JPH0377472U - - Google Patents
Info
- Publication number
- JPH0377472U JPH0377472U JP13904389U JP13904389U JPH0377472U JP H0377472 U JPH0377472 U JP H0377472U JP 13904389 U JP13904389 U JP 13904389U JP 13904389 U JP13904389 U JP 13904389U JP H0377472 U JPH0377472 U JP H0377472U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- parent
- child
- board
- support protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139043U JPH0726862Y2 (ja) | 1989-11-30 | 1989-11-30 | 混成集積回路基板モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139043U JPH0726862Y2 (ja) | 1989-11-30 | 1989-11-30 | 混成集積回路基板モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377472U true JPH0377472U (US07993877-20110809-P00003.png) | 1991-08-05 |
| JPH0726862Y2 JPH0726862Y2 (ja) | 1995-06-14 |
Family
ID=31686112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989139043U Expired - Fee Related JPH0726862Y2 (ja) | 1989-11-30 | 1989-11-30 | 混成集積回路基板モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726862Y2 (US07993877-20110809-P00003.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110089A (ja) * | 2001-09-27 | 2003-04-11 | Fairchild Korea Semiconductor Kk | 半導体電力用モジュール及びその製造方法 |
| CN102026479A (zh) * | 2009-09-17 | 2011-04-20 | 日东电工株式会社 | 布线电路基板、该布线电路基板的连接构造和连接方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5771372U (US07993877-20110809-P00003.png) * | 1980-10-17 | 1982-04-30 | ||
| JPS59121859U (ja) * | 1983-02-03 | 1984-08-16 | アイワ株式会社 | 複合基板装置 |
| JPS6361178U (US07993877-20110809-P00003.png) * | 1986-10-08 | 1988-04-22 |
-
1989
- 1989-11-30 JP JP1989139043U patent/JPH0726862Y2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5771372U (US07993877-20110809-P00003.png) * | 1980-10-17 | 1982-04-30 | ||
| JPS59121859U (ja) * | 1983-02-03 | 1984-08-16 | アイワ株式会社 | 複合基板装置 |
| JPS6361178U (US07993877-20110809-P00003.png) * | 1986-10-08 | 1988-04-22 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110089A (ja) * | 2001-09-27 | 2003-04-11 | Fairchild Korea Semiconductor Kk | 半導体電力用モジュール及びその製造方法 |
| CN102026479A (zh) * | 2009-09-17 | 2011-04-20 | 日东电工株式会社 | 布线电路基板、该布线电路基板的连接构造和连接方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0726862Y2 (ja) | 1995-06-14 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |