JPH0372145B2 - - Google Patents

Info

Publication number

JPH0372145B2

JPH0372145B2 JP15486584A JP15486584A JPH0372145B2 JP H0372145 B2 JPH0372145 B2 JP H0372145B2 JP 15486584 A JP15486584 A JP 15486584A JP 15486584 A JP15486584 A JP 15486584A JP H0372145 B2 JPH0372145 B2 JP H0372145B2

Authority

JP

Japan

Prior art keywords

silver

brazing

copper

annealing

decorative items

Prior art date

1984-07-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
• 229910052709 silver Inorganic materials 0.000 claims description 19
• 239000004332 silver Substances 0.000 claims description 19
• 239000000463 material Substances 0.000 claims description 18
• QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 5
• 239000005751 Copper oxide Substances 0.000 claims description 5
• 229910000431 copper oxide Inorganic materials 0.000 claims description 5
• 229910003437 indium oxide Inorganic materials 0.000 claims description 4
• PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 4
• 238000005219 brazing Methods 0.000 description 20
• 238000010438 heat treatment Methods 0.000 description 11
• 238000000137 annealing Methods 0.000 description 9
• NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 6
• 239000013078 crystal Substances 0.000 description 6
• 229910000881 Cu alloy Inorganic materials 0.000 description 4
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
• 229910045601 alloy Inorganic materials 0.000 description 3
• 239000000956 alloy Substances 0.000 description 3
• 229910052802 copper Inorganic materials 0.000 description 3
• 239000010949 copper Substances 0.000 description 3
• 230000007547 defect Effects 0.000 description 3
• 230000000694 effects Effects 0.000 description 3
• 239000000203 mixture Substances 0.000 description 3
• 238000004040 coloring Methods 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 230000003678 scratch resistant effect Effects 0.000 description 2
• 239000003795 chemical substances by application Substances 0.000 description 1
• 229910052738 indium Inorganic materials 0.000 description 1
• APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
• 238000005554 pickling Methods 0.000 description 1
• 238000004663 powder metallurgy Methods 0.000 description 1
• 238000007670 refining Methods 0.000 description 1
• 239000000126 substance Substances 0.000 description 1
• 238000011282 treatment Methods 0.000 description 1