JPH0390494U - - Google Patents

Info

Publication number
JPH0390494U
JPH0390494U JP1989152688U JP15268889U JPH0390494U JP H0390494 U JPH0390494 U JP H0390494U JP 1989152688 U JP1989152688 U JP 1989152688U JP 15268889 U JP15268889 U JP 15268889U JP H0390494 U JPH0390494 U JP H0390494U
Authority
JP
Japan
Prior art keywords
protrusion
electronic component
chip
board
holding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989152688U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0747915Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989152688U priority Critical patent/JPH0747915Y2/ja
Publication of JPH0390494U publication Critical patent/JPH0390494U/ja
Application granted granted Critical
Publication of JPH0747915Y2 publication Critical patent/JPH0747915Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1989152688U 1989-12-28 1989-12-28 電子部品実装構造体 Expired - Fee Related JPH0747915Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989152688U JPH0747915Y2 (ja) 1989-12-28 1989-12-28 電子部品実装構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989152688U JPH0747915Y2 (ja) 1989-12-28 1989-12-28 電子部品実装構造体

Publications (2)

Publication Number Publication Date
JPH0390494U true JPH0390494U (US06878557-20050412-C00065.png) 1991-09-13
JPH0747915Y2 JPH0747915Y2 (ja) 1995-11-01

Family

ID=31698940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989152688U Expired - Fee Related JPH0747915Y2 (ja) 1989-12-28 1989-12-28 電子部品実装構造体

Country Status (1)

Country Link
JP (1) JPH0747915Y2 (US06878557-20050412-C00065.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217574A (ja) * 2001-01-12 2002-08-02 Matsushita Electric Works Ltd 電力変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217574A (ja) * 2001-01-12 2002-08-02 Matsushita Electric Works Ltd 電力変換装置

Also Published As

Publication number Publication date
JPH0747915Y2 (ja) 1995-11-01

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees