JPH0383956U - - Google Patents

Info

Publication number
JPH0383956U
JPH0383956U JP14407189U JP14407189U JPH0383956U JP H0383956 U JPH0383956 U JP H0383956U JP 14407189 U JP14407189 U JP 14407189U JP 14407189 U JP14407189 U JP 14407189U JP H0383956 U JPH0383956 U JP H0383956U
Authority
JP
Japan
Prior art keywords
pad
lead
semiconductor element
printed boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14407189U
Other languages
English (en)
Japanese (ja)
Other versions
JP2521530Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989144071U priority Critical patent/JP2521530Y2/ja
Publication of JPH0383956U publication Critical patent/JPH0383956U/ja
Application granted granted Critical
Publication of JP2521530Y2 publication Critical patent/JP2521530Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
JP1989144071U 1989-12-15 1989-12-15 半導体モジュール Expired - Fee Related JP2521530Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989144071U JP2521530Y2 (ja) 1989-12-15 1989-12-15 半導体モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989144071U JP2521530Y2 (ja) 1989-12-15 1989-12-15 半導体モジュール

Publications (2)

Publication Number Publication Date
JPH0383956U true JPH0383956U (US07345094-20080318-C00003.png) 1991-08-26
JP2521530Y2 JP2521530Y2 (ja) 1996-12-25

Family

ID=31690808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989144071U Expired - Fee Related JP2521530Y2 (ja) 1989-12-15 1989-12-15 半導体モジュール

Country Status (1)

Country Link
JP (1) JP2521530Y2 (US07345094-20080318-C00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007204A (ja) * 2005-06-30 2007-01-18 Asics Corp 靴の中敷、及び靴、及び靴下

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624144U (US07345094-20080318-C00003.png) * 1985-06-24 1987-01-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624144U (US07345094-20080318-C00003.png) * 1985-06-24 1987-01-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007204A (ja) * 2005-06-30 2007-01-18 Asics Corp 靴の中敷、及び靴、及び靴下

Also Published As

Publication number Publication date
JP2521530Y2 (ja) 1996-12-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees