JPH03771B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a heating device for heat-treating an object to be heated, such as a semiconductor wafer, housed in a reaction tube, and particularly relates to the arrangement of heating element wires.

[Conventional technology]

Conventionally, heating devices used in semiconductor processing have a configuration that covers the circumferential surface of a cylindrical reaction tube that houses a semiconductor wafer, and a heating element is arranged to uniformly heat the circumferential surface of the reaction tube. It was established.

The heat treatment of the semiconductor wafer is performed by inserting the reaction tube containing the semiconductor wafer through the end opening of the heating device, and the semiconductor wafer that has undergone the heat treatment is pulled out together with the reaction tube from the end opening of the heating device. ing.

[Problem that the invention seeks to solve]

By the way, moving the reaction tube in and out of the heating device in the longitudinal direction requires a space larger than the length of the reaction tube on the end face side of the heating device, and also takes a long time to move the reaction tube in and out. In particular, when the reaction tube is pulled out from the heating device for cooling, residual heat from the heating device acts on the semiconductor wafer inside the reaction tube, putting a limit on the cooling rate.

Regarding the cooling of semiconductor wafers, the effect of rapid cooling may directly affect the characteristics of some semiconductor devices, and the demand for rapid cooling is increasing.

In response to these demands, in order to achieve rapid heating and cooling of semiconductor wafers, the furnace body was configured to be divisible in the diametrical direction, and the reaction tubes were attached to and removed from the furnace body in the diametrical direction. A heating device has been proposed.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a heating device that improves the arrangement of heat generating wires installed on the inner wall surface of a furnace body.

[Means for solving problems]

As shown in FIG. 1, the heating device of this invention has the following features:
Cylindrical furnace bodies 2A, 2B, heating element wire storage grooves 13 provided in a staggered manner on the inner wall surface of the furnace body, and heating element wires 14 provided to fit into the heating element wire storage grooves.
A storage groove 20 is provided at a bent portion of the heating element wire and a storage groove 20 provided between the bent portion and facing the heating element wire.
A band-shaped fixing piece (fixing piece 18) is formed and fixes a plurality of lines of the heat-generating wires, and a band-shaped fixing piece (fixing piece 18) is provided between each of the fixing pieces fixing the heat-generating wires to fix the heat-generating wires located next to each other. A mechanism (fixing bolts 28 and nuts 36) that fixes the heating element wires by a band-shaped spacer (spacer 16) that maintains the spacing and the band-shaped fixing piece, and also connects and arranges the fixing pieces in the axial direction of the furnace body. ).

[Effect]

In the heating device of the present invention, the heat generating wires are arranged at regular intervals in a staggered manner on the inner wall surface of the furnace body that houses the object to be heated, so that the heat generation temperature can be made uniform and stabilized.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 show an embodiment of the heating device of the present invention, FIG. 1 shows the arrangement of the heat generating wires of the heating device, and FIG. 2 shows the overall structure of the heating device.

As shown in FIG. 2, this heating device is constructed by vertically dividing a cylindrical furnace body into two furnace bodies 2A, 2.
B, each of the furnace bodies 2A and 2B is individually rotatably supported via a support shaft 8 by support columns 6 attached at regular intervals to the upper surface of a support base 4, and
The opening/closing mechanism 10 allows the opening/closing mechanism to be opened/closed and maintained at a desired opening degree.

Inside each of the furnace bodies 2A and 2B, a housing section 12 is formed to house a cylindrical reaction tube containing a semiconductor wafer as an object to be heated.

The housing portion 12 of each furnace body 2A, 2B is formed of a heat insulating material such as ceramic.
A heating element wire storage groove 13 is formed along the curved inner wall surface of the heating element wire storage groove 13, and as shown in FIG. The heating element wires 14 are fitted and disposed. In this case, the heating element wire 14 is a relatively thick element wire with a diameter of about 6.5 mm.

The heating element wires 14 are arranged at regular intervals by band-shaped spacers 16 made of a heat insulating material, and the heating element wires 14 are arranged at regular intervals by band-shaped spacers 16 formed of a heat insulating material. It is fixed to the furnace bodies 2A, 2B by fixing pieces 18.

FIG. 3 shows the heating element wire 1 for the furnace bodies 2A and 2B.
4 is shown fixing. That is, the heating element wire 14 is disposed in the heating element wire storage groove 13 formed on the inner wall surface of the furnace bodies 2A, 2B, and the storage groove 20 is formed at a position facing the heating element wire 14. Fixed piece 1
8 and the metal holding plate 22 is placed on the outer surface of this fixing piece 18.
2 and the fixing bolt 28 is passed through the through hole 24 formed in the fixing piece 18 and the through hole 26 of the furnace bodies 2A, 2B, and a washer 32 is attached to the fixing bolt 28 that protrudes from the outer surface of the reinforcing plate 30 of the furnace bodies 2A, 2B. and the heat insulating ring 34, and the fixing bolt 2
A nut 36 is attached to the threaded part 8 and tightened. Therefore, together with the fixing piece 18,
Fixing bolt 28, washer 32, insulation ring 34
The heating element wire 14 is fixed to the inner wall surface of the furnace bodies 2A, 2B with the nuts 36, and the fixing piece 1
8 are connected and arranged in the axial direction of the furnace bodies 2A, 2B.

Note that a DC power source as a driving source is connected between the terminals of the heating element wire 14, and by controlling the current, it is possible to generate heat at a specific temperature.

Therefore, the heat-generating wires 14 are installed along the inner wall surface of the housing section 12 that houses the objects to be heated in the furnace bodies 2A and 2B, and are arranged at regular intervals.
A predetermined process can be performed by uniformly heating a reaction tube containing a semiconductor wafer.

In addition, since the heating element wire 14 can have a thick shape of about 6.5 mm, it can be firmly fixed inside the furnace bodies 2A and 2B by the fixing means, and deformation due to the temperature inside the furnace can be prevented. Therefore, a uniform temperature distribution can be maintained, a stable heating state can be maintained, and the heating life can be extended.

Although the embodiments have been described using a semiconductor wafer as an example of an object to be heated, the heating apparatus of the present invention can uniformly heat objects to be heated other than semiconductor wafers.

〔Effect of the invention〕

As explained above, according to the present invention, the heat-generating wires are bent in a staggered manner, arranged at regular intervals, and firmly fixed to the inner wall surface of the furnace housing the object to be heated. It is possible to prevent deformation of the heat-generating wires such as sagging over time, to make the heat-generating temperature uniform, and to stabilize the heat-generating temperature.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an embodiment of the heating device of the present invention, Fig. 2 is a perspective view showing the overall configuration of the heating device shown in Fig. 1, and Fig. 3 is an inside view of the heating device shown in Fig. 1. FIG. 3 is a cross-sectional view showing a fixing structure of the heating element wire of FIG. 2A, 2B...furnace body, 12...accommodating section, 13...
...Heating element wire storage groove, 14...Heating element wire, 16...
Spacer, 18... Fixed piece (band-shaped fixed piece), 20
... Storage groove, 28 ... Fixing bolt, 36 ... Nut.

Claims (1)

[Scope of Claims] 1. A cylindrical furnace body, heat generating wire storage grooves provided in a staggered manner on the inner wall surface of the furnace body, and heat generating wires provided to fit into the heat generating wire storage grooves. a bent portion of the heating element wire; and a belt-shaped fixing piece provided between the bent portions and having a storage groove formed at a position facing the heating element wire to fix a plurality of lines of the heating element wire; a band-shaped spacer provided between each of the fixing pieces for fixing the heating element wires and maintaining a constant interval between the heating element wires located next to each other; A heating device comprising: a mechanism that is arranged in a connected manner in the axial direction of a furnace body;