JPH0373891B2 - - Google Patents

Info

Publication number
JPH0373891B2
JPH0373891B2 JP57112996A JP11299682A JPH0373891B2 JP H0373891 B2 JPH0373891 B2 JP H0373891B2 JP 57112996 A JP57112996 A JP 57112996A JP 11299682 A JP11299682 A JP 11299682A JP H0373891 B2 JPH0373891 B2 JP H0373891B2
Authority
JP
Japan
Prior art keywords
power supply
supply voltage
chip select
memory device
semiconductor memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57112996A
Other languages
Japanese (ja)
Other versions
JPS593523A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57112996A priority Critical patent/JPS593523A/en
Publication of JPS593523A publication Critical patent/JPS593523A/en
Publication of JPH0373891B2 publication Critical patent/JPH0373891B2/ja
Granted legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/30Means for acting in the event of power-supply failure or interruption, e.g. power-supply fluctuations

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Direct Current Feeding And Distribution (AREA)
  • Power Sources (AREA)
  • Static Random-Access Memory (AREA)
  • Stand-By Power Supply Arrangements (AREA)

Description

【発明の詳細な説明】 (1) 発明の技術分野 本発明は、半導体記憶装置に関し、特に非常時
用電源によりバツクアツプされ得る相補型半導体
記憶装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a semiconductor memory device, and particularly to a complementary semiconductor memory device that can be backed up by an emergency power supply.

(2) 従来技術と問題点 従来形の、非常時用電源によりバツクアツプさ
れるように構成された半導体記憶装置が第1図に
示される。第1図の半導体記憶装置MEMの電源
端子VSにはダイオードD1,D2を介して二つの電
源、すなわち通常時の電源Vcc1(例えば5V)と非
常時用電源Vcc2(例えば2.2V)とが接続される。
記憶装置MEMの外部において通常時の電源Vcc1
の低下を検出する回路DTが設けられており、こ
の検出回路DTの出力は、メモリ全体を制御する
外部クロツク信号(例えばチツプセレクト信号
CS)とともにオアゲート回路ORに入力され、オ
アゲート路ORの出力は、記憶装置MEMのメモ
リ制御端子MSに入力される。
(2) Prior Art and Problems A conventional semiconductor memory device configured to be backed up by an emergency power source is shown in FIG. The power supply terminal VS of the semiconductor memory device MEM shown in FIG . Connected.
Normal power supply V cc1 outside the storage device MEM
A circuit DT for detecting a drop in the memory is provided, and the output of this detection circuit DT is connected to an external clock signal (for example, a chip select signal) that controls the entire memory.
CS) is input to the OR gate circuit OR, and the output of the OR gate OR is input to the memory control terminal MS of the storage device MEM.

第1図の回路において、通常の動作時には点
の電圧が電源Vcc2の出力電圧より大であるためダ
イオードD2はカツトオフしており、電源Vcc1から
の電源電流により動作している。次に何んらかの
原因により電源Vcc1の出力電圧が低下するとダイ
オードD2がオンとなり電池等より成る非常時用
電源Vcc2の出力電圧が供給されはじめると同時に
電源低下検出回路DTからの出力はハイレベルと
なり、オアゲート回路ORの出力はチツプセレク
ト信号にかかわらずハイレベルとなりメモリが静
止状態になる。従つて、メモリのデータは電源電
圧Vcc1の低下時においても破壊されることなく保
持される。
In the circuit shown in FIG. 1, during normal operation, the voltage at the point is higher than the output voltage of the power supply Vcc2 , so the diode D2 is cut off, and the circuit is operated by the power supply current from the power supply Vcc1 . Next, when the output voltage of the power supply V cc1 drops for some reason, the diode D 2 turns on, and the output voltage of the emergency power supply V cc2 consisting of a battery, etc. starts to be supplied, and at the same time, the output voltage from the power drop detection circuit DT starts to be supplied. The output becomes high level, and the output of the OR gate circuit OR becomes high level regardless of the chip select signal, and the memory becomes in a static state. Therefore, the data in the memory is maintained without being destroyed even when the power supply voltage Vcc1 decreases.

ところで、第1図に示される回路においては、
半導体記憶装置MEMの外部にダイオード、オア
ゲート回路、電源低下検出回路等を設ける必要が
あり、それだけ回路設計および回路構成が複雑化
するという問題点がある。
By the way, in the circuit shown in Figure 1,
It is necessary to provide a diode, an OR gate circuit, a power drop detection circuit, etc. outside the semiconductor memory device MEM, which poses a problem in that the circuit design and configuration become more complicated.

(3) 発明の目的 本発明の目的は、前記の従来形の問題点にかん
がみ、半導体記憶装置において、電源端子として
通常時用および非常時用の二つの端子を設け、外
部に特別の回路を設けることなしで通常時用電源
電圧の低下時におけるメモリのバツクアツプ保持
が行われるようにすることにある。
(3) Purpose of the Invention In view of the problems of the conventional type described above, the purpose of the present invention is to provide a semiconductor memory device with two terminals for normal and emergency use as power supply terminals, and to provide a special circuit externally. The object of the present invention is to enable backup retention of the memory even when the power supply voltage for normal use is reduced without the provision of such a memory.

(4) 発明の構成 本発明においては、通常時用電源端子と、非常
時用電源端子と、前記通常時用電源端子に印加さ
れる電圧の低下を検出する電源電圧低下検出回路
と、前記検出に応答して、内部電源電圧として、
前記通常時用電源端子に印加される電源電圧にか
えて、前記非常時用電源端子に印加される電源電
圧を供給する電源電圧供給回路と、半導体記憶装
置の動作・静止状態の切り換え制御を行うための
チツプセレクト信号が外部から入力されるチツプ
セレクト信号端子と、前記チツプセレクト信号入
力用の初段インバータと、前記検出に応答して、
前記内部電源電圧の前記初段インバータへの供給
を遮断する第1のトランジスタ及び前記初段イン
バータの出力レベルを半導体記憶装置が静止状態
となるように固定する第2のトランジスタを具備
する制御信号発生回路とを有し、前記制御信号発
生回路は、前記電源電圧低下検出回路が電圧の低
下を検出しないときは、前記外部から入力される
チツプセレクト信号に応答して半導体記憶装置の
前記動作・静止状態の切り換えを行い、前記電源
電圧低下検出回路が電圧の低下を検出したとき
は、前記外部から入力されるチツプセレクト信号
の状態にかかわらず半導体記憶装置を静止状態に
保持することを特徴とする半導体記憶装置が提供
される。
(4) Structure of the Invention The present invention includes a power supply terminal for normal use, a power supply terminal for emergency use, a power supply voltage drop detection circuit that detects a drop in voltage applied to the power supply terminal for normal use, and a power supply voltage drop detection circuit that detects a drop in voltage applied to the power supply terminal for normal use; In response to the internal supply voltage,
A power supply voltage supply circuit that supplies a power supply voltage applied to the emergency power supply terminal in place of the power supply voltage applied to the normal power supply terminal, and controls switching between an operating state and a static state of the semiconductor memory device. a chip select signal terminal to which a chip select signal is input from the outside; a first stage inverter for inputting the chip select signal; and a first stage inverter for inputting the chip select signal;
a control signal generation circuit comprising: a first transistor that cuts off supply of the internal power supply voltage to the first-stage inverter; and a second transistor that fixes the output level of the first-stage inverter so that the semiconductor memory device is in a static state; and the control signal generation circuit changes the operating/quiescent state of the semiconductor memory device in response to the externally input chip select signal when the power supply voltage drop detection circuit does not detect a voltage drop. When switching is performed and the power supply voltage drop detection circuit detects a voltage drop, the semiconductor memory device is held in a static state regardless of the state of the externally input chip select signal. Equipment is provided.

(5) 発明の実施例 本発明の一実施例としての半導体記憶装置が第
2図に示される。第2図の半導体記憶装置におい
ては、2つの電源端子VS1およびVS2に通常用電
源Vcc1および非常用電源Vcc2がそれぞれ接続され
る。電源端子VS1およびVS2は、集積回路の内部
においてダイオードD1およびD2を介して接続
点N1に接続される。接続点N1からの電源線
は、集積回路内の各回路に接続される。
(5) Embodiment of the Invention A semiconductor memory device as an embodiment of the invention is shown in FIG. In the semiconductor memory device of FIG. 2, a normal power supply V cc1 and an emergency power supply V cc2 are connected to two power supply terminals VS 1 and VS 2 , respectively. Power supply terminals VS 1 and VS 2 are connected to a connection point N1 via diodes D1 and D2 inside the integrated circuit. A power line from connection point N1 is connected to each circuit within the integrated circuit.

第2図の半導体記憶装置にはまた、通常用電源
Vcc1の電圧低下を検出する回路DTが内蔵されて
いる。電源電圧低下検出回路DTは、接続点N1
と接地の間に接続される相補型MOSインバータ
I1から構成され、電源Vcc1の出力電圧が入力され
る。メモリ全体を制御する外部クロツク信号(例
えばチツプセレクト信号)は、端子MSを介し
て、制御信号発生回路CSに入力される。制御信
号発生回路CSは、第2図に示されるように相補
型MOSインバータI2,I3から構成され、インバー
タI2を構成するPチヤンネルトランジスタT4のソ
ースと接続点N1との間にPチヤンネルMOSトラ
ンジスタT3が接続され、第2のインバータの出
力と接地の間にNチヤンネルMOSトランジスタ
がT6接続される。前記のPチヤンネルおよびN
チヤンネルMOSトランジスタのゲートにはそれ
ぞれ電圧低下検出回路DTの出力が接続される。
The semiconductor storage device shown in Figure 2 also has a normal power supply.
It has a built-in circuit DT that detects a voltage drop in V cc1 . The power supply voltage drop detection circuit DT connects to the connection point N1.
Complementary MOS inverter connected between
I1 , and the output voltage of the power supply Vcc1 is input. An external clock signal (for example, a chip select signal) that controls the entire memory is input to the control signal generation circuit CS via the terminal MS. The control signal generation circuit CS is composed of complementary MOS inverters I 2 and I 3 as shown in FIG. A P-channel MOS transistor T3 is connected, and an N-channel MOS transistor T6 is connected between the output of the second inverter and ground. The P channel and N
The output of the voltage drop detection circuit DT is connected to the gate of each channel MOS transistor.

第2図の半導体記憶装置においては、通常動作
時ダイオードD2に逆バイアスがかかる様に電源
端子VS1に通常様電源Vcc1が接続され電源端子
VS2に非常様電源Vcc2が接続される。従つて電源
Vcc1が正常な時には、インバータI1の入力はハイ
レベルであるので、その出力はローレベルとなり
PチヤンネルトランジスタT3はオン、Nチヤン
ネルトランジスタT6はオフとなる。従つてメモ
リMEMはチツプセレクト信号に応じて動作す
る。一方、何んらかの原因により電源Vcc1の出力
電圧が低下すると、ダイオードD2が導通して非
常用電源Vcc2より電圧が供給される。この時端子
VS1の電位はローレベルとなるのでインバータI1
の出力はハイレベルとなり、MOSトランジスタ
T3がオフとなつてインバータI2が非動作状態とな
り、またMOSトランジスタT6がオンとなつてイ
ンバータI3の入力がローレベルとなる。従つてイ
ンバータI3の出力はチツプセレクト信号にか
かわらず、ハイレベルに固定されてメモリ全体が
静止状態になり、メモリのデータは破壊されるこ
となく保持される。
In the semiconductor memory device shown in FIG. 2, the normal power supply V cc1 is connected to the power supply terminal VS 1 so that diode D 2 is reverse biased during normal operation.
An emergency power supply Vcc2 is connected to VS2 . Therefore power supply
When V cc1 is normal, the input of the inverter I 1 is at a high level, so its output is at a low level, and the P channel transistor T 3 is turned on and the N channel transistor T 6 is turned off. Therefore, the memory MEM operates according to the chip select signal. On the other hand, if the output voltage of the power supply V cc1 decreases for some reason, the diode D 2 becomes conductive and voltage is supplied from the emergency power supply V cc2 . At this time the terminal
Since the potential of VS 1 is low level, inverter I 1
The output of becomes high level, and the MOS transistor
T 3 is turned off and inverter I 2 becomes inactive, and MOS transistor T 6 is turned on and the input of inverter I 3 becomes low level. Therefore, the output of the inverter I3 is fixed at a high level regardless of the chip select signal, the entire memory is put into a static state, and the data in the memory is held without being destroyed.

尚、上記説明では相補型MOSメモリを例にあ
げて説明したが本発明の適用範囲はこれに限るも
のではない。
Note that although the above description has been made using a complementary MOS memory as an example, the scope of application of the present invention is not limited to this.

(6) 発明の効果 本発明によれば、半導体記憶装置において、通
常用電源および非常様電源を別個に接続すること
により、集積回路の外部に特別の回路を設けるこ
となしで、通常用電源の電圧低下時におけるメモ
リのバツクアツプ保持が可能である。
(6) Effects of the Invention According to the present invention, in a semiconductor memory device, by separately connecting the normal power source and the emergency power source, the normal power source can be connected without providing a special circuit outside the integrated circuit. Memory backup can be maintained during voltage drops.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来形の半導体記憶装置の回路図、
第2図は、本発明の一実施例としての半導体記憶
装置の回路図である。 (符号の説明)、MEM:半導体記憶装置、DT:
電源電圧低下検出回路、CS:制御信号発生回路、
CS:チツプセレクト信号。
FIG. 1 is a circuit diagram of a conventional semiconductor memory device.
FIG. 2 is a circuit diagram of a semiconductor memory device as an embodiment of the present invention. (Explanation of symbols), MEM: semiconductor memory device, DT:
Power supply voltage drop detection circuit, CS: control signal generation circuit,
CS: Chip select signal.

Claims (1)

【特許請求の範囲】 1 通常時用電源端子VS1と、 非常時用電源端子VS2と、 前記通常時用電源端子に印加される電圧の低下
を検出する電源電圧低下検出回路DTと、 前記検出に応答して、内部電源電圧として、前
記通常時用電源端子に印加される電源電圧にかえ
て、前記非常時用電源端子に印加される電源電圧
を供給する電源電圧供給回路D1,D2と、 半導体記憶装置の動作・静止状態の切り換え制
御を行うためのチツプセレクト信号が外部か
ら入力されるチツプセレクト信号端子MSと、 前記チツプセレクト信号入力用の初段インバー
タT4,T5と、 前記検出に応答して、前記内部電源電圧の前記
初段インバータへの供給を遮断する第1のトラン
ジスタT3及び前記初段インバータの出力レベル
を半導体記憶装置が静止状態となるように固定す
る第2のトランジスタT6を具備する制御信号発
生回路CSとを有し、 前記制御信号発生回路は、前記電源電圧低下検
出回路が電圧の低下を検出しないときは、前記外
部から入力されるチツプセレクト信号に対応して
半導体記憶装置の前記動作・静止状態の切り換え
を行い、前記電源電圧低下検出回路が電圧の低下
を検出したときは、前記外部から入力されるチツ
プセレクト信号の状態にかかわらず半導体記憶装
置を静止状態に保持することを特徴とする半導体
記憶装置。
[Claims] 1: a normal power supply terminal VS 1 ; an emergency power supply terminal VS 2 ; a power supply voltage drop detection circuit DT that detects a drop in the voltage applied to the normal power supply terminal; In response to the detection, a power supply voltage supply circuit D 1 , D supplies a power supply voltage applied to the emergency power supply terminal as an internal power supply voltage in place of the power supply voltage applied to the normal power supply terminal. 2 , a chip select signal terminal MS to which a chip select signal for controlling switching between an operating state and a static state of the semiconductor storage device is inputted from the outside; first stage inverters T 4 and T 5 for inputting the chip select signal; In response to the detection, a first transistor T3 cuts off the supply of the internal power supply voltage to the first stage inverter, and a second transistor T3 fixes the output level of the first stage inverter so that the semiconductor memory device is in a static state. and a control signal generation circuit CS comprising a transistor T6 , and the control signal generation circuit responds to the externally input chip select signal when the power supply voltage drop detection circuit does not detect a voltage drop. When the semiconductor memory device is switched between the operating state and the rest state, and the power supply voltage drop detection circuit detects a voltage drop, the semiconductor memory device is switched regardless of the state of the externally input chip select signal. A semiconductor memory device that is maintained in a stationary state.
JP57112996A 1982-06-30 1982-06-30 Semiconductor storage device Granted JPS593523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57112996A JPS593523A (en) 1982-06-30 1982-06-30 Semiconductor storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57112996A JPS593523A (en) 1982-06-30 1982-06-30 Semiconductor storage device

Publications (2)

Publication Number Publication Date
JPS593523A JPS593523A (en) 1984-01-10
JPH0373891B2 true JPH0373891B2 (en) 1991-11-25

Family

ID=14600810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57112996A Granted JPS593523A (en) 1982-06-30 1982-06-30 Semiconductor storage device

Country Status (1)

Country Link
JP (1) JPS593523A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278097A (en) * 1985-06-03 1986-12-08 Nippon Telegr & Teleph Corp <Ntt> Memory integrated circuit
JP6152668B2 (en) * 2013-03-14 2017-06-28 株式会社ソシオネクスト Semiconductor device and method for testing semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5723123A (en) * 1980-07-16 1982-02-06 Fujitsu Ltd Semiconductor device having volatile memory
JPS5738230B2 (en) * 1974-03-08 1982-08-14

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6137077Y2 (en) * 1980-08-15 1986-10-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738230B2 (en) * 1974-03-08 1982-08-14
JPS5723123A (en) * 1980-07-16 1982-02-06 Fujitsu Ltd Semiconductor device having volatile memory

Also Published As

Publication number Publication date
JPS593523A (en) 1984-01-10

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