JPH0383960U - - Google Patents
Info
- Publication number
- JPH0383960U JPH0383960U JP14533889U JP14533889U JPH0383960U JP H0383960 U JPH0383960 U JP H0383960U JP 14533889 U JP14533889 U JP 14533889U JP 14533889 U JP14533889 U JP 14533889U JP H0383960 U JPH0383960 U JP H0383960U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lens
- lead frames
- led chip
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14533889U JPH0383960U (US06589383-20030708-C00041.png) | 1989-12-15 | 1989-12-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14533889U JPH0383960U (US06589383-20030708-C00041.png) | 1989-12-15 | 1989-12-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0383960U true JPH0383960U (US06589383-20030708-C00041.png) | 1991-08-26 |
Family
ID=31691977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14533889U Pending JPH0383960U (US06589383-20030708-C00041.png) | 1989-12-15 | 1989-12-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0383960U (US06589383-20030708-C00041.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003288808A (ja) * | 2002-03-27 | 2003-10-10 | Shashin Denki Kogyo Kk | 照明器具 |
JP2004349628A (ja) * | 2003-05-26 | 2004-12-09 | Sharp Corp | 半導体発光装置及びそれを用いた撮影用照明装置 |
-
1989
- 1989-12-15 JP JP14533889U patent/JPH0383960U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003288808A (ja) * | 2002-03-27 | 2003-10-10 | Shashin Denki Kogyo Kk | 照明器具 |
JP2004349628A (ja) * | 2003-05-26 | 2004-12-09 | Sharp Corp | 半導体発光装置及びそれを用いた撮影用照明装置 |