JPH0375568U - - Google Patents

Info

Publication number
JPH0375568U
JPH0375568U JP13777289U JP13777289U JPH0375568U JP H0375568 U JPH0375568 U JP H0375568U JP 13777289 U JP13777289 U JP 13777289U JP 13777289 U JP13777289 U JP 13777289U JP H0375568 U JPH0375568 U JP H0375568U
Authority
JP
Japan
Prior art keywords
circuit board
wiring pattern
solder resist
resist agent
confirm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13777289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13777289U priority Critical patent/JPH0375568U/ja
Publication of JPH0375568U publication Critical patent/JPH0375568U/ja
Pending legal-status Critical Current

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Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す回路基板の構造
を示し、第1図aは平面図、第1図bはその断面
図を示す、第2図は従来の実施例を示す回路基板
の構造を示し、第2図aは平面図、第2図bはそ
の判断図を示す。 1……回路基板、2……半田レジスト剤、3…
…配線パターン、4……確認用窓、5……素子付
パターン、6……コンタクトパターン。
FIG. 1 shows the structure of a circuit board showing an embodiment of the present invention, FIG. 1a is a plan view, FIG. 1b is a sectional view thereof, and FIG. The structure is shown, FIG. 2a is a plan view, and FIG. 2b is a diagram showing its evaluation. 1... Circuit board, 2... Solder resist agent, 3...
... Wiring pattern, 4 ... Confirmation window, 5 ... Pattern with element, 6 ... Contact pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板と前記回路基板の一主面に配線されて
いる配線パターンと、前記配線パターンを半田レ
ジスト剤が覆つている回路基板の構造において、
前記半田レジスト剤の一部分を配線パターンを確
認するために窓明けをしたことを特徴とする回路
基板の構造。
A circuit board structure including a circuit board, a wiring pattern wired on one main surface of the circuit board, and a solder resist agent covering the wiring pattern,
A structure of a circuit board, characterized in that a part of the solder resist agent is opened in order to confirm the wiring pattern.
JP13777289U 1989-11-27 1989-11-27 Pending JPH0375568U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13777289U JPH0375568U (en) 1989-11-27 1989-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13777289U JPH0375568U (en) 1989-11-27 1989-11-27

Publications (1)

Publication Number Publication Date
JPH0375568U true JPH0375568U (en) 1991-07-29

Family

ID=31684915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13777289U Pending JPH0375568U (en) 1989-11-27 1989-11-27

Country Status (1)

Country Link
JP (1) JPH0375568U (en)

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