JPH0379452U - - Google Patents
Info
- Publication number
- JPH0379452U JPH0379452U JP14100189U JP14100189U JPH0379452U JP H0379452 U JPH0379452 U JP H0379452U JP 14100189 U JP14100189 U JP 14100189U JP 14100189 U JP14100189 U JP 14100189U JP H0379452 U JPH0379452 U JP H0379452U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- package
- depressions
- groove
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14100189U JPH0379452U (es) | 1989-12-05 | 1989-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14100189U JPH0379452U (es) | 1989-12-05 | 1989-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379452U true JPH0379452U (es) | 1991-08-13 |
Family
ID=31687935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14100189U Pending JPH0379452U (es) | 1989-12-05 | 1989-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379452U (es) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5947747A (ja) * | 1982-09-10 | 1984-03-17 | Hitachi Ltd | 半導体装置 |
-
1989
- 1989-12-05 JP JP14100189U patent/JPH0379452U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5947747A (ja) * | 1982-09-10 | 1984-03-17 | Hitachi Ltd | 半導体装置 |