JPH0387177U - - Google Patents
Info
- Publication number
- JPH0387177U JPH0387177U JP1989147032U JP14703289U JPH0387177U JP H0387177 U JPH0387177 U JP H0387177U JP 1989147032 U JP1989147032 U JP 1989147032U JP 14703289 U JP14703289 U JP 14703289U JP H0387177 U JPH0387177 U JP H0387177U
- Authority
- JP
- Japan
- Prior art keywords
- board
- generating component
- cooling
- cooling plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147032U JPH0727637Y2 (ja) | 1989-12-22 | 1989-12-22 | 浸漬冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147032U JPH0727637Y2 (ja) | 1989-12-22 | 1989-12-22 | 浸漬冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0387177U true JPH0387177U (US08124630-20120228-C00152.png) | 1991-09-04 |
| JPH0727637Y2 JPH0727637Y2 (ja) | 1995-06-21 |
Family
ID=31693565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147032U Expired - Lifetime JPH0727637Y2 (ja) | 1989-12-22 | 1989-12-22 | 浸漬冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727637Y2 (US08124630-20120228-C00152.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (ja) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法 |
| WO2007102498A1 (ja) * | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103453A (en) * | 1980-01-21 | 1981-08-18 | Hitachi Ltd | Lsi apparatus system |
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
-
1989
- 1989-12-22 JP JP1989147032U patent/JPH0727637Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103453A (en) * | 1980-01-21 | 1981-08-18 | Hitachi Ltd | Lsi apparatus system |
| JPS57103338A (en) * | 1980-12-19 | 1982-06-26 | Hitachi Ltd | Boiling cooling device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004297069A (ja) * | 2003-03-27 | 2004-10-21 | Stmicroelectronics Inc | 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法 |
| JP4657617B2 (ja) * | 2003-03-27 | 2011-03-23 | エスティーマイクロエレクトロニクス，インコーポレイテッド | 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法 |
| WO2007102498A1 (ja) * | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品 |
| JPWO2007102498A1 (ja) * | 2006-03-06 | 2009-07-23 | 学校法人東京理科大学 | 沸騰冷却方法、沸騰冷却装置および流路構造体並びにその応用製品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727637Y2 (ja) | 1995-06-21 |
