JPH037244U - - Google Patents
Info
- Publication number
- JPH037244U JPH037244U JP6699889U JP6699889U JPH037244U JP H037244 U JPH037244 U JP H037244U JP 6699889 U JP6699889 U JP 6699889U JP 6699889 U JP6699889 U JP 6699889U JP H037244 U JPH037244 U JP H037244U
- Authority
- JP
- Japan
- Prior art keywords
- piece
- movable iron
- iron piece
- contact
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electromagnets (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6699889U JPH037244U (sl) | 1989-06-08 | 1989-06-08 | |
| US07/528,889 US5070315A (en) | 1989-05-26 | 1990-05-29 | Electromagnetic relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6699889U JPH037244U (sl) | 1989-06-08 | 1989-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH037244U true JPH037244U (sl) | 1991-01-24 |
Family
ID=31600186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6699889U Pending JPH037244U (sl) | 1989-05-26 | 1989-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH037244U (sl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007138843A1 (ja) | 2006-05-31 | 2007-12-06 | Nec Corporation | 回路基板装置、配線基板間接続方法及び回路基板モジュール装置 |
-
1989
- 1989-06-08 JP JP6699889U patent/JPH037244U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007138843A1 (ja) | 2006-05-31 | 2007-12-06 | Nec Corporation | 回路基板装置、配線基板間接続方法及び回路基板モジュール装置 |