JPH0379469U - - Google Patents

Info

Publication number

JPH0379469U

JPH0379469U JP14077989U JP14077989U JPH0379469U JP H0379469 U JPH0379469 U JP H0379469U JP 14077989 U JP14077989 U JP 14077989U JP 14077989 U JP14077989 U JP 14077989U JP H0379469 U JPH0379469 U JP H0379469U

Authority

JP

Japan

Prior art keywords

metal substrate

insulating layer

copper foil

top surface

hole

Prior art date

1989-12-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 229910052751 metal Inorganic materials 0.000 claims description 9
• 239000002184 metal Substances 0.000 claims description 9
• 239000000758 substrate Substances 0.000 claims description 6
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 238000005530 etching Methods 0.000 claims 1
• 238000005476 soldering Methods 0.000 claims 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1