JPH0373440U - - Google Patents
Info
- Publication number
- JPH0373440U JPH0373440U JP13522389U JP13522389U JPH0373440U JP H0373440 U JPH0373440 U JP H0373440U JP 13522389 U JP13522389 U JP 13522389U JP 13522389 U JP13522389 U JP 13522389U JP H0373440 U JPH0373440 U JP H0373440U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cull
- cull portion
- pot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13522389U JPH0373440U (da) | 1989-11-21 | 1989-11-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13522389U JPH0373440U (da) | 1989-11-21 | 1989-11-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0373440U true JPH0373440U (da) | 1991-07-24 |
Family
ID=31682503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13522389U Pending JPH0373440U (da) | 1989-11-21 | 1989-11-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0373440U (da) |
-
1989
- 1989-11-21 JP JP13522389U patent/JPH0373440U/ja active Pending