JPH0370375U - - Google Patents
Info
- Publication number
- JPH0370375U JPH0370375U JP13045789U JP13045789U JPH0370375U JP H0370375 U JPH0370375 U JP H0370375U JP 13045789 U JP13045789 U JP 13045789U JP 13045789 U JP13045789 U JP 13045789U JP H0370375 U JPH0370375 U JP H0370375U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- dielectric substrate
- metallized layers
- dielectric resonators
- resonators
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
Landscapes
- Measurement Of Resistance Or Impedance (AREA)
Description
第１図はこの考案の一実施例を示す断面図解図
および電界強度分布図である。
図において、１０は誘電体基板の測定装置、１
２は第１の誘電体共振器、１４は第２の誘電体共
振器、１６は誘電体基板、１８は第１のメタライ
ズ層、２０は第２のメタライズ層、２２，２４は
対向面、２６，２８はコネクタを示す。
FIG. 1 is an illustrative cross-sectional view and an electric field strength distribution diagram showing an embodiment of this invention. In the figure, 10 is a dielectric substrate measuring device;
2 is a first dielectric resonator, 14 is a second dielectric resonator, 16 is a dielectric substrate, 18 is a first metallized layer, 20 is a second metallized layer, 22 and 24 are opposing surfaces, 26 , 28 indicate connectors.
Claims (1)
置される第１および第２の誘電体共振器、 前記第１および第２の誘電体共振器の前記誘電
体基板との対向面を除いた外表面にそれぞれ形成
される第１および第２のメタライズ層、および 前記第１および第２のメタライズ層の少なくと
も一方に前記第１および第２の誘電体共振器を励
振するように取り付けられる２つの結合端子を備
える、誘電体基板の測定装置。[Claims for Utility Model Registration] First and second dielectric resonators disposed on the upper and lower surfaces of a dielectric substrate, respectively; the dielectric substrate of the first and second dielectric resonators; first and second metallized layers formed on outer surfaces other than opposing surfaces, respectively; and exciting the first and second dielectric resonators in at least one of the first and second metallized layers. A measuring device for a dielectric substrate, comprising two coupling terminals attached as shown in FIG.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13045789U JPH0370375U (en) | 1989-11-08 | 1989-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13045789U JPH0370375U (en) | 1989-11-08 | 1989-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0370375U true JPH0370375U (en) | 1991-07-15 |
Family
ID=31678037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13045789U Pending JPH0370375U (en) | 1989-11-08 | 1989-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0370375U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011232152A (en) * | 2010-04-27 | 2011-11-17 | Kyocera Corp | Thickness measuring method |
-
1989
- 1989-11-08 JP JP13045789U patent/JPH0370375U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011232152A (en) * | 2010-04-27 | 2011-11-17 | Kyocera Corp | Thickness measuring method |