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Priority to JP1989139612UpriorityCriticalpatent/JPH0377672U/ja
Publication of JPH0377672UpublicationCriticalpatent/JPH0377672U/ja
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W74/00—Encapsulations, e.g. protective coatings
H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
Credit Cards Or The Like
(AREA)
Structures For Mounting Electric Components On Printed Circuit Boards
(AREA)