JPH0383953U - - Google Patents
Info
- Publication number
- JPH0383953U JPH0383953U JP14405089U JP14405089U JPH0383953U JP H0383953 U JPH0383953 U JP H0383953U JP 14405089 U JP14405089 U JP 14405089U JP 14405089 U JP14405089 U JP 14405089U JP H0383953 U JPH0383953 U JP H0383953U
- Authority
- JP
- Japan
- Prior art keywords
- component
- lead
- piece
- parallel
- twisted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第３図は本考案の第１実施例を示す図
で、第１図はＩＣ部品の全体図、第２図はその要
部拡大図、第３図は同じく要部側面図、第４図、
第５図は本考案の第２実施例を示す図で、第４図
はＩＣ部品の全体図、第５図はその側面図、第６
図は従来のＩＣ部品の全体図、第７図はその要部
拡大図、第８図は同じく要部側面図である。
１１，２１……ＩＣ部品、１２，２２……パツ
ケージ、１３，２３……リード、１３Ａ，１３Ｂ
，２３Ａ，２３Ｂ……幅広面、１４，２４……捩
り。
1 to 3 are diagrams showing a first embodiment of the present invention, in which FIG. 1 is an overall view of the IC component, FIG. 2 is an enlarged view of the main part, and FIG. 3 is a side view of the main part. Figure 4,
5 is a diagram showing a second embodiment of the present invention, FIG. 4 is an overall view of the IC component, FIG. 5 is a side view thereof, and FIG. 6 is a diagram showing a second embodiment of the present invention.
The figure is an overall view of a conventional IC component, FIG. 7 is an enlarged view of the main part, and FIG. 8 is a side view of the main part. 11, 21...IC parts, 12, 22...Package, 13, 23...Lead, 13A, 13B
, 23A, 23B... wide surface, 14, 24... twisted.
Claims (1)
互いに平行に並んだ状態でしかもそれぞれの幅広
面を上記並び方向と平行な姿勢にして、パツケー
ジの側面から外部に延び出しているＩＣ部品のリ
ードにおいて、 先端部の幅広面が上記並び方向とほぼ直交ない
しは斜めに交差するよう、一部に捩りを形成した
ことを特徴とするＩＣ部品のリード。[Claims for Utility Model Registration] Each piece is composed of a flat metal piece, and a large number of metal pieces are lined up parallel to each other, with their wide surfaces parallel to the above-mentioned line direction, so that they can be exposed to the outside from the side of the package. 1. A lead for an IC component, wherein a part of the lead of the IC component is twisted so that the wide surface of the tip part is substantially orthogonal to or diagonally intersects with the above-mentioned arrangement direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14405089U JPH0383953U (en) | 1989-12-15 | 1989-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14405089U JPH0383953U (en) | 1989-12-15 | 1989-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0383953U true JPH0383953U (en) | 1991-08-26 |
Family
ID=31690789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14405089U Pending JPH0383953U (en) | 1989-12-15 | 1989-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0383953U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61148855A (en) * | 1984-12-24 | 1986-07-07 | Hitachi Ltd | Semiconductor device |
-
1989
- 1989-12-15 JP JP14405089U patent/JPH0383953U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61148855A (en) * | 1984-12-24 | 1986-07-07 | Hitachi Ltd | Semiconductor device |
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