JPH0385699U - - Google Patents
Info
- Publication number
- JPH0385699U JPH0385699U JP14801789U JP14801789U JPH0385699U JP H0385699 U JPH0385699 U JP H0385699U JP 14801789 U JP14801789 U JP 14801789U JP 14801789 U JP14801789 U JP 14801789U JP H0385699 U JPH0385699 U JP H0385699U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- thickness
- guide
- guided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案の電子回路パツケージ構造の一
例の斜視図、第２図は本実施例の電子回路パツケ
ージを搭載した電子回路ブロツクの正面図、第３
図は従来の電子回路パツケージ構造の一例を示す
正面図である。
１，１ａ，１ｂ……印刷配線基板、２……支持
穴、３……コネクタ、４……ガイデイングアダプ
タ、５……案内面、６……支持面、７……支持ピ
ン、８……電子回路ブロツク、１０，１０ａ……
ガイドレールの溝。
FIG. 1 is a perspective view of an example of the electronic circuit package structure of the present invention, FIG. 2 is a front view of an electronic circuit block equipped with the electronic circuit package of the present embodiment, and FIG.
The figure is a front view showing an example of a conventional electronic circuit package structure. 1, 1a, 1b...Printed wiring board, 2...Support hole, 3...Connector, 4...Guiding adapter, 5...Guide surface, 6...Support surface, 7...Support pin, 8... Electronic circuit block, 10, 10a...
Guide rail groove.
Claims (1)
基板に合せて複数の案内溝を設けた１対のガイド
レールとこのガイドレールに案内されて複数の前
記印刷配線基板を装着する筐体構造において、前
記第１の板厚と異なる第２の板厚の印刷配線基板
を装着するとき前記第１の板厚のガイド板を前記
第２の板厚の印刷配線基板に付加して前記ガイド
レールで案内させることを特徴とする電子回路パ
ツケージ。 (2) 前記ガイド板は印刷配線基板に装着される
面とガイドレールに案内される面とを段付けする
ことを特徴とする請求項(1)記載の電子回路パツ
ケージ。[Claims for Utility Model Registration] (1) A printed wiring board of a first thickness, a pair of guide rails provided with a plurality of guide grooves to match the printed wiring board, and a plurality of guide rails that are guided by this guide rail. In the case structure for mounting the printed wiring board, when mounting the printed wiring board having a second thickness different from the first thickness, the guide plate having the first thickness is replaced with the guide plate having the second thickness. An electronic circuit package that is attached to a printed wiring board and guided by the guide rail. (2) The electronic circuit package according to claim 1, wherein the guide plate has a stepped surface that is attached to the printed wiring board and a surface that is guided by the guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14801789U JPH0385699U (en) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14801789U JPH0385699U (en) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385699U true JPH0385699U (en) | 1991-08-29 |
Family
ID=31694485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14801789U Pending JPH0385699U (en) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385699U (en) |
-
1989
- 1989-12-21 JP JP14801789U patent/JPH0385699U/ja active Pending
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