Ｌｏｇ／ｌ
浴温 ２０℃、電流密度３Ａ／ｄｎ？、リフロー処理め
っき皮膜中の炭素含有量 ０．００３％３）６：
４半田アルカノールスルホン酸浴アルカノールスルホン
＃＃１７５ｇ／ １アル力ノールスルホン酸鉛２０ｇ／
Ｊアルカノールスルホン酸 １００ｇ／ １界面活性
剤 １０ｇ／ １浴温 ２０℃、電流密度
３Ａ／ｄｉ、リフロー処理めっき皮膜中の炭素含有ｆｆ
ｉ ０．００１％以上に示した浴について下地
、上地めっきの厚さを以下の様にしてめっきサンプルを
作成した。Base plating bath 0 Copper plating copper sulfate bath Sulfuric acid 100g/7! Copper sulfate (pentahydrate) 140 g/l Bath temperature 20°C, current density 2A/diO nickel plating Watt bath Nickel sulfate (hexahydrate) 240 g/l
Nickel chloride (hexahydrate) 45g 7N Hydrolic acid 40g/l Bath temperature 45℃, top plating bath 0 Tin plating current density 5A/do? l) Borofluoride bath Borofluoride No. 1 tl (45%) 20
0g//Hydrofluoric acid 42%) 240g/l
! Brightener 30m1/1 Bath temperature 25℃
, Current density 2A/dn? Carbon content in the plating film 2) Sulfuric acid bath Stannous sulfate sulfuric acid surfactant Bath temperature 20°C, current density 3A/drrr Carbon content in the plating film l O,004%0Tin plating Reflow bath Sulfuric acid bath First sulfuric acid Tin 60g/l sulfuric acid
70g/7! Surfactant 2g/j2 Bath temperature 20°C, current density 3A/dnr, carbon content in reflow plating film 1 O, 001% o, o
os % 60g/1 1Qg/1 2g/(10 Solder plating (solder: tin-lead alloy) 1.) 9:1 solder fluoridation bath Stannous borofluoride (45%) Lead borofluoride (45%) Borofluoride Hydrogen acid (42%) UTB 513Y (brightener) Bath temperature 25°C, current density 2A/dm Carbon content in the plating film 1 O, 005%2) 9:1 solder alkaline alcohol sulfonic acid bath Alkanol sulfonic acid SR75
g/j! Lead alkanol sulfonate 5g/j! Alkanolsulfonic acid 10h/1 surfactant
10g/1 bath temperature 20℃, current density 3A/d
r+? Carbon content in plating film 3) 6:4 Solder methanesulfonic acid bath Tin methanesulfonate Lead methanesulfonate Methanesulfonic acid 200g/ll 29g/j! 240g/ Z 30Wi/l1 50g/ 1 12g/ 1 100g/1 0.007% Surfactant Log/Il Bath temperature 20℃
, Current density 3A/drrf Carbon content in plating film l O, 004% 0 Solder clear flow treatment 1) II Solder borofluoride bath Stannous borofluoride (45%) 200g/ 1 Lead borofluoride (45%) 20g/ j! Hydroborofluoric acid (42%) 240g/ IUTB 513Y (brightener) 30rnl/1 Bath temperature 25°C, current density 2A/
dn? , carbon content in reflow-treated plating film
0.002%2) LL solder methanesulfonic acid bath Tin methanesulfonate 50g/1 Lead methanesulfonate 3.6g/1 Methanesulfonic acid 1
00g/β surfactant Log/l Bath temperature 20℃, current density 3A/dn? , carbon content in reflow-treated plating film 0.003%3)6:
4 Solder alkanolsulfonic acid bath Alkanolsulfone ##175g/ 1 Alkanolsulfonic acid lead lead 20g/
J Alkanolsulfonic acid 100g/1 Surfactant 10g/1 Bath temperature 20°C, current density 3A/di, carbon content ff in reflow-treated plating film
Plating samples were prepared using the baths having an i of 0.001% or more, with the base and top plating thicknesses as shown below.
下地めっき ０４５μ、２μ
上地めっき １μ、２μ、４μ
この様にして作成したサンプルをプレス加工し、ヒゲバ
リ発生の有無を調査したところ、ヒゲバリは認められな
かった。Base plating: 045μ, 2μ Top plating: 1μ, 2μ, 4μ The samples prepared in this manner were pressed and investigated for the occurrence of burrs, and no burrs were observed.
比較例
上地めっきに以下に示すめっきを用いた以外はすべて実
施例１と同様にして試験を行った。Comparative Example A test was conducted in the same manner as in Example 1 except that the plating shown below was used as the top plating.
Ｏｆ！めっき
ｌ）ホウフッ化浴 ホウフ・７化第１錫（４５％） ２
００ｇ＃！ホウフッ化水素酸（４２％） ２４０ｇ／
ｊ！光沢剤 阻１ ４０ｇ／ ＩＩ磁２
６０ｃｃ／ １ホルマリン
１Ｏｃｃ／ １浴温 ２０℃、 電流密度 ３Ａ／
ｄｏ（めっき皮膜中の炭素含有ｉ ｏ、０７％
２）硫酸浴 硫酸第一錫 ４０ｇ／ｌ
硫酸 １００ｇ／ｆｆ界面活性剤
５ｇ＃！
光沢剤 庵１ ２０ｇ／ｌ
Ｎｌ２ １０ＣＣ／ １
ホルマリン ５ｃｃ／ １浴温 １５℃
、 電流密度 ２人／ｄｉめっき皮膜中の炭素含有量
０．０６％０半田めっき
１）９：１半田ホウフフ化浴
ホウフッ化第１錫（４５％）２００ｇ／ｊ！ホウフッ化
鉛 （４５％） ２０ｇ／ｌホウフッ化水素酸（４
２％） ２４０ｇ／ １光沢剤 隘１ ４
０ｇ／ρＮ１２ ４０ｃｃ／ｊ！ホル
マリン １ｏｃｃ／ １浴温 １５℃、
電流密度 ２Ａ／ｄｒｒｆめっき皮膜中の炭素含有量
０．０４％３）６：４半田アル力ノールスルホン
酸浴アルカノールスルホン酸錫７５ｇ／ １アル力ノー
ルスルホン酸鉛２０ｇ／ １アルカノールスルホン酸
１００ｇ／ １光沢剤 １１ｋＬ１ １０
ｇ＃Ｎａ ２ ２０ｃｃ／ Ｉｔホルマリ
ン １０ｃｃ／ ｊ！浴温 １５℃、 電
流密度 ２Ａ／ｄｒｙめっき皮膜中の炭素含有ｌ
Ｏ，０９％その結果、これらのめっきはプレス加工
後にヒゲバリの発生が認められた。Of! Plating l) Borofluoride bath Bouf/Stannic heptaide (45%) 2
00g#! Hydrofluoroboric acid (42%) 240g/
j! Brightener Inhibi 1 40g/II Magnetic 2
60cc/1 formalin
1Occ/1 bath temperature 20℃, current density 3A/
do (carbon content in the plating film, 07%
2) Sulfuric acid bath Stannous sulfate 40g/l
Sulfuric acid 100g/ff surfactant
5g#! Brightener Iori 1 20g/l Nl2 10CC/ 1 Formalin 5cc/ 1 Bath temperature 15℃
, Current density 2 people/carbon content in di-plating film
0.06%0 solder plating 1) 9:1 solder borofluoride bath Stannous borofluoride (45%) 200g/j! Lead borofluoride (45%) 20g/l fluoroboric acid (4
2%) 240g/1 brightener 1 4
0g/ρN12 40cc/j! Formalin 1occ/1 bath temperature 15℃,
Current density 2A/carbon content in drrf plating film
0.04%3) 6:4 solder alkanolsulfonic acid bath Tin alkanolsulfonate 75g/1Alkanolsulfonic acid lead 20g/1Alkanolsulfonic acid
100g/1 brightener 11kL1 10
g#Na 2 20cc/ It formalin 10cc/ j! Bath temperature 15℃, current density 2A/dry carbon content in plating film
O, 09% As a result, the occurrence of burrs was observed in these platings after press working.
Claims (1)
含有量が０．０１重量％以下であることを特徴とするめ
っき材。A tin or tin alloy plated material, characterized in that the carbon content in the plating film is 0.01% by weight or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32189188A JPH02170995A (en) | 1988-12-22 | 1988-12-22 | Tin and tin alloy plated material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32189188A JPH02170995A (en) | 1988-12-22 | 1988-12-22 | Tin and tin alloy plated material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02170995A true JPH02170995A (en) | 1990-07-02 |
Family
ID=18137554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32189188A Pending JPH02170995A (en) | 1988-12-22 | 1988-12-22 | Tin and tin alloy plated material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02170995A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1643015A3 (en) * | 2004-09-29 | 2006-04-19 | Dowa Mining Co., Ltd. | Tin-plated product |
| JP2006193778A (en) * | 2005-01-13 | 2006-07-27 | Fujitsu Ltd | Sn PLATING FILM FOR ELECTRONIC COMPONENT |
-
1988
- 1988-12-22 JP JP32189188A patent/JPH02170995A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1643015A3 (en) * | 2004-09-29 | 2006-04-19 | Dowa Mining Co., Ltd. | Tin-plated product |
| JP2006193778A (en) * | 2005-01-13 | 2006-07-27 | Fujitsu Ltd | Sn PLATING FILM FOR ELECTRONIC COMPONENT |
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