JPH0385642U - - Google Patents
Info
- Publication number
- JPH0385642U JPH0385642U JP1989147970U JP14797089U JPH0385642U JP H0385642 U JPH0385642 U JP H0385642U JP 1989147970 U JP1989147970 U JP 1989147970U JP 14797089 U JP14797089 U JP 14797089U JP H0385642 U JPH0385642 U JP H0385642U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- front side
- circuit board
- circuit element
- semiconductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147970U JPH0385642U (th) | 1989-12-22 | 1989-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147970U JPH0385642U (th) | 1989-12-22 | 1989-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385642U true JPH0385642U (th) | 1991-08-29 |
Family
ID=31694439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147970U Pending JPH0385642U (th) | 1989-12-22 | 1989-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385642U (th) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000070670A1 (en) * | 1999-05-12 | 2000-11-23 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same, and electronic device |
| WO2008072510A1 (ja) * | 2006-12-15 | 2008-06-19 | Sharp Kabushiki Kaisha | 半導体装置 |
-
1989
- 1989-12-22 JP JP1989147970U patent/JPH0385642U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000070670A1 (en) * | 1999-05-12 | 2000-11-23 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same, and electronic device |
| WO2008072510A1 (ja) * | 2006-12-15 | 2008-06-19 | Sharp Kabushiki Kaisha | 半導体装置 |