JPH0373420B2 - - Google Patents
Info
- Publication number
- JPH0373420B2 JPH0373420B2 JP264984A JP264984A JPH0373420B2 JP H0373420 B2 JPH0373420 B2 JP H0373420B2 JP 264984 A JP264984 A JP 264984A JP 264984 A JP264984 A JP 264984A JP H0373420 B2 JPH0373420 B2 JP H0373420B2
- Authority
- JP
- Japan
- Prior art keywords
- gripping
- axis
- slider
- processing
- nozzle head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 38
- 238000000926 separation method Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 description 8
- 238000003754 machining Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/02—Advancing work in relation to the stroke of the die or tool
- B21D43/04—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
- B21D43/10—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Jigs For Machine Tools (AREA)
- Feeding Of Workpieces (AREA)
Description
【発明の詳細な説明】
この発明は、鉄、非鉄金属或いはプラスチツク
等の材料を把持して、レーザ加工装置、パンチン
グマシン、熔断加工装置等材料加工装置に提供す
る材料把持装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a material gripping device for gripping materials such as iron, nonferrous metals, or plastics and providing them to material processing equipment such as laser processing equipment, punching machines, and fusing equipment.
一般に材料と材料加工装置の加工部とは相対的
に移動するよう構成されるので、材料把持装置の
把持部と加工部とが干渉するという問題がある。
従来、上記干渉を避けるため相対的移動可能の２
つの把持手段を設け、この２つの把持手段間でい
わゆる掴み換えをするか、或いは把持部分の加工
を残しておき、他の部分の加工が終了してからい
わゆる掴み直しをして再度加工を続けることが行
われていた。 Since the material and the processing section of the material processing device are generally configured to move relative to each other, there is a problem that the gripping section of the material gripping device and the processing section interfere with each other.
Conventionally, in order to avoid the above interference, two relatively movable
Either two gripping means are provided and the gripping is changed between the two gripping means, or the gripped part is left unprocessed and the other parts are gripped again after the other parts have been processed and the machining is continued again. things were being done.
しかし、上記加工途中における掴み換えには工
作制度上の問題がある。即ち、掴み換えは相対的
に移動する２つの把持手段間で行われるものであ
るから掴み換え毎に誤差が生じるのは止むを得
ず、特に、複数回の掴み換えを行う場合には誤差
が蓄積され工作精度が悪化するのである。 However, there is a problem with the machining system in re-gripping during the process. That is, since regripping is performed between two relatively movable gripping means, it is unavoidable that errors occur each time the gripping is changed, and especially when regripping is performed multiple times, errors occur. This accumulates and deteriorates machining accuracy.
又、一方、一時加工を停止してからの掴み直し
は、上記同様の誤差に相埃つて、加工作業におけ
る時間的ロスを生じる。そして、例えばレーザー
加工装置において連続的に切断作業を行つている
ような場合には、掴み直しの誤差を無視したとし
ても加工途中での一時停止は好ましくないのであ
る。 On the other hand, re-gripping after temporarily stopping machining causes time loss in the machining operation due to errors similar to those described above. For example, when cutting is performed continuously in a laser processing device, it is not desirable to temporarily stop the processing in the middle of processing, even if the error in regripping is ignored.
この発明は上記従来技術に鑑みて、材料加工装
置の加工部と干渉することがなく、もつて製品精
度の向上、及び円滑な連続作業を可能とする材料
把持装置を提供することを目的とする。 In view of the above-mentioned prior art, an object of the present invention is to provide a material gripping device that does not interfere with the processing section of a material processing device, thereby improving product accuracy and enabling smooth continuous work. .
上記目的を達成するためのこの発明は、基台に
複数の把持部を設け、当該それぞれの把持部に、
加工部の相対的接近に基づいて材料を解放し把持
位置から離れる退避機構と、前記加工部の相対的
離反に基づいて前記把持位置に復帰し前記材料を
再び把持する復帰機構とを設けたことを特徴とす
る材料把持装置である。 In order to achieve the above object, the present invention provides a plurality of gripping parts on the base, and each of the gripping parts has a
A retraction mechanism that releases the material and leaves the gripping position based on the relative approach of the processing part, and a return mechanism that returns to the gripping position and grips the material again based on the relative separation of the processing part. This is a material gripping device characterized by:
従つて、この発明に係る材料把持装置は、該当
把持部が干渉域に入る以前に退避するよう構成し
たので、従来の如き掴み換えによる誤差、又は掴
み直しによる誤差が生じることがなく製品精度の
向上、及び円滑な連続作業を可能とするのであ
る。 Therefore, since the material gripping device according to the present invention is configured to retreat before the relevant gripping part enters the interference area, the product accuracy can be improved without causing errors due to regripping or regripping as in the past. This enables improved performance and smooth continuous work.
以下、この発明をレーザー加工装置に適用した
一実施例を掲げ詳細に説明する。 Hereinafter, an example in which the present invention is applied to a laser processing device will be described in detail.
第１図はレーザ加工装置の平面図、第２図はそ
の右側図面である。レーザ加工装置１はレーザ発
振器３を有し、該レーザ発振器３により発生され
たレーザ光線をベンドミラーM1，M2，M3，M4
を介して集光レンズを内蔵したノズルヘツド５に
送り、該ノズルヘツド５の先端ノズルからレーザ
ビームを発射させている。 FIG. 1 is a plan view of the laser processing apparatus, and FIG. 2 is a right side view thereof. The laser processing device 1 has a laser oscillator 3, and bends the laser beam generated by the laser oscillator 3 to bend mirrors M 1 , M 2 , M 3 , M 4
The laser beam is sent to the nozzle head 5 which has a built-in condensing lens through the laser beam, and the laser beam is emitted from the tip nozzle of the nozzle head 5.
第１図において、テーブル７の左右方向（Ｘ方
向）にＸ軸レールRXを延設している。Ｘ軸キヤ
リツジ９はＸ軸レールRXに平行に延設したＸ軸
ねじSXを図示しないナツト部材に螺合させ、Ｘ
軸サーボモータMXを回転駆動することによりＸ
軸方向に案内される。そして、材料把持装置１１
は前記Ｘ軸キヤリツジ９に固定的に設けられ、把
持部１３，１３で材料Ｗを把持し、該材料ＷをＸ
軸方向に案内している。 In FIG. 1, an X-axis rail RX extends in the left-right direction (X direction) of the table 7. The X-axis carriage 9 is constructed by screwing an X-axis screw SX extending parallel to the X-axis rail RX into a nut member (not shown).
By rotating the axis servo motor MX,
axially guided. And material gripping device 11
is fixedly provided on the X-axis carriage 9, grips the material W with the gripping parts 13, 13, and moves the material W along the
It is guided in the axial direction.
第２図に示したように、テーブル７の上方には
門型のフレーム１５を設け、該フレーム１５の上
方に設けたＹ軸レールRYに沿つてＹ軸キヤリツ
ジ１７を水平面内でＸ軸と直交するＹ軸方向に案
内している。その駆動機構はＸ方向と同様、Ｙ軸
キヤリツジ１７に設けられたナツト部材（図示せ
ず）と、Ｙ軸サーボモータMYにより回動駆動さ
れるＹ軸ねじSYにより行われる。そして、前記
Ｙ軸キヤリツジ１７にはＺ軸レールRZを介して
上下方向に案内されるＺ軸キヤリツジ１９が設け
られ、該Ｚ軸キヤリツジ１９に前述ノズルヘツド
５を取付けている。なお、Ｚ軸キヤリツジ１９の
上下方向の駆動は、Ｘ軸、Ｙ軸方向と同様、Ｚ軸
キヤリツジに設けられたナツト部材（図示せず）
と、Ｚ軸サーボモータMZで回転駆動されるＺ軸
ねじSZで行われている。 As shown in FIG. 2, a gate-shaped frame 15 is provided above the table 7, and the Y-axis carriage 17 is moved along the Y-axis rail RY provided above the frame 15 in a horizontal plane perpendicular to the X-axis. It is guided in the Y-axis direction. As in the X direction, the drive mechanism is performed by a nut member (not shown) provided on the Y-axis carriage 17 and a Y-axis screw SY rotationally driven by a Y-axis servo motor MY. The Y-axis carriage 17 is provided with a Z-axis carriage 19 that is guided in the vertical direction via a Z-axis rail RZ, and the nozzle head 5 is attached to the Z-axis carriage 19. Note that the Z-axis carriage 19 is driven in the vertical direction by a nut member (not shown) provided on the Z-axis carriage, as in the X-axis and Y-axis directions.
This is done by a Z-axis screw SZ that is rotationally driven by a Z-axis servo motor MZ.
従つて、本例に示したレーザ加工装置１は第１
図において左右（Ｘ）方向に案内される材料Ｗ
を、上下（Ｙ）方向に案内するノズルヘツド５か
らのレーザビームで所望の２次元形状に切断加工
することができる。 Therefore, the laser processing apparatus 1 shown in this example has the first
Material W guided in the left and right (X) direction in the figure
can be cut into a desired two-dimensional shape using a laser beam from the nozzle head 5 that guides the material in the vertical (Y) direction.
第１図において、ノズルヘツド５が把持部１
３，１３方向に接近したことを知るために、フレ
ーム１５の把持装置寄りの位置にＹ軸センサ２１
を設け、Ｙ軸キヤリツジ１７にＹ軸ドグ２３を設
けている。又、第２図に示したように、Ｘ軸方向
の移動においてノズルヘツド５の接近を知るため
に、それぞれの把持部１３，１３にＸ軸センサ２
５を設け、該センサ２５の通過位置に関連してテ
ーブル７にＸ軸ドグ２７を設けている。従つて、
本例では、某把持部１３に設けたＸ軸センサ２５
がＸ軸ドグ２７を検出したこと、及び、Ｙ軸セン
サ２１がＹ軸ドグ２３を検出していることを条件
として干渉域を知り、材料把持装置１１の該当把
持部１３を退避させるようにしている。なお、Ｘ
軸、Ｙ軸が数値制御されている場合には、上記干
渉域は既知であるので、上記センサ及びドグを省
略することもできる。 In FIG. 1, the nozzle head 5 is
In order to know when the user is approaching in the 3rd and 13th directions, a Y-axis sensor 21 is installed on the frame 15 at a position near the gripping device.
A Y-axis dog 23 is provided on the Y-axis carriage 17. In addition, as shown in FIG. 2, in order to detect the approach of the nozzle head 5 during movement in the X-axis direction, an X-axis sensor 2 is attached to each of the grips 13, 13.
5, and an X-axis dog 27 is provided on the table 7 in relation to the passing position of the sensor 25. Therefore,
In this example, the X-axis sensor 25 provided on a certain grip part 13
detects the X-axis dog 27 and the Y-axis sensor 21 detects the Y-axis dog 23, the interference area is known, and the corresponding gripping section 13 of the material gripping device 11 is evacuated. There is. In addition, X
If the axes and Y-axes are numerically controlled, the interference area is known, so the sensor and dog can be omitted.
第３図と第４図に材料把持部１３の詳細を示し
た。第３図は拡大平面図、第４図は第３図の−
断面図である。 Details of the material gripping section 13 are shown in FIGS. 3 and 4. Figure 3 is an enlarged plan view, Figure 4 is the − of Figure 3.
FIG.
材料把持装置１１の基台２７に複数の把持部１
３を設けている。把持部１３は上爪２９と下爪３
１とを有する。下爪３１はスライダ３３に固定的
に設けられ、該スライダ３３は、基台２７に固定
的に設けられたシリンダ３５のピストン３７の作
動によりピストンロツド３９を介してＹ方向に移
動可能である。一方、上爪２９は前記スライダ３
３に対し固定的な軸４１を軸として揺動する揺動
板４３の先端に設けられ、該揺動板４３の他方側
には揺動シリンダ４５のピストン４７の作動によ
り前記スライダ３３上面を押圧する押圧ロツド４
９を設けている。 A plurality of gripping parts 1 are mounted on the base 27 of the material gripping device 11.
There are 3. The grip part 13 has an upper claw 29 and a lower claw 3.
1. The lower claw 31 is fixedly provided on a slider 33, and the slider 33 is movable in the Y direction via a piston rod 39 by the operation of a piston 37 of a cylinder 35 fixedly provided on the base 27. On the other hand, the upper claw 29 is attached to the slider 3.
A rocking plate 43 is provided at the tip of a swinging plate 43 that swings about a fixed shaft 41 relative to the slider 3, and on the other side of the swinging plate 43, a piston 47 of a swinging cylinder 45 presses the top surface of the slider 33. Pressing rod 4
There are 9.
第３図に示したように、把持部１３の側方に
は、スライダ３３の移動状態を感知し次の制御信
号を得べく、該スライダにトグ５１を設け、前
進、退避位置それぞれに対応して位置検出センサ
５３，５５を設けている。 As shown in FIG. 3, a tog 51 is provided on the side of the slider 33 to sense the movement state of the slider 33 and obtain the next control signal, which corresponds to the forward and retracted positions. Position detection sensors 53 and 55 are provided.
上記構成による材料把持装置１１の各把持部１
３は、第１図、第２図に示したＸ軸センサ２５及
びドグ２７と、Ｙ軸センサ２１及びドグ２３とに
よ干渉域を知り、或いは数値制御部からの指令に
より干渉域を知り、第４図に示した材料把持状態
から第５図に示した退避状態に移行することがで
きる。 Each gripping part 1 of the material gripping device 11 with the above configuration
3 knows the interference area by the X-axis sensor 25 and dog 27 and the Y-axis sensor 21 and dog 23 shown in FIGS. 1 and 2, or knows the interference area by a command from the numerical control section, It is possible to shift from the material gripping state shown in FIG. 4 to the retracted state shown in FIG.
第４図において、揺動シリンダ４５が押圧ロツ
ド４９を下方に押し下げ、材料Ｗを加圧力Ｆで把
持している。前記干渉域にあることを知れば、揺
動シリンダ４５は押圧ロツド４０を上方に引き、
自重、又は適宜のばね力で上爪を上方に上げるべ
く揺動する。しかる後、シリンダ３５を作動さ
せ、第５図に示したようにスライダ３３をＹ方向
にΔYだけ引いてノズルヘツド５との干渉を避け
るべく退避するのである。そして、干渉域からノ
ズルヘツド５が離反すれば、再び逆の作動を行い
復帰する。即ち、シリンダ３５の作動によりスラ
イダ３３の爪部を把持位置に戻し、揺動シリンダ
４５の作動によ材料Ｗを押圧力Ｆで把持する。 In FIG. 4, the swing cylinder 45 pushes down the pressing rod 49 and grips the material W with a pressing force F. When it knows that it is in the interference area, the swing cylinder 45 pulls the pressing rod 40 upward,
The upper claw swings upward using its own weight or an appropriate spring force. Thereafter, the cylinder 35 is operated and the slider 33 is pulled in the Y direction by ΔY as shown in FIG. 5, thereby retracting it to avoid interference with the nozzle head 5. Then, when the nozzle head 5 separates from the interference area, the reverse operation is performed again and the nozzle head 5 returns to its original state. That is, the claw portion of the slider 33 is returned to the gripping position by the operation of the cylinder 35, and the material W is gripped by the pressing force F by the operation of the swing cylinder 45.
上記実施例の説明は、材料把持装置１１がＸ軸
方向に移動される場合について行つたけれども、
固定的な場合、又は、多軸方向に複数の材料把持
装置が設けられる場合であつても、この発明は要
するに個々の把持部が干渉域に入れば退避し、干
渉域から離反すれば復帰する構成であるから、同
様の説明を行うことができる。なお、退避機構は
スライダ３３を用いて直線的に移動する例を示し
たけれども、例えば、カムとカムフオロア等用い
て旋回させる構成とすることもできる。 Although the above embodiment has been described for the case where the material gripping device 11 is moved in the X-axis direction,
Even in the case of a fixed device or a case where a plurality of material gripping devices are provided in multiple axial directions, the present invention basically means that each gripping portion retreats when it enters the interference area, and returns when it leaves the interference area. Since it is a configuration, a similar explanation can be given. Although an example has been shown in which the evacuation mechanism moves linearly using the slider 33, it can also be configured to rotate using a cam, a cam follower, etc., for example.
基台に複数の把持部を設け、当該それぞれの把
持部に加工部の相対的接近に基づいて材料を解放
し把持位置から離れる退避機構と、前記加工部の
相対的離反に基づいて前記把持位置に復帰し前記
材料を再び把持する復帰機構とを設けたことを特
徴とするこの発明に係る材料把持装置は、材料加
工部と干渉することがなく、もつて、製品精度を
向上させることができると共に、円滑な連続作業
を可能とすることができる。 A base is provided with a plurality of gripping parts, and each gripping part has an evacuation mechanism that releases the material and leaves the gripping position based on the relative approach of the processing part, and a retraction mechanism that releases the material and moves away from the gripping position based on the relative separation of the processing part. The material gripping device according to the present invention, which is characterized by being provided with a return mechanism that returns to the original state and grips the material again, does not interfere with the material processing section, and can improve product accuracy. At the same time, smooth continuous work can be performed.
図面はいずれもこの発明の実施例を示し、第１
図はレーザ加工装置の例を示す平面図、第２図は
第１図の右側面図、第３図は材料把持部の拡大平
面図、第４図は第３図の−矢視断面図、第５
図は第４図に対応し、退避状態を示す説明図であ
る。
１１…材料把持装置、１３…把持部、２９…上
爪、３１…下爪、Ｗ…材料。
The drawings all show embodiments of the invention.
The figure is a plan view showing an example of a laser processing device, FIG. 2 is a right side view of FIG. 1, FIG. 3 is an enlarged plan view of the material gripping part, and FIG. Fifth
The figure corresponds to FIG. 4 and is an explanatory diagram showing a retracted state. DESCRIPTION OF SYMBOLS 11... Material gripping device, 13... Gripping part, 29... Upper claw, 31... Lower claw, W... Material.
Claims (1)
把持部に加工部の相対的接近に基づいて材料を解
放し把持位置から離れる退避機構と、前記加工部
の相対的離反に基づいて前記把持位置に復帰し前
記材料を再び把持する復帰機構とを設けたことを
特徴とする材料把持装置。1. A base is provided with a plurality of gripping parts, and each gripping part is provided with an evacuation mechanism that releases the material and leaves the gripping position based on the relative approach of the processing part, and a retraction mechanism that releases the material and moves away from the gripping position based on the relative separation of the processing part. A material gripping device comprising: a return mechanism for returning to a position and gripping the material again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP264984A JPS60146644A (en) | 1984-01-12 | 1984-01-12 | Material holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP264984A JPS60146644A (en) | 1984-01-12 | 1984-01-12 | Material holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60146644A JPS60146644A (en) | 1985-08-02 |
| JPH0373420B2 true JPH0373420B2 (en) | 1991-11-21 |
Family
ID=11535200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP264984A Granted JPS60146644A (en) | 1984-01-12 | 1984-01-12 | Material holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60146644A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5132974B2 (en) * | 2007-04-10 | 2013-01-30 | 高園産業株式会社 | Earless sheet handling method and apparatus for dispensing device |
| JP5867864B2 (en) * | 2012-11-07 | 2016-02-24 | 株式会社タカゾノ | Dispensing device |
-
1984
- 1984-01-12 JP JP264984A patent/JPS60146644A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60146644A (en) | 1985-08-02 |
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