JPH0377453U - - Google Patents

Info

Publication number
JPH0377453U
JPH0377453U JP13816089U JP13816089U JPH0377453U JP H0377453 U JPH0377453 U JP H0377453U JP 13816089 U JP13816089 U JP 13816089U JP 13816089 U JP13816089 U JP 13816089U JP H0377453 U JPH0377453 U JP H0377453U
Authority
JP
Japan
Prior art keywords
semiconductor component
electrode
heat sink
mounting plate
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13816089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0810204Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13816089U priority Critical patent/JPH0810204Y2/ja
Publication of JPH0377453U publication Critical patent/JPH0377453U/ja
Application granted granted Critical
Publication of JPH0810204Y2 publication Critical patent/JPH0810204Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP13816089U 1989-11-29 1989-11-29 半導体部品取付構造 Expired - Lifetime JPH0810204Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13816089U JPH0810204Y2 (ja) 1989-11-29 1989-11-29 半導体部品取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13816089U JPH0810204Y2 (ja) 1989-11-29 1989-11-29 半導体部品取付構造

Publications (2)

Publication Number Publication Date
JPH0377453U true JPH0377453U (US08063081-20111122-C00115.png) 1991-08-05
JPH0810204Y2 JPH0810204Y2 (ja) 1996-03-27

Family

ID=31685281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13816089U Expired - Lifetime JPH0810204Y2 (ja) 1989-11-29 1989-11-29 半導体部品取付構造

Country Status (1)

Country Link
JP (1) JPH0810204Y2 (US08063081-20111122-C00115.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006094398A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Works Ltd 圧力波発生装置
KR20100132458A (ko) * 2009-06-09 2010-12-17 레인만 게엠바하 엔 코 카게 역화 방지장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006094398A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Works Ltd 圧力波発生装置
JP4525273B2 (ja) * 2004-09-27 2010-08-18 パナソニック電工株式会社 圧力波発生装置
KR20100132458A (ko) * 2009-06-09 2010-12-17 레인만 게엠바하 엔 코 카게 역화 방지장치

Also Published As

Publication number Publication date
JPH0810204Y2 (ja) 1996-03-27

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term