JPH0388369U - - Google Patents

Info

Publication number
JPH0388369U
JPH0388369U JP14920089U JP14920089U JPH0388369U JP H0388369 U JPH0388369 U JP H0388369U JP 14920089 U JP14920089 U JP 14920089U JP 14920089 U JP14920089 U JP 14920089U JP H0388369 U JPH0388369 U JP H0388369U
Authority
JP
Japan
Prior art keywords
electronic component
positioning mark
mark
positioning
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14920089U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14920089U priority Critical patent/JPH0388369U/ja
Publication of JPH0388369U publication Critical patent/JPH0388369U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Automatic Assembly (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP14920089U 1989-12-25 1989-12-25 Pending JPH0388369U (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14920089U JPH0388369U (en, 2012) 1989-12-25 1989-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14920089U JPH0388369U (en, 2012) 1989-12-25 1989-12-25

Publications (1)

Publication Number Publication Date
JPH0388369U true JPH0388369U (en, 2012) 1991-09-10

Family

ID=31695614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14920089U Pending JPH0388369U (en, 2012) 1989-12-25 1989-12-25

Country Status (1)

Country Link
JP (1) JPH0388369U (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020160325A (ja) * 2019-03-27 2020-10-01 日東電工株式会社 配線回路基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020160325A (ja) * 2019-03-27 2020-10-01 日東電工株式会社 配線回路基板およびその製造方法
US11825598B2 (en) 2019-03-27 2023-11-21 Nitto Denko Corporation Wiring circuit board and producing method thereof

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