JPH0382202A - Dielectric resonator - Google Patents
Dielectric resonatorInfo
- Publication number
- JPH0382202A JPH0382202A JP21906889A JP21906889A JPH0382202A JP H0382202 A JPH0382202 A JP H0382202A JP 21906889 A JP21906889 A JP 21906889A JP 21906889 A JP21906889 A JP 21906889A JP H0382202 A JPH0382202 A JP H0382202A
- Authority
- JP
- Japan
- Prior art keywords
- resonator
- temperature
- shield case
- dielectric
- support seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 230000007423 decrease Effects 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、自動車電話の基地局における空中線共用装置
の構成素子等として好適な誘電体共振器に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a dielectric resonator suitable as a component of an antenna sharing device in a base station of a mobile phone.
従来の技術
第７図は、従来の誘電体共振器の要部を示す断面図で、
６はシールドケースの基体で、誘電体より成る。７は基
体６の表面に付着せしめた銀等の金属薄膜、２は誘電体
共振素子、３は誘電体共振素子２の支持体で、誘電体よ
り成る。Conventional technology FIG. 7 is a sectional view showing the main parts of a conventional dielectric resonator.
Reference numeral 6 denotes a base of the shield case, which is made of a dielectric material. 7 is a metal thin film such as silver attached to the surface of the base 6; 2 is a dielectric resonant element; and 3 is a support for the dielectric resonant element 2, which is made of a dielectric.
発明が解決しようとする課題
自動車電話の基地局における空中線共用装置を構成する
高負荷Ｑ形の共振器は、温度特性の良好なものであるこ
とが要求され、第７図に示した従来の誘電体共振器の温
度特性は、シールドケースの基体６、誘電体共振素子２
及び支持体３等を形成する誘電体のｌ１ｉＩ膨張係数に
よって定まるので、温度特性は比較的良好である。Problems to be Solved by the Invention The high-load Q-type resonator that constitutes the antenna sharing device in the base station of a car phone is required to have good temperature characteristics, and the conventional dielectric resonator shown in FIG. The temperature characteristics of the body resonator are as follows: the base 6 of the shield case, the dielectric resonator 2
The temperature characteristics are determined by the l1iI expansion coefficient of the dielectric material forming the support 3 and the like, so the temperature characteristics are relatively good.
熱しながら、共振器の各部を構成する誘電体は熱伝導性
に劣り、損失電力により生じた熱の放射が十分に行われ
ないため、電力特性の劣化を免れることが出来ない。While heating, the dielectric materials constituting each part of the resonator have poor thermal conductivity, and the heat generated by the power loss is not sufficiently radiated, so deterioration of the power characteristics cannot be avoided.
課題を解決するための手段
本発明は、 ＴＥａｕモード誘電体共振素子、誘電体よ
り成り前記ＴＥ０１５モード誘電体共振素子を支持する
支持体及びこれらを内装するシールドケースを備える共
振器において、前記ＴＥｓｕモード誘電体共振素子の端
面と対向せしめられた温度補償用導体板と、内端に前記
温度補償用導体板を支持せしめられ、基部を前記シール
ドケースの端壁に固定せしめられた支持座とを備えると
共に、前記共振器が温度上昇によって共振周波数が高く
（又は低く）なる特性を有する場合、前記シールドケー
スの線膨張係数より小（又は大）なる線膨張係数を有す
る材質を以て前記支持座を形成せしめることによって共
振周波数の温度特性を極めて良好ならしめると共に、従
来の共振器における欠点を除こうとするちのである。Means for Solving the Problems The present invention provides a resonator comprising a TEau mode dielectric resonant element, a support made of a dielectric and supporting the TE015 mode dielectric resonant element, and a shield case in which these are housed, in which the TEsu mode A temperature-compensating conductor plate facing the end face of the dielectric resonant element, and a support seat having an inner end supporting the temperature-compensating conductor plate and having a base fixed to the end wall of the shield case. In addition, when the resonator has a characteristic that the resonant frequency increases (or decreases) as the temperature rises, the support seat is formed of a material having a linear expansion coefficient smaller (or larger) than the linear expansion coefficient of the shield case. In this way, the temperature characteristics of the resonant frequency can be made extremely good, and the drawbacks of conventional resonators can be eliminated.
作用
誘電体共振器の温度が上昇（又は低下）すると、温度補
償用導体板とＴＥａｕモード誘電体共振素子の端面との
間隔が大（又は小）となって共振周波数の変動を抑える
ように作用する。When the temperature of the working dielectric resonator increases (or decreases), the distance between the temperature compensation conductor plate and the end face of the TEau mode dielectric resonator element increases (or decreases), which acts to suppress fluctuations in the resonant frequency. do.
実施例
第１図は、本発明の一実施例の要部を示す縦断面図、第
２図は、第１図のＡ−Ａ断面図、第３図は、第１図のＢ
−Ｂ断面図で、各図において、１はシールドケース、２
はＴＥｏ＋ａモード誘電体共振素子、３は共振素子２の
支持体で、適宜の誘電体より成る。４は温度補償用導体
板、５は支持座で、後述するような線膨張係数を有する
材質より成り、内端に取付けた温度補償用導体板４がＴ
Ｅｏ＋ａモード誘電体共振素子の端面と対向するように
形成し、基部をシールドケースｌの端壁内表面に固定し
である。Embodiment FIG. 1 is a vertical cross-sectional view showing the main parts of an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1, and FIG.
-B sectional view, in each figure, 1 is the shield case, 2
3 is a TEo+a mode dielectric resonant element, and 3 is a support for the resonant element 2, which is made of a suitable dielectric material. 4 is a temperature-compensating conductor plate, and 5 is a support seat, which is made of a material having a coefficient of linear expansion as described later, and the temperature-compensating conductor plate 4 attached to the inner end is T.
It is formed to face the end face of the Eo+a mode dielectric resonant element, and its base is fixed to the inner surface of the end wall of the shield case l.
尚、第１図乃至第３図には、本発明の説明に直接関係の
ある部品のみを示し、入出力結合素子及び共振周波数の
微調用素子等は図示するのを省いである。Note that FIGS. 1 to 3 show only parts directly related to the explanation of the present invention, and illustrations of input/output coupling elements, resonant frequency fine adjustment elements, etc. are omitted.
この種の共振器においては、共振器の温度変化によって
誘電体共振素子２の端面とシールドケース１の端壁面と
の間隔１２ｃ が大となると共振周波数が低い方へずれ
、間隔ｔ２ｃ が小となると共振周波数が高い方へず
れることとなる。In this type of resonator, when the distance 12c between the end surface of the dielectric resonant element 2 and the end wall surface of the shield case 1 increases due to a temperature change in the resonator, the resonant frequency shifts to a lower side, and when the distance t2c becomes smaller, the resonant frequency shifts to a lower side. This causes the resonance frequency to shift toward the higher side.
本発明誘電体共振器におけるシールドケース１、誘電体
共振素子２及び支持体３の総合温度特性が正特性、即ち
、第４図（横軸は伝送周波数ｆ ＭＨｚ 、縦軸は減衰
量Ｌ ｄＢ、曲線下、は基準温度における伝送特性、Ｔ
、は基準温度より高い温度における伝送特性、ＴＬは基
？ｐ＝温度より低い温度における伝送特性）に示すよう
に、温度上昇により間隔β０が小となって共振周波数が
高い方へずれ、温度低下により間隔２ｃ が大となって
共振周波数が低い方へずれるような特性の場合には、シ
ールドケースｌの形成材質の線膨張係数より小なる線膨
張係数を有する材質を以て支持座５を形成する。In the dielectric resonator of the present invention, the overall temperature characteristics of the shield case 1, dielectric resonant element 2, and support 3 are positive, that is, as shown in FIG. 4 (the horizontal axis is the transmission frequency f MHz, the vertical axis is the attenuation L dB, Below the curve is the transmission characteristic at the reference temperature, T
, is the transmission characteristic at a temperature higher than the reference temperature, and TL is the base? As shown in (transmission characteristics at a temperature lower than p = temperature), as the temperature rises, the interval β0 becomes smaller and the resonant frequency shifts to a higher side, and as the temperature decreases, the interval 2c increases and the resonant frequency shifts to a lower side. In the case of such characteristics, the support seat 5 is formed of a material having a coefficient of linear expansion smaller than that of the material forming the shield case l.
例えばシールドケース１を銅を以て形成し、支持座５を
鉄、アンバ又はスーパアンバ等を以て形成すると、誘電
体共振器の温度が上昇（又は低下）した場合、温度特性
補償用導体板４と誘電体共振素子２の端面との間隔ＬＣ
（第１図）が大（又は小）となるから温度補償用導体板
４の面積及び支持座５の高さを適当ならしめることによ
って温度変化に関係なく共振周波数を安定に保持せしめ
ることが出来る。For example, if the shield case 1 is made of copper and the support seat 5 is made of iron, umber, super umber, etc., when the temperature of the dielectric resonator increases (or decreases), the temperature characteristic compensation conductor plate 4 and the dielectric resonance will occur. Distance LC from the end face of element 2
(Fig. 1) becomes large (or small), so by appropriately adjusting the area of the temperature-compensating conductor plate 4 and the height of the support seat 5, the resonant frequency can be maintained stably regardless of temperature changes. .
シールドケース１、誘電体共振素子２及び支持体３の総
合温度特性が負特性、即ち、第５図（横軸、縦軸及び曲
線の符号は第４図と同じ）に示すように、温度上昇によ
り間隔ε。が大となって共振周波数が低い方へずれ、温
度低下により間隔ｔ２ｃ が小となって共振周波数が高
い方へずれるような特性の場合には、シールドケース１
の形成材質の線膨張係数より大なる線膨張係数を有する
材質を以て支持座５を形成する。The overall temperature characteristics of the shield case 1, dielectric resonant element 2, and support 3 are negative characteristics, that is, as shown in FIG. Therefore, the interval ε. If the characteristics are such that the interval t2c becomes large and the resonant frequency shifts to a lower side, and the interval t2c decreases due to temperature drop and the resonant frequency shifts to a higher side, the shield case 1
The support seat 5 is formed of a material having a coefficient of linear expansion larger than that of the material from which it is formed.
例えばシールドケースｌを鉄を以て形成し、支持座５を
アルミニラを以て形成すると、誘電体共振器の温度が上
昇（又は低下）した場合、温度特性補償用導体板４と誘
電体共振素子２の端面との間隔ＬＣ（第１図）が小（又
は大）となって共振周波数を安定に保持せしめることが
出来る。For example, if the shield case l is made of iron and the support seat 5 is made of aluminum, when the temperature of the dielectric resonator increases (or decreases), the temperature characteristic compensation conductor plate 4 and the end face of the dielectric resonator element 2 The interval LC (FIG. 1) becomes small (or large), and the resonance frequency can be stably maintained.
第１図乃至第３図には、誘電体共振素子２の端面のうち
支持体３に結合されていない平坦な端面に対向せしめて
温度特性補償用導体板４を設けた場合を例示したが、支
持体３に結合されている側の端面に温度補償用導体板を
対向せしめてもよく、両端面にそれぞれ温度補償用導体
板を対向せしめてもよい。1 to 3 illustrate a case where a conductive plate 4 for compensating temperature characteristics is provided to face a flat end face of the dielectric resonant element 2 that is not coupled to the support 3. A temperature-compensating conductor plate may be opposed to the end surface connected to the support 3, or a temperature-compensating conductor plate may be opposed to both end surfaces.
尚、支持体３に結合されている側の端面に対向せしめる
場合には、例えば温度特性補償用導体板をリング状に形
成し、その内径を支持体３の外径より適宜大ならしめて
相互に接触することのないように形成し、リング状導体
板の適宜個所を支持座を介してシールドケースの端壁に
固定する。In addition, in the case of facing the end surface of the side connected to the support body 3, for example, the conductor plate for temperature characteristic compensation is formed into a ring shape, and its inner diameter is appropriately made larger than the outer diameter of the support body 3, so that they are mutually connected. The ring-shaped conductor plates are formed so as not to come into contact with each other, and appropriate locations of the ring-shaped conductor plate are fixed to the end wall of the shield case via support seats.
発明の効果
本発明誘電体共振器においては、シールドケース１を金
属体のみによって形成しであるので熱伝導性が良好で、
損失電力により生じた熱の放射が効果的に行われ、電力
特性を劣化せしめるおそれがない。Effects of the Invention In the dielectric resonator of the present invention, since the shield case 1 is formed only of a metal body, it has good thermal conductivity.
Heat generated by power loss is effectively radiated, and there is no risk of deteriorating power characteristics.
又、温度補償用導体板４の面積、支持座５の材質及び高
さを適当に選ぶことによって共振器の温度変化に関係な
く共振周波数を極めて安定に保持せしめ得るので、例え
ば自動車電話の基地局における空中線共用装置を構成す
る共振器、即ち、負荷Ｑが高く温度特性が良好なること
を要求される共振器として好適である。In addition, by appropriately selecting the area of the temperature-compensating conductor plate 4 and the material and height of the support seat 5, it is possible to maintain the resonant frequency extremely stably regardless of temperature changes in the resonator. It is suitable as a resonator constituting an antenna sharing device, that is, a resonator that is required to have a high load Q and good temperature characteristics.
第６図（横軸及び縦軸は第４図と同じ）は、本発明誘電
体共振器の温度を変化せしめた場合における伝送特性の
一例を示す曲線図で、共振器の温度変化に関係なく共振
周波数は極めて安定に保持されている。Figure 6 (horizontal and vertical axes are the same as Figure 4) is a curve diagram showing an example of the transmission characteristics when the temperature of the dielectric resonator of the present invention is changed, regardless of the temperature change of the resonator. The resonant frequency is kept extremely stable.
第１図〜第３図は、本発明の一実施例の要部を示す断面
図、第４図及び第５図は本発明誘電体共振器の構成原理
を説明するための曲線図、第６図は、本発明誘電体共振
器の伝送特性の一例を示す曲線図、第７図は、従来の共
振器の一例を示す要部断面図で、ｌ：シールドケース、
２：誘電体共振素子、３：支持体、４：温度特性補償用
導体板、５：支持座、６：シールドケースの基体、７：
金属薄膜である。1 to 3 are cross-sectional views showing essential parts of an embodiment of the present invention, FIGS. 4 and 5 are curve diagrams for explaining the principle of construction of the dielectric resonator of the present invention, and FIG. The figure is a curve diagram showing an example of the transmission characteristics of the dielectric resonator of the present invention, and FIG.
2: Dielectric resonant element, 3: Support body, 4: Conductor plate for compensating temperature characteristics, 5: Support seat, 6: Base of shield case, 7:
It is a thin metal film.
Claims (2)
り成り前記ＴＥ＿０＿１＿５モード誘電体共振素子を支
持する支持体及びこれらを内装するシールドケースを備
える共振器において、前記ＴＥ＿０＿１＿５モード誘電
体共振素子の端面と対向せしめられた温度補償用導体板
と、内端に前記温度補償用導体板を支持せしめられ、基
部を前記シールドケースの端壁に固定せしめられた支持
座とを備えると共に、前記共振器が温度上昇によって共
振周波数が高くなる特性を有する場合、前記シールドケ
ースの線膨張係数より小なる線膨張係数を有する材質を
以て前記支持座を形成せしめたことを特徴とする誘電体
共振器。1. A TE_0_1_5 mode dielectric resonant element, a resonator made of a dielectric and comprising a support for supporting the TE_0_1_5 mode dielectric resonant element and a shield case housing these, the resonator facing an end surface of the TE_0_1_5 mode dielectric resonator. The resonator includes a temperature-compensating conductor plate and a support seat whose inner end supports the temperature-compensating conductor plate and whose base is fixed to the end wall of the shield case, and the resonator changes its resonance frequency due to temperature rise. If the dielectric resonator has a characteristic of increasing the linear expansion coefficient, the support seat is formed of a material having a linear expansion coefficient smaller than that of the shield case.
り成り前記ＴＥ＿０＿１＿５モード誘電体共振素子を支
持する支持体及びこれらを内装するシールドケースを備
える共振器において、前記ＴＥ＿０＿１＿５モード誘電
体共振素子の端面と対向せしめられた温度補償用導体板
と、内端に前記温度補償用導体板を支持せしめられ、基
部を前記シールドケースの端壁に固定せしめられた支持
座とを備えると共に、前記共振器が温度上昇によって共
振周波数が低くなる特性を有する場合、前記シールドケ
ースの線膨張係数より大なる線膨張係数を有する材質を
以て前記支持座を形成せしめたことを特徴とする誘電体
共振器。2. A TE_0_1_5 mode dielectric resonant element, a resonator made of a dielectric and comprising a support for supporting the TE_0_1_5 mode dielectric resonant element and a shield case housing these, the resonator facing an end surface of the TE_0_1_5 mode dielectric resonator. The resonator includes a temperature-compensating conductor plate and a support seat whose inner end supports the temperature-compensating conductor plate and whose base is fixed to the end wall of the shield case, and the resonator changes its resonance frequency due to temperature rise. The dielectric resonator is characterized in that the support seat is formed of a material having a coefficient of linear expansion larger than that of the shield case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21906889A JPH0382202A (en) | 1989-08-25 | 1989-08-25 | Dielectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21906889A JPH0382202A (en) | 1989-08-25 | 1989-08-25 | Dielectric resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0382202A true JPH0382202A (en) | 1991-04-08 |
Family
ID=16729768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21906889A Pending JPH0382202A (en) | 1989-08-25 | 1989-08-25 | Dielectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0382202A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819003A (en) * | 1981-07-27 | 1983-02-03 | Sony Corp | Microwave resonance circuit device |
| JPH01109802A (en) * | 1987-10-22 | 1989-04-26 | Nippon Dengiyou Kosaku Kk | Dielectric resonator |
-
1989
- 1989-08-25 JP JP21906889A patent/JPH0382202A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5819003A (en) * | 1981-07-27 | 1983-02-03 | Sony Corp | Microwave resonance circuit device |
| JPH01109802A (en) * | 1987-10-22 | 1989-04-26 | Nippon Dengiyou Kosaku Kk | Dielectric resonator |
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