JPH0390327U - - Google Patents

Info

Publication number
JPH0390327U
JPH0390327U JP15050889U JP15050889U JPH0390327U JP H0390327 U JPH0390327 U JP H0390327U JP 15050889 U JP15050889 U JP 15050889U JP 15050889 U JP15050889 U JP 15050889U JP H0390327 U JPH0390327 U JP H0390327U
Authority
JP
Japan
Prior art keywords
wiring board
flexible wiring
memory module
memory
chip capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15050889U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15050889U priority Critical patent/JPH0390327U/ja
Publication of JPH0390327U publication Critical patent/JPH0390327U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Memories (AREA)
JP15050889U 1989-12-26 1989-12-26 Pending JPH0390327U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15050889U JPH0390327U (ko) 1989-12-26 1989-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15050889U JPH0390327U (ko) 1989-12-26 1989-12-26

Publications (1)

Publication Number Publication Date
JPH0390327U true JPH0390327U (ko) 1991-09-13

Family

ID=31696855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15050889U Pending JPH0390327U (ko) 1989-12-26 1989-12-26

Country Status (1)

Country Link
JP (1) JPH0390327U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015015423A (ja) * 2013-07-08 2015-01-22 富士通セミコンダクター株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015015423A (ja) * 2013-07-08 2015-01-22 富士通セミコンダクター株式会社 半導体装置
US9748231B2 (en) 2013-07-08 2017-08-29 Fujitsu Semiconductor Limited Semiconductor device

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