JPH0373589A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To prevent crosstalk in high frequency characteristic and to reduce its cost by adhering two insulating boards back-to-back, and using conductive resin as an adhering material. CONSTITUTION:A conductor 3 is printed with conductive thin film paste on a ceramic board 2 having a through hole 1 to bs electrically conducted via the through hole. An IC bare chip 4 is placed on the board 2 by a bonding method, a passive component such as a capacitor 5, a resistor, etc., is soldered by a solder reflowing method to complete placing of the component. Simultaneously, a component is placed on another ceramic board. The two boards on which no component is placed are coated with Ag paste 6 of conductive resin, the faces coated with the paste are superposed and thermally cured. Then, an outer terminal is inserted, and soldered by a solder dipping method. Thus, a crosstalk is prevented, and an inexpensive hybrid circuit can be formed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit, and particularly to a hybrid integrated circuit that requires high frequency characteristics.

[Conventional technology]

In recent years, the degree of integration of circuits has increased significantly due to the demand for miniaturization of devices, and the degree of integration of ICs (integrated circuits) has increased accordingly. However, as the degree of integration of ICs increases, miniaturization is required, and there are many circuits and characteristics that cannot be achieved with ICs alone. Therefore, the need for hybrid integrated circuits including peripheral circuits of ICs is increasing in importance. Hybrid integrated circuits are
A conductive film, thick film resistor, or thin film resistor is formed on an insulating substrate, such as a ceramic substrate or a printed circuit board. Furthermore, active elements such as ICs, transistors, diodes, and passive elements are mounted on top of it, and it has a complex function that provides various circuit functions, making it suitable for use in everything from highly reliable industrial applications such as communication devices and computers to home appliances. It is contributing to the miniaturization of all kinds of electrical components, including products and consumer products such as games.

Conventional hybrid integrated circuits have a two-layer structure in which a wiring pattern is placed on a ceramic substrate, and insulating glass is provided on the first layer to form a second layer of conductor patterns to increase the degree of integration. Become.

[Problem to be solved by the invention]

The conventional substrate for hybrid integrated circuits described above has a two-layer structure in order to achieve a high degree of integration. The 10 circuit patterns and the second layer circuit pattern are made of insulating glass (approximately 40 μm
), a phenomenon (crosstalk) occurs in which the signals of the first layer and the second layer are mixed in the high frequency region. On the other hand, a multilayer board is used as a board for circuits that require high frequency characteristics, and a ground potential pattern is placed on the entire surface of the inner layer to provide a shielding effect! Although there are precepts, they are very expensive and are an obstacle to lower prices.

[Means to solve the problem]

The hybrid integrated circuit of the present invention has a structure in which components are mounted on only one side of two insulating substrates each having a through hole whose back side is electrically connected to a conductor pattern section at ground potential, and the surfaces on which no components are mounted are attached back to back. have.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a partial sectional view of an embodiment of the present invention.

On a ceramic substrate 2 having a through hole 1, a conductor 3 is printed with a conductive thick film base (Ag/Pc11 system) to provide electrical continuity through the through hole. An IC bare chip 4 is mounted on the ceramic substrate 2 by a bonding method, and a capacitor 5. Passive components such as resistors are soldered using the solder reflow method to complete component mounting. Similarly, components are mounted on another ceramic substrate. Apply conductive resin Ag paste 6 to a thickness of about 40 mμ on each side of these two boards on which no components are mounted,
As shown in FIG. 2, the surfaces coated with Ag paste are placed one on top of the other and heat cured at 120° C. After that, external terminals are inserted and solder connections are made using the solder dipping method.

〔Effect of the invention〕

As described above, the present invention has the effect of preventing crosstalk in high frequency characteristics by gluing two insulating substrates back to back and using conductive resin as the bonding material. Further, by using a conventional thick film substrate, an inexpensive substrate can be used.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a substrate used in one embodiment of the present invention, and FIG.
The figure is a sectional view of a hybrid integrated circuit showing one embodiment of the present invention. 1... Through hole, 2... Ceramic substrate, 3... Thick film printed conductor, 4...
IC pair chip, 5... Capacitor, 6...
...Ag paste, 7...IC bare base, protective coat, 8...gold wire 9...flat bar, cage IC.

Claims (1)

[Claims] 1. A hybrid integrated circuit having a configuration in which insulating substrates are bonded back to back, the bonding resin being a conductive resin and the potential being set to ground potential.