JPH0392045U - - Google Patents
Info
- Publication number
- JPH0392045U JPH0392045U JP1990013052U JP1305290U JPH0392045U JP H0392045 U JPH0392045 U JP H0392045U JP 1990013052 U JP1990013052 U JP 1990013052U JP 1305290 U JP1305290 U JP 1305290U JP H0392045 U JPH0392045 U JP H0392045U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- sealing structure
- hollow covering
- structure according
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990013052U JPH0392045U (pl) | 1989-10-31 | 1990-02-15 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12663789 | 1989-10-31 | ||
| JP1990013052U JPH0392045U (pl) | 1989-10-31 | 1990-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392045U true JPH0392045U (pl) | 1991-09-19 |
Family
ID=31889815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990013052U Pending JPH0392045U (pl) | 1989-10-31 | 1990-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392045U (pl) |
-
1990
- 1990-02-15 JP JP1990013052U patent/JPH0392045U/ja active Pending