JPH0379465U - - Google Patents

Info

Publication number

JPH0379465U

JPH0379465U JP14041089U JP14041089U JPH0379465U JP H0379465 U JPH0379465 U JP H0379465U JP 14041089 U JP14041089 U JP 14041089U JP 14041089 U JP14041089 U JP 14041089U JP H0379465 U JPH0379465 U JP H0379465U

Authority

JP

Japan

Prior art keywords

circuit board

printed circuit

flexible printed

reinforcing plate

copper foil

Prior art date

1989-12-04

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
• 239000011889 copper foil Substances 0.000 claims description 3
• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 230000003014 reinforcing effect Effects 0.000 claims 3
• 230000002950 deficient Effects 0.000 description 1
• 230000002787 reinforcement Effects 0.000 description 1

Cited By (2)