JPH0385686U - - Google Patents
Info
- Publication number
- JPH0385686U JPH0385686U JP14703889U JP14703889U JPH0385686U JP H0385686 U JPH0385686 U JP H0385686U JP 14703889 U JP14703889 U JP 14703889U JP 14703889 U JP14703889 U JP 14703889U JP H0385686 U JPH0385686 U JP H0385686U
- Authority
- JP
- Japan
- Prior art keywords
- printed
- laminated
- wiring board
- multilayer wiring
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147038U JPH0651010Y2 (ja) | 1989-12-22 | 1989-12-22 | プリント配線板構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147038U JPH0651010Y2 (ja) | 1989-12-22 | 1989-12-22 | プリント配線板構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0385686U true JPH0385686U (US06623731-20030923-C00052.png) | 1991-08-29 |
| JPH0651010Y2 JPH0651010Y2 (ja) | 1994-12-21 |
Family
ID=31693571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147038U Expired - Lifetime JPH0651010Y2 (ja) | 1989-12-22 | 1989-12-22 | プリント配線板構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651010Y2 (US06623731-20030923-C00052.png) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127434A (ja) * | 1999-10-26 | 2001-05-11 | Ibiden Co Ltd | 多層プリント配線板及び多層プリント配線板の製造方法 |
| JP2007201509A (ja) * | 2007-05-01 | 2007-08-09 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2007201508A (ja) * | 2007-05-01 | 2007-08-09 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2007251189A (ja) * | 2007-05-01 | 2007-09-27 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2008263222A (ja) * | 2008-06-23 | 2008-10-30 | Ibiden Co Ltd | 多層プリント配線板 |
| US7795542B2 (en) | 1999-10-26 | 2010-09-14 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138993A (en) * | 1980-04-01 | 1981-10-29 | Nippon Telegraph & Telephone | Method of producing multilayer printed cirucit board |
| JPS6122691A (ja) * | 1984-07-10 | 1986-01-31 | 日本電気株式会社 | 厚膜薄膜混成多層配線基板 |
| JPS6314494A (ja) * | 1986-07-07 | 1988-01-21 | 日本電気株式会社 | 多層回路基板 |
-
1989
- 1989-12-22 JP JP1989147038U patent/JPH0651010Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138993A (en) * | 1980-04-01 | 1981-10-29 | Nippon Telegraph & Telephone | Method of producing multilayer printed cirucit board |
| JPS6122691A (ja) * | 1984-07-10 | 1986-01-31 | 日本電気株式会社 | 厚膜薄膜混成多層配線基板 |
| JPS6314494A (ja) * | 1986-07-07 | 1988-01-21 | 日本電気株式会社 | 多層回路基板 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127434A (ja) * | 1999-10-26 | 2001-05-11 | Ibiden Co Ltd | 多層プリント配線板及び多層プリント配線板の製造方法 |
| US7795542B2 (en) | 1999-10-26 | 2010-09-14 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US8106310B2 (en) | 1999-10-26 | 2012-01-31 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US8822839B2 (en) | 1999-10-26 | 2014-09-02 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| JP2007201509A (ja) * | 2007-05-01 | 2007-08-09 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2007201508A (ja) * | 2007-05-01 | 2007-08-09 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2007251189A (ja) * | 2007-05-01 | 2007-09-27 | Ibiden Co Ltd | 多層プリント配線板 |
| JP2008263222A (ja) * | 2008-06-23 | 2008-10-30 | Ibiden Co Ltd | 多層プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0651010Y2 (ja) | 1994-12-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |