JPH0391642U - - Google Patents

Info

Publication number

JPH0391642U

JPH0391642U JP15215689U JP15215689U JPH0391642U JP H0391642 U JPH0391642 U JP H0391642U JP 15215689 U JP15215689 U JP 15215689U JP 15215689 U JP15215689 U JP 15215689U JP H0391642 U JPH0391642 U JP H0391642U

Authority

JP

Japan

Prior art keywords

epoxy resin

case

temperature fuse

sealed

temperature

Prior art date

1989-12-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 239000000945 filler Substances 0.000 claims description 3
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
• 230000004907 flux Effects 0.000 claims description 2
• 229910000743 fusible alloy Inorganic materials 0.000 claims description 2
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
• 239000003822 epoxy resin Substances 0.000 claims 4
• 229920000647 polyepoxide Polymers 0.000 claims 4
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1