JPH0375544U - - Google Patents
Info
- Publication number
- JPH0375544U JPH0375544U JP1989135401U JP13540189U JPH0375544U JP H0375544 U JPH0375544 U JP H0375544U JP 1989135401 U JP1989135401 U JP 1989135401U JP 13540189 U JP13540189 U JP 13540189U JP H0375544 U JPH0375544 U JP H0375544U
- Authority
- JP
- Japan
- Prior art keywords
- lsi
- plate
- flange
- substrate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135401U JPH0648870Y2 (ja) | 1989-11-24 | 1989-11-24 | 集積回路の冷却素子構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135401U JPH0648870Y2 (ja) | 1989-11-24 | 1989-11-24 | 集積回路の冷却素子構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0375544U true JPH0375544U (enExample) | 1991-07-29 |
| JPH0648870Y2 JPH0648870Y2 (ja) | 1994-12-12 |
Family
ID=31682671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135401U Expired - Lifetime JPH0648870Y2 (ja) | 1989-11-24 | 1989-11-24 | 集積回路の冷却素子構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648870Y2 (enExample) |
-
1989
- 1989-11-24 JP JP1989135401U patent/JPH0648870Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648870Y2 (ja) | 1994-12-12 |