JPH0375546U - - Google Patents

Info

Publication number

JPH0375546U

JPH0375546U JP13689089U JP13689089U JPH0375546U JP H0375546 U JPH0375546 U JP H0375546U JP 13689089 U JP13689089 U JP 13689089U JP 13689089 U JP13689089 U JP 13689089U JP H0375546 U JPH0375546 U JP H0375546U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

lead

semiconductor device

package

Prior art date

1989-11-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims 2
• 238000010586 diagram Methods 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1

Cited By (1)