JPH0372694A - Electronic component for infrared ray reflowing - Google Patents

Abstract

PURPOSE:To obtain an electronic component suitable particularly for infrared ray reflow by providing white paint coating layer on a surface to be irradiated with infrared rays of resin housing. CONSTITUTION:A white paint coating layer 4 may be formed on a surface which is irradiated with infrared rays directly when an electronic component is secured on a board under an infrared ray reflow system, and the layer 4 is provided, for example, on the upper surface of a resin housing 2. Polyamide used preferably to form the housing contains 30-100mol% terephthalic acid component unit of 100mol% total dicarboxylic acid component unit, 0-40mol% aromatic dicarboxylic acid component unit except the terephthalic acid, and/or 0-70mol% fatty dicarboxylic acid component unit as a repeated unit, and the diamine component unit is a derivative of alicyclic alkylene diamine component unit. Such a polyamide has 0.5-30.dl/g of limiting viscosity [eta] measured at 30 deg.C in conc. sulfuric acid.

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to electronic components that are soldered onto a substrate by heating with infrared radiation.

Technical background of the invention and its problems Conventionally, as a method of fixing electronic components on a printed wiring board, terminals are inserted into through holes of the printed wiring board, electronic components are placed, and then the printed wiring board is fixed. Dipping in a solder bath was used to secure electronic components to printed circuit boards.

However, with this method, it was not possible to increase the mounting density of electronic components beyond a certain level because the mounting density of electronic components was high (this could lead to short circuits within the board). .

In recent years, as electronic devices have become smaller and lighter, it has become necessary to increase the mounting density of electronic components.In order to improve this mounting density, methods have been adopted to increase the degree of integration of the chips themselves. was. However, the improvement in packaging density by this method has already been achieved close to the limit value, and recently the improvement in packaging density has been moving toward increasing the packaging density of electronic components on the surface of the printed wiring board.

As a method to improve the mounting density of electronic components on the surface of a printed wiring board, electronic components are temporarily fixed on a board with solder dotted on the electronic component stator window of the circuit in advance, and then infrared rays are applied onto the board. The method used is to irradiate the spotted solder to melt it and fix the electronic component on the circuit. This method is generally referred to as an infrared reflow method.

By mounting electronic components using this method, it is possible to improve the mounting density of electronic components on the surface of the board. There is a problem in that the temperature of the parts becomes high and the temperature cannot be raised sufficiently during infrared reflow. Therefore, it cannot be said that the electronic components conventionally used as electronic components for such infrared reflow have sufficient heat resistance. It needed to be improved.

OBJECTS OF THE INVENTION The present invention attempts to solve the problems associated with the prior art as described above, and aims to provide an electronic component particularly suitable for infrared reflow.

Summary of the Invention An infrared reflow electronic component according to the present invention is an infrared reflow electronic component having a resin housing, in which a white paint coating layer is provided at least on the surface of the resin housing that is irradiated with infrared rays. It is a feature.

Since the electronic component according to the present invention has a coating layer of white paint formed on the surface of the resin housing that is irradiated with infrared rays as described above, it becomes difficult to absorb infrared rays. Shows excellent heat resistance.

DETAILED DESCRIPTION OF THE INVENTION The infrared reflow electronic component according to the present invention will be specifically described below.

FIG. 1 schematically shows a cross section of an electronic component for infrared reflow according to the present invention.

As shown in FIG. 1, the infrared reflow electronic component of the present invention basically includes a resin housing 2 that accommodates chips 1 and 11, and terminals 3 and 3 led out of the resin housing 2 from the chips 111'. It consists of 3′.

Electronic components of the present invention include diodes, transistors, field effect transistors, rectifiers, integrated circuits, resistors, variable resistors, capacitors, etc.
．． 1' may be anything that can form these electronic components. For example, when the electronic component of the present invention is an integrated circuit, examples of the chip include a chip capacitor, a flip chip IC, and a transistor chip. , diode chips, thick film resistors, etc. Such chips are typically placed on a substrate. Further, when the electronic component is, for example, a transistor or a resistor, it may be composed of a single chip.

Such a chip is housed in a plastic housing 2, and this chip 1.1' is connected to a terminal 3.3'. The chips 1.1' as described above and the ends of the terminals 3.3' connected to the chips 1, 1' are housed in the resin housing 2.

In the electronic component of the present invention, a coating layer of white paint is provided on the surface of the resin housing as described above that is irradiated with infrared rays. This coating layer is indicated at 4 in FIG.

The coating layer 4 of the white paint may be provided on a surface that is directly irradiated with infrared rays when electronic components are fixed on a substrate using the infrared reflow one-way method. For example, in FIG.
An embodiment is shown in which a coating layer 4 of this white paint is provided on the upper surface of the resin housing 2. However, in the electronic component of the present invention, the coating layer described above can also be provided on the side surfaces 5 and 5' of the resin housing 2, and if necessary, the coating layer can also be provided on the lower surface 6 of the resin housing 2. .

The thickness of the coating layer 4 of such white paint is usually 10 to 10.
100 μm, preferably within the range of 20 to 50 μm.

As a white paint for forming such a coating layer,
A paint containing a resin component and a white pigment can be used.

There is no particular restriction on the resin component forming this white paint, and ordinary heat-resistant resins can be used.

Examples of such heat-resistant resins include urethane resins, epoxy resins, polyimide resins, and polyimide amide resins. Among these resins, urethane resins and epoxy resins are particularly preferred.

As the white pigment contained in the white paint used in the present invention, both inorganic white pigments and organic white pigments can be used. Among these, it is preferable to use inorganic white pigments.

Examples of such inorganic white pigments include silica, silica alumina, alumina, titanium dioxide, talc, zinc oxide, and the like. Among these, it is preferable to use titanium dioxide in consideration of hiding properties.

The average particle size of such white pigments is usually 0. 1-20
0 μm, preferably in the range of 1 to 100 μm.

The above-mentioned white pigment is contained in the white paint used in the present invention in an amount of usually 10 to 90 parts by weight, preferably 30 to 70 parts by weight, based on 100 parts by weight of the resin component.

The white paint having the above composition may be of an organic solvent dispersion type or a water dispersion type.

In the present invention, there is no particular restriction on the method of forming the coating layer using the above-mentioned white paint, and examples of the forming method include:
For example, a method may be used in which a white paint as described above is applied to the surface on which the coating layer is to be formed of the resin housing, dried, and then baked if necessary.

By forming the coated layer of white paint as described above, infrared rays are less likely to be absorbed, so that the resin housing can be protected from heat caused by infrared rays.

By providing a coating layer of such white paint, infrared rays are blocked, so a resin with lower heat resistance than the resin used to form the resin housing of conventional infrared reflow electronic components can be used. It also becomes possible. Therefore, in the present invention, resins that can be used to form the resin housing include polyimide, epoxy resin, polyamideimide, polyether ether,
Resins such as polysulfone, polyetherimide, liquid crystal polymers, etc. can be used. Further, in the present invention, in addition to the resins mentioned above, resins such as aromatic polyamide and polyphenylene sulfide are preferably used.

The polyamide preferably used to form the resin housing in the present invention has specific dicarboxylic acid component units [A
] and a specific diamine component unit [B].

The specific dicarboxylic acid component unit [A] constituting the polyamide is an essential component of the terephthalic acid component unit (
Contains a). A repeating unit containing such a terephthalic acid component unit (a) can be represented by the following formula [■a].

However, in the above formula [II-a], R1 represents an alkylene group having 4 to 25 carbon atoms.

0 The specific dicarboxylic acid component units constituting the polyamide used in the present invention may contain other dicarboxylic acid component units in addition to the above-mentioned terephthalic acid component unit (B).

Such carboxylic acid component units other than terephthalic acid component include aromatic dicarboxylic acid component units other than terephthalic acid component units and aliphatic dicarboxylic acid component units.

Examples of aromatic dicarboxylic acid component units other than terephthalic acid include component units derived from isophthalic acid, phthalic acid, 2-methylterephthalic acid, naphthalene dicarboxylic acid, and the like. When the polyamide of the present invention contains an aromatic dicarboxylic acid component unit other than terephthalic acid,
As such a component unit, isophthalic acid or naphthalene dicarboxylic acid component units are preferred, and isophthalic acid component units are particularly preferred.

Among such aromatic dicarboxylic acid component units other than terephthalic acid, a repeating unit having an isophthalic acid component unit which is particularly preferred in the present invention can be represented by the linear formula [1-b].

However, in the above formula [II-b], R1 represents an alkylene group having 4 to 25 carbon atoms.

Further, the aliphatic dicarboxylic acid component unit is usually derived from an aliphatic dicarboxylic acid having 4 to 20, preferably 6 to 12 alkylene groups, although the number of carbon atoms is not particularly limited. Examples of aliphatic dicarboxylic acids used to derive such aliphatic dicarboxylic acid component units (C/) include succinic acid, adipic acid (^A), azelaic acid, sebacic acid, decanedicarboxylic acid, and undecane. Dicarboxylic acid and dodecanedicarboxylic acid can be mentioned. When the polyamide contains aliphatic dicarboxylic acid component units, adipic acid component units are particularly preferred as such component units.

A repeating unit containing such an aliphatic dicarboxylic acid component unit (C) can be represented by the following formula [111].

1 However, in the above formula [111], n is usually 4 to 2
0, preferably an integer from 6 to 12.

R1 is the same as above.

Along with the above-mentioned dicarboxylic acid component units, the diamine component units constituting the polyamide used in the present invention are:
A component unit derived from an aliphatic alkylene diamine component unit and/or an alicyclic alkylene diamine component unit, and among the aliphatic alkylene diamine component units, it is derived from an aliphatic alkylene diamine having 4 to 18 carbon atoms. Component units are preferred.

Specific examples of such aliphatic alkylene diamine units include 14-diaminobutane 1,6-diaminohexane, trimethyl-16-diaminohexane 1,7-diaminohexane, 1.8-diaminooctane, 31 .9-diaminononane, 1.10-diaminodecane, 1.11-diaminoundecane, 1.12-diaminododecane and other linear alkylene diamines, and 1.4-diamino-1,1-dimethylbutane, 1. 4-
Diamino-1-ethylbutane, 1,4-diamino-1,
2-dimethylbutane, 1.4-diamino, 3-dimethylbutane, 1.4-diamino-1,4-dimethylbutane, 1.4-diamino-2,3-dimethylbutane, 1.2
-diamino-1-butylethane, 1,6-diamino-2
, 5-dimethylhexane, 1,6-diamino-2,4-
Dimethylhexane, 1,6-diamino-3,3-dimethylhexane, 1,6-diamino-2,2-dimethylhexane, 1,6-diamino-2,2,4-trimethylhexane, 1,6-diamino- 2,4,4-trimethylhexane, 1,7-diamino-2,3-dimethylhebutane,
4 7-Diamino-2,4-dimethylhebutane, 7-diamino-25-dimethylhebutane 1,7-diamino-2,2
-dimethylhebutane, 8-diamino-1,3-dimethyloctane, 8-diamino-1,4-dimethyloctane,
8-diamino-2,4-dimethyloctane, 8-diamino-3,4-dimethyloctane, 8-diamino-4,5
-dimethyloctane, 8-diamino-2,2-dimethyloctane, 8-diamino-3,3-dimethyloctane,
Examples include component units derived from branched chain alkylene diamines such as 8-diamino-4,4-dimethyloctane, 6-diamino-2,4-diethylhexane, and 9-diamino-5-methylnonane. can.

Among such straight chain or branched chain alkylene diamine component units, straight chain alkylene diamine component units are preferred, particularly 1.6-diaminohexane, 1.8-diaminooctane, 1. 10-diaminodecane, ], ]+2-diaminododecane One or two of the linear alkylene diamines of 5
Component units derived from at least one type of compound are preferred, and 1,6-diaminohexane component units are more preferred.

The alicyclic diamine power unit usually has 6 to 2 carbon atoms.
5 and is a component unit derived from a diamine containing at least one alicyclic hydrocarbon ring.

Specifically, such alicyclic diamine component units include, for example, 13-diaminocyclohexane, 14-diaminocyclohexane, 13-bis(aminomethyl)cyclohexane, 14-bis(aminomethyl)cyclohexane, isophoronediamine, piperazine, 25-dimethylpiperazine, bis(4-aminocyclohexyl)methane, bis(4-
aminocyclohexyl)propane, 4□4'-diamino-3,3'-dimethyldicyclohexylpropane, 44'-diamino-33'-dimethyldicyclohexylmethane, 44'-diamino-33'-dimethyl-5,5' -dimethyldicyclohexylmethane, 44'-diamino-33'-dimethyl-5,5'-dimethyldicyclohexylpropane, α-α'-bis(4-aminocyclohexyl)-p-diisopropylbenzene, α-α'-bis(4 -aminocyclohexyl)-m-diisopropylbenzene, α-α′-bis(4-aminocyclohexyl)-1,4
Cyclohexane, α-α′-bis(4-aminocyclohexyl)-1,3
Examples include component units derived from alicyclic diamines such as cyclohexane.

Among these ring group diamine component units, bis(aminomethyl)cyclohexane, bis(4aminocyclohexyl)methane, and 4,4'-diamino3,3'-dimethyldicyclohexylmethane are preferred, and particularly bis(4aminocyclohexyl)methane is preferred. -aminocyclohexyl)methane, 1
Component units derived from alicyclic diamines such as 3-bis(aminocyclohexyl)methane and 1.3bis(aminomethyl)cyclohexane are preferred.

Such a polyamide has a total dicarboxylic acid component unit of 10
30 to 100 mol% of terephthalic acid component units (a) in 0 mol%; aromatic dicarboxylic acid component units other than terephthalic acid (b)
and/or aliphatic dicarboxylic acid component unit (C) in an amount of 0 to 40 mol%.

In addition, as the aromatic dicarboxylic acid component unit, the above-mentioned terephthalic acid component unit which is the main component unit, furthermore, the component unit derived from a divalent aromatic carboxylic acid other than terephthalic acid represented by the isophthalic acid component unit, and the above-mentioned component unit. In addition to the aliphatic dicarboxylic acid component units, it may contain a small amount of repeating units containing component units derived from tribasic or higher polyhydric carboxylic acids such as trimellitic acid and pyromellitic acid. The content of repeating units containing component units derived from such polyhydric carboxylic acids in the polyamide used in the present invention is usually 0 to 5 mol%.

The polyamide as described above has an intrinsic viscosity [η] of 0.5 to 3.0 dl/g%, preferably 0.5 to 2.8 617 g, as measured in concentrated sulfuric acid at a temperature of 30°C.

Particularly preferred is a range of 0.6 to 2.5 dA'/H. Moreover, the melting point of this polyamide is 280°C or higher.

When electronic parts and the like are formed using polyamide exhibiting such a melting point, molded products with excellent heat resistance and the like can be obtained.

Further, the polyamide used in the present invention has the formula [II
-a], [II-b] and [I[I], and may also be a polyamide containing repeating units represented by
A polyamide whose main repeating unit is a repeating unit represented by the above formula [II-a], a polyamide whose main repeating unit is a repeating unit represented by the above formula [■b], and a polyamide whose main repeating unit is a repeating unit represented by the above formula [■b], and a polyamide represented by the above formula [III]. It may also be a mixture of polyamides having repeating units as main repeating units.

When the polyamide used in the present invention is a mixture, among these mixtures, a polyamide whose main repeating unit is a repeating unit represented by the above formula [U-a], and a polyamide whose main repeating unit is a repeating unit represented by the above formula [n-b] and / Or a polyamide having [III] as a main repeating unit. In this case, the content of the polyamide whose main repeating unit is the repeating unit represented by the formula [I[-a] is usually 30% by weight or more.

Furthermore, in this case, a polyamide whose main repeating unit is a repeating unit represented by the above formula [n-b], and a polyamide having the above formula [m]
The blending ratio with a polyamide mixture whose main repeating unit is the repeating unit represented by is usually 0:
100-40: 60 preferably O: 100-30
:70.

Such polyamides exhibit much higher melting points (Tm) than conventionally used polyamides. That is, such polyamides have a melting point of 0280-340°C, preferably 300-330°C, and typically have a higher melting point in the range of 35-65°C than conventional polyamides such as 6-row nylon. As described above, since the polyamide used in the present invention has a high glass transition temperature, it can be used as a resin housing for electronic components for infrared reflow.

Furthermore, because the polyamide used in the present invention has a specific structure, it not only inherently has a high flexural modulus at high temperatures, but also has low water absorption, which has been a problem with conventional polyamides. .

Furthermore, since the polyamide used in the present invention has a high melting point, the rate of dimensional change due to temperature change in a high temperature region is small.

Table 1 shows an example of the coefficient of thermal expansion of the polyamide used in the present invention. Note that the polyamide used here contains glass fiber.

Table 1 shows the coefficient of linear expansion of nylon 66 measured under the same conditions.

As described above, the polyamide used in the present invention has a smaller variation in linear expansion coefficient in the high temperature range than conventional polyamides.

Therefore, a resin housing made of such polyamide is less likely to be thermally deformed during infrared reflow.

Such polyamide (or polyamide group 1 2 can be manufactured using conventional techniques.

Further, polyphenylene sulfide preferably used to form the resin housing in the present invention is a heat-resistant thermoplastic resin substantially composed of repeating units represented by the following formula.

Such polyphenyl sulfide can be obtained, for example, by reacting p-dichlorobenzene and sodium sulfide.

Since the resin itself of such polyphenylsulfide is blackish brown, when a resin housing is formed from this resin, it easily absorbs infrared rays. However, by forming a coating layer of white paint as described above, the infrared reflow temperature can be set high.

In the electronic component of the present invention, as the resin used to form the resin housing, one, three, or two or more types are selected from among the heat-resistant resins including aromatic polyamide and polyphenylene sulfide as described above. can be used.

In the present invention, the resin composition used to form the resin housing preferably contains an inorganic filler and/or an organic filler in addition to the resin components described above. Among such fillers, it is particularly preferable to use fibrous fillers made of inorganic substances.

Suitable examples of such fibrous fillers include glass fibers, carbon fibers, and boron fibers. Particularly in the present invention, it is preferable to use glass fiber. By using glass fiber, mechanical properties such as tensile strength, bending strength, and flexural modulus of the resin housing, and heat resistance properties such as heat distortion temperature are improved.

The average length of the glass fibers mentioned above is usually 0.1 to 2
0 mm, preferably in the range of 0.3 to 6+ nm, and the aspect ratio is usually 10 to 2000, preferably 30
~600. By using glass fibers having an average length and aspect ratio within these ranges, the moldability of the polyamide composition 4 is improved, and the heat resistance properties such as heat distortion temperature of the resin housing obtained from this polyamide composition are improved. , mechanical properties such as tensile strength and bending strength are improved.

Glass fiber is usually used in an amount of 2 parts by weight per 100 parts by weight of the resin component.
00 parts by weight or less, preferably in an amount of 5 to 180 parts by weight, more preferably in an amount of 5 to 150 parts by weight.

Furthermore, in the present invention, organic or inorganic fillers can be blended in addition to the above-mentioned fibrous fillers.

As such a filler, a powder, granule, plate, needle, cross, or matte filler can be used. Examples of such fillers include silica, silica alumina, alumina, titanium dioxide, talc, diatomaceous earth,
Powdered or plate-like inorganic compounds such as clay kaolin, glass, mica, ceracola, red iron oxide, zinc oxide, aluminum, copper, and stainless steel, polyparaphenylene terephthalamide, polymetaphenylene terephthalamide, polyparaphenylene isophthalamide, polymeth Phenylene isophthalamide, diaminodiphenyl ether and terephthalic acid (
or isophthalic acid), fully aromatic polyamides such as condensates of para(meth)aminobenzoic acid, fully aromatic polyamideimides such as condensates of diaminodiphenyl ether and trimellitic anhydride or pyromellitic anhydride, Secondary processing of powder, plate, fibrous, or cross-shaped materials made of fully aromatic polyimide, fully aromatic polyester, polybenzimidazole, heterocyclic compounds such as polyimidazophenanthroline, and polytetrafluoroethylene. You can list items, etc.

These fillers can also be used in combination of two or more types. Moreover, these fillers can also be used after being treated with a silane coupling agent, a titanium coupling agent, or the like.

Among such fillers other than fibrous fillers, for example, as powder fillers, it is preferable to use fillers having an average particle diameter within the range of 0.1 to 200 μm.

The filler other than the fibrous filler is used in an amount of 0 to 200 parts by weight, preferably 15 to 150 parts by weight, based on 100 parts by weight of the resin component.

In addition to the above-mentioned fillers, the present invention also uses antioxidants, ultraviolet absorbers, photoprotectants, heat stabilizers, phosphite stabilizers, peroxide decomposers, basic auxiliaries, and nucleating agents. , a plasticizer, a lubricant, an antistatic agent, a flame retardant, a pigment, a dye, etc.

The filler and the like can be mixed with the resin component by a method such as blending and kneading the filler while maintaining the resin component in a molten state. At this time, common cross-talk devices such as extruders, kneaders, etc. can be used.

A resin housing can be manufactured by using the composition prepared as described above and using a usual melt molding method, such as a compression molding method, an injection molding method, or an extrusion molding method.

Fixing to a printed wiring board by infrared reflow using the electronic component of the present invention is carried out as follows. First, dots of solder are placed on the electronic component stator window portion of the wiring formed on the printed wiring board, and then the electronic component of the present invention is temporarily fixed to the board using an adhesive.

At this time, make sure that the terminal to be fixed comes into contact with the solder placed in dots. The board on which the electronic components have been temporarily fixed as described above is placed in an infrared reflow oven, and the surface of the board on which the electronic components are temporarily fixed is irradiated with infrared rays to melt the solder and connect the wiring on the board and the terminals of the electronic components. solder.

When soldering the electronic components of the present invention using the infrared reflow method as described above, the temperature of the reflow oven is usually set to about 40°C higher than that of conventionally used black electronic components. I can do it.

Effects of the Invention In the electronic component according to the present invention, a coating layer of white paint is formed on the surface that is directly irradiated with infrared rays, so infrared rays are blocked by this coating layer, so the temperature in the infrared reflow oven can be set high. can do.

8. Therefore, by using the electronic component of the present invention, the electronic component can be satisfactorily fixed onto the printed wiring board by employing an infrared reflow method.

Next, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these examples in any way as long as they do not go beyond the gist of the invention.

Example 1 Granulation method Ordinary vented twin-screw granulator (PCM45 manufactured by Ikegu Iron Works)
Using a hopper, 60 parts by weight of a polyamide resin having the composition shown below was charged, and 40 parts by weight of glass fibers (chopped strands with a diameter of 13 μm and a length of BIIIm) were charged from a side feeder, and then the resin and glass fibers were added. Carbon black was added in an amount of 0.3% by weight based on the total weight of the sample, and the cylinder temperature was set at 340°C for granulation.

This polyamide contains 35 mole parts of terephthalic acid component units as dicarboxylic acid component units, and 1 part of aromatic dicarboxylic acid component units other than terephthalic acid component units (isophthalic acid component units).
5 molar parts, and 50 molar parts of hexamethylene diamine as a cy9amine component unit.

Further, the intrinsic viscosity (measured in concentrated sulfuric acid at 30°C) of this polyamide is 1.1 dl/g, the glass transition temperature is 125°C, and the melting point is 320°C.

The obtained granules were molded using an injection molding machine (Promat 40/25A type manufactured by Sumira Heavy Industries, Ltd.) at a cylinder temperature of 330°C.
, 0.8X6 by injection molding at a mold temperature of 120℃.
．． A strip-shaped test piece of 4×64+nm was prepared.

A test piece was prepared by applying a white paint (containing urethane resin, titanium dioxide content relative to the resin: 40% by weight) on the surface of the strip-shaped test piece prepared as described above, and then drying it. The thickness of the white paint coating layer on the obtained test piece was 40 μm.

Test method [Infrared reflow test] Infrared reflow equipment (Jard, reflow oven: M
J-R4000 type), and the peak temperature was set to 2000℃, 220℃, 240℃, 260℃, 280℃
, 300°C, and 320°C, and the peak temperature passing time was set to 20 seconds, and the strip-shaped test piece coated with a coating layer of the white paint produced as described above was placed in this infrared reflow oven. I let it pass inside.

The appearance of the test piece after passing through the infrared reflow oven as described above was observed, and the presence or absence of melting, blistering, and deformation was visually determined. Table 3 shows cases where there was no change in appearance.
”, and cases where there was a change are indicated with an “×”.

Comparative Example 1 A test piece was produced in the same manner as in Example 1, except that the strip-shaped test piece was not coated with a white paint layer.

Table 2 shows changes in the appearance of the obtained test pieces after passing through an infrared reflow oven.

Example 2 A strip was made in the same manner as in Example 1, except that glass fiber-containing polyphenylene sulfide (manufactured by Philips, trade name: Lactone 1 R4, glass fiber content 40% by weight) was used instead of polyamide and glass fiber. A mold specimen was prepared.

Further, in the same manner as in Example 1, this strip-shaped test piece was coated with white paint to prepare a test piece coated with a coated layer of white paint.

Table 2 shows changes in the appearance of the obtained test pieces after passing through an infrared reflow oven.

Comparative Example 2 A test piece was produced in the same manner as in Example 2, except that the strip-shaped test piece was not coated with a layer of white paint.

Table 2 shows changes in the appearance of the obtained test pieces after passing through an infrared reflow oven.

Example 3 A strip-shaped test piece was prepared in the same manner as in Example 1, except that the polyamide and glass fiber were changed as follows.

Further, in the same manner as in Example 1, this strip-shaped test piece was coated with white paint to prepare a test piece coated with a coated layer of white paint.

2 Table 2 shows the change in appearance of the obtained test piece after passing through an infrared reflow oven.

Polyamide 60 parts by weight Dicarboxylic acid component unit Terephthalic acid component unit 27.5 mol parts Adipic acid component unit as side aliphatic dicarboxylic component unit 22.5 mol part Hexamethylene diamine as diamine component unit 50 mol part Intrinsic viscosity of polyamide [η ] (Measured in concentrated sulfuric acid at 30°C>
1.16dl/g〃 Glass transition temperature
82°C Melting point 31
6°C glass fiber 40 parts by weight 3 ″31I-

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view schematically showing an example of the electronic component of the present invention. 1.1'...Chip, 2...Resin housing, 3.
3'...terminal, 4...white paint coating layer, 5.5'
...side, 6...bottom.

Claims (4)

[Claims] (1) An electronic component for infrared reflow having a resin housing, characterized in that a coating layer of white paint is provided on at least the surface of the resin housing that is irradiated with infrared rays. (2) The resin housing is made of 30 to 100 mol% of terephthalic acid component units, 0 to 40 mol% of aromatic dicarboxylic acid component units other than terephthalic acid, and/or 0 to 70 mol% of aliphatic dicarboxylic acid component units. consisting of dicarboxylic acid component units (however, the total of all dicarboxylic acid component units is 100 mol%), and repeating units consisting of aliphatic alkylene diamine component units and/or alicyclic alkylene diamine component units, and , the intrinsic viscosity measured in concentrated sulfuric acid at 30°C is 0.5 to 3.
．． 2. The electronic component according to claim 1, wherein the electronic component is made of a resin composition containing a polyamide having a melting point of 0 dl/g and a melting point of 280° C. or higher. (3) The electronic component according to claim 2, wherein the resin composition contains glass fiber. (4) The electronic component according to claim 1, wherein the white paint is a urethane-based or epoxy-based white paint.