JPH0370187A - Reflection-type light-emitting diode - Google Patents

Reflection-type light-emitting diode

Info

Publication number
JPH0370187A
JPH0370187A JP1206538A JP20653889A JPH0370187A JP H0370187 A JPH0370187 A JP H0370187A JP 1206538 A JP1206538 A JP 1206538A JP 20653889 A JP20653889 A JP 20653889A JP H0370187 A JPH0370187 A JP H0370187A
Authority
JP
Japan
Prior art keywords
light
emitting element
reflective
emitted
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1206538A
Other languages
Japanese (ja)
Inventor
Yoshinobu Suehiro
好伸 末広
Shigeru Yamazaki
繁 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwasaki Denki KK
Original Assignee
Iwasaki Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwasaki Denki KK filed Critical Iwasaki Denki KK
Priority to JP1206538A priority Critical patent/JPH0370187A/en
Publication of JPH0370187A publication Critical patent/JPH0370187A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To obtain a reflection-type LED with a large contrast when turning on and off light by using a material for enabling light of wavelength emitted by a light-emitting element to be transmitted selectively as a light-transmission material. CONSTITUTION:A light-emitting element 1, lead frames 2 and 3, and a wire 4 are sealed by a light-transmission material 5 for enabling light emitted by the light-emitting element 1 to be transmitted selectively. If for example the light-emitting element 1 is made of GaAlAs and has a peak at a light-emitting wavelength of 660nm, most of the wavelength emitted by the light-emitting element 1 is within + or -20-30nm for a peak value of 660nm. Thus, when the light- transmission material 5 for enabling light with a wavelength above 600nm to be transmitted selectively is used, light of 660nm + or -20-30nm wavelength emitted by the light-emitting element 1 is not absorbed by the light-transmission material 5 but is reflected by a reflection surface 6 and is radiated to the outside.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、発光素子が発した光を、−度反射面によって
反射した後に外部に放射する反射型発光ダイオード(以
下反射型LEDとも称する。)に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a reflective light emitting diode (hereinafter also referred to as a reflective LED) that emits light to the outside after reflecting the light emitted by a light emitting element by a -degree reflective surface. ).

〔従来の技術〕[Conventional technology]

従来より、発光ダイオードの発光素子が発する光を有効
に荊方に放射するため、種々の構造の発光ダイオードが
案出されている。第4図は従来の反射型LEDの概略断
面図及びその発光素子が発する光の光路図、第5図は従
来の反射型LEDの概略断面図及びその反射型LEDに
入射する外光の光路図、第6図は反射型LEDの概略正
面図である。第4図乃至第6図において、51は発光素
子、52.53はリードフレーム、54はワイヤ、55
は光透過性材料、56は光透過性材料55の下面に形成
された凹面状の反射面である。
Conventionally, light emitting diodes with various structures have been devised in order to effectively radiate light emitted from a light emitting element of the light emitting diode in a direction. Figure 4 is a schematic cross-sectional view of a conventional reflective LED and an optical path diagram of light emitted by its light emitting element, and Figure 5 is a schematic cross-sectional diagram of a conventional reflective LED and an optical path diagram of external light incident on the reflective LED. , FIG. 6 is a schematic front view of the reflective LED. 4 to 6, 51 is a light emitting element, 52 and 53 are lead frames, 54 are wires, and 55
is a light-transmitting material, and 56 is a concave reflective surface formed on the lower surface of the light-transmitting material 55.

発光素子51は一方のリードフレーム52上にマウント
され、他方のリードフレーム53とはワイヤ54により
電気的に接続されている。また、発光素子51、リード
フレーム52.53の先端部及びワイヤ54は光透過性
材料55により封止され、その光透過性材料55の下面
には凹面状の反射面56が形成されている。反射面56
は、光透過性材料55の下面を金属蒸着や鍍金等により
鏡面加工したものである。一方、光透過性材料55の上
面55aは平面状に形成された放射面である。
The light emitting element 51 is mounted on one lead frame 52 and electrically connected to the other lead frame 53 by a wire 54. Further, the light emitting element 51, the tips of the lead frames 52 and 53, and the wire 54 are sealed with a light-transmitting material 55, and a concave reflective surface 56 is formed on the lower surface of the light-transmitting material 55. Reflective surface 56
The lower surface of the light-transmitting material 55 is mirror-finished by metal vapor deposition, plating, or the like. On the other hand, the upper surface 55a of the light-transmitting material 55 is a planar radiation surface.

第4図において、発光素子51が発する光は、矢印で示
すように反射面5Gによって反射され、放射面55aか
ら外部に放射される。このように、発光素子51が発す
る光を一度凹面状の反射面56で反射した後に外部に放
射することにより、発光素子51が発した光を有効に前
面方向に放射することができる。
In FIG. 4, the light emitted by the light emitting element 51 is reflected by the reflecting surface 5G as indicated by the arrow, and is emitted to the outside from the emitting surface 55a. In this way, by reflecting the light emitted by the light emitting element 51 once on the concave reflecting surface 56 and then emitting it to the outside, the light emitted by the light emitting element 51 can be effectively emitted toward the front.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、従来の反射型LEDは光透過性材料55とし
て無色透明の樹脂を用いている。このため、反射型LE
Dに入射した外光は、第5図に示すように、反射面56
で反射され、再び外部へ放射される。ここで、反射型L
EDが正面方向への指向性の強いものであれば、その反
射型LEDを正面から見た場合には、第6図(a)に示
すように、発光素子1の像(同図のハンチング部)が反
射面56全体に映り、外光の反射面56による反射の影
響はない、すなわち、発光素子1が外光の大部分を吸収
する。
By the way, a conventional reflective LED uses a colorless and transparent resin as the light-transmitting material 55. For this reason, reflective LE
As shown in FIG. 5, the external light incident on D
is reflected and radiated to the outside again. Here, reflective type L
If the ED has strong directivity in the front direction, when the reflective LED is viewed from the front, the image of the light emitting element 1 (the hunting part in the same figure) will appear as shown in FIG. 6(a). ) is reflected on the entire reflective surface 56, and there is no effect of reflection of external light by the reflective surface 56. In other words, the light emitting element 1 absorbs most of the external light.

これに対し、反射型LEDが正面への指向性の弱いもの
であるときには、指向性が弱くなるにつれて、同図(b
)、  (C)に示すように反射面56に映る発光素子
1の像が小さくなり、外光の反射面56による反射の影
響が大きくなる。また、反射型LEDを、発光素子1が
発する光の放射方向以外の方向から見ると、反射面56
には発光素子1の像が映らなくなり、外光の反射面56
による反射の影響が大きくなる。
On the other hand, when the reflective LED has weak directivity toward the front, as the directivity becomes weaker, the
) and (C), the image of the light emitting element 1 reflected on the reflective surface 56 becomes smaller, and the influence of reflection of external light by the reflective surface 56 becomes larger. Furthermore, when the reflective LED is viewed from a direction other than the radiation direction of light emitted by the light emitting element 1, the reflective surface 56
The image of the light emitting element 1 is no longer reflected on the external light reflecting surface 56.
The influence of reflections caused by

また、視認角を広げるべく、第7図に示すように、放射
方向を変えて複数の反射型LEDを配置した場合、反射
型LEDloaについては同図のAで示す範囲が外光の
影響を大きく受け、同様に反射型LHDlobについて
はBの範囲、反射型LEDIOCについてはCの範囲が
外光の影響を大きく受ける。したがって、複数の反射型
LEDを配置した場合、視認角範囲X内においても、外
光の影響を強く受けることになる。
In addition, in order to widen the viewing angle, as shown in Figure 7, if multiple reflective LEDs are arranged with different radiation directions, the area indicated by A in the figure will be greatly affected by external light for the reflective LED loa. Similarly, the range B for the reflective LHDlob and the range C for the reflective LEDIOC are greatly affected by external light. Therefore, when a plurality of reflective LEDs are arranged, even within the viewing angle range X, they will be strongly influenced by external light.

このように、従来の反射型LEDは、特に外光の強い日
中の屋外などでデイスプレィ用として使用する場合、反
射面56によって外光が反射されるので、消灯時でも完
全な暗状態にはならず、点灯時と消灯時のコントラスト
が小さく、見にくいという問題点があった。
In this way, when conventional reflective LEDs are used for display purposes, especially outdoors during the daytime when outside light is strong, the outside light is reflected by the reflective surface 56, so even when the lights are turned off, they cannot be completely dark. However, there was a problem in that the contrast between the lights on and off was small, making it difficult to see.

本発明は、上記事情に基づいてなされたものであり、点
灯時と消灯時のコントラストが大きな反射型LEDを提
供することを目的とするものである。
The present invention has been made based on the above-mentioned circumstances, and an object of the present invention is to provide a reflective LED with a large contrast between when turned on and when turned off.

〔課題を解決するための手段〕[Means to solve the problem]

上記の目的を達成するための本発明は、発光素子と、該
発光素子に電力を供給するリード部と、前記発光素子の
発光面側と対向して設けられた反射面と、前記発光素子
を封止する光透過性材料とを有し、前記発光素子が発す
る光を前記反射面で反射した後に外部に放射する反射型
LEDにおいて、 前記光透過性材料は、前記発光素子が発する波長の光を
選択的に透過させる材料であることを特徴とするもので
ある。
To achieve the above object, the present invention includes a light emitting element, a lead portion for supplying power to the light emitting element, a reflecting surface provided opposite to a light emitting surface side of the light emitting element, and a light emitting element. In the reflective LED, the light transmitting material has a sealing light transmitting material, and the light emitted by the light emitting element is reflected by the reflecting surface and then emitted to the outside. It is characterized by being a material that selectively transmits.

また、前記光透過性材料によって、前記発光素子と前記
リード部の一部とを封止すると共に、前記発光素子と前
記反射面との空間を埋めてもよい。
Further, the light-transmitting material may seal the light-emitting element and a part of the lead part, and may also fill a space between the light-emitting element and the reflective surface.

〔作用〕[Effect]

本発明は前記の構成により、光透過性材料は発光素子が
発する波長の光を選択的に透過させるので、発光素子が
発する光を放射効率を下げることなく外部へ放射するこ
とができ、しかも従来の反射型LEDでは反射型LED
に入射する外光の全ての波長の光が反射されて外部に放
射されるのに対して、本発明では光透過性材料が特定の
波長以外の光を吸収して透過させないので、反射型LE
Dに入射する外光のうち、反射面によって反射されて外
部に放射される光は、極めて少量である。
According to the above-described structure, the light-transmitting material selectively transmits the light of the wavelength emitted by the light-emitting element, so that the light emitted by the light-emitting element can be radiated to the outside without reducing the radiation efficiency. Reflective LED
While all wavelengths of external light incident on the LED are reflected and radiated to the outside, in the present invention, the light-transmitting material absorbs light other than a specific wavelength and does not transmit it.
Of the external light incident on D, the amount of light reflected by the reflective surface and radiated to the outside is extremely small.

このため、点灯時と消灯時のコントラストを大きくする
ことができる。
Therefore, the contrast between when the light is turned on and when the light is turned off can be increased.

また、光透過性材料によって、発光素子とリード部の一
部とを封止すると共に、発光素子と反射面との空間を埋
めることにより、光の取出効率の向上を図ることができ
る。
Further, by sealing the light emitting element and a part of the lead part with a light-transmitting material and filling the space between the light emitting element and the reflective surface, it is possible to improve the light extraction efficiency.

〔実施例〕〔Example〕

以下に本発明の実施例を第1図乃至第3図を参照して説
明する。第1図は本発明の1実施例である反射型LIE
Dの概略断面図及びその発光素子が発する光の光路図、
第2図はその反射型LEDの概略正面図、第3図は本発
明の1実施例の反射型LEDの概略断面図及び外光の光
路図である。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 3. Figure 1 shows a reflective LIE that is an embodiment of the present invention.
A schematic cross-sectional view of D and an optical path diagram of light emitted by the light emitting element,
FIG. 2 is a schematic front view of the reflective LED, and FIG. 3 is a schematic sectional view of the reflective LED according to an embodiment of the present invention and an optical path diagram of external light.

第1図乃至第3図において、1は発光素子、23はリー
ドフレーム、4はワイヤ、5は光透過性材料、6は光透
過性材料5の下面に形成された凹面状の反射面である。
1 to 3, 1 is a light emitting element, 23 is a lead frame, 4 is a wire, 5 is a light-transmitting material, and 6 is a concave reflective surface formed on the lower surface of the light-transmitting material 5. .

発光素子1は一方のリードフレーム2にマウントされ、
他方のリードフレーム3とはワイヤ4により電気的に接
続されている。また発光素子1、リードフレーム2.3
及びワイヤ4は、発光素子1の発する光を選択的に透過
させる光透過性材料5により封止される。反射面6は光
透過性材料5の下面を凸面状に形成し、その下面を金属
蒸着や鍍金等により鏡面加工したものである。尚、反射
面6は、たとえば回転放物面状又は回転楕円面状に形成
され、発光素子1はその焦点に配置されている。また、
光透過性材料5の上面は外部に光を放射する放射面5a
である。
The light emitting element 1 is mounted on one lead frame 2,
It is electrically connected to the other lead frame 3 by a wire 4. Also, light emitting element 1, lead frame 2.3
The wire 4 is sealed with a light-transmitting material 5 that selectively transmits light emitted from the light-emitting element 1. The reflective surface 6 is formed by forming the lower surface of the light-transmitting material 5 into a convex shape, and mirror-finishing the lower surface by metal vapor deposition, plating, or the like. Note that the reflective surface 6 is formed, for example, in the shape of a paraboloid of revolution or an ellipsoid of revolution, and the light emitting element 1 is disposed at its focal point. Also,
The upper surface of the light-transmitting material 5 is a radiation surface 5a that emits light to the outside.
It is.

第1図において、発光素子1が発する光は、矢印で示す
ように反射面6によって反射され、放射面5aから外部
へ放射される。
In FIG. 1, the light emitted by the light emitting element 1 is reflected by the reflective surface 6 as shown by the arrow, and is radiated to the outside from the radiation surface 5a.

今、たとえば発光素子1がGaAlAs系で660 n
sに発光波長のピークを持つものである場合、発光素子
1が発する光の波長の大半はピーク値660n麟に対し
て±20〜30n−の範囲内である。したがって、この
場合に、光i3過性材料5として、600nm以上の波
長の光を選択的に透過させるもの使用すれば、発光素子
1が発する6 60 nm±20〜30nmの波長の光
は、光透過性材料5によって吸収されることなく、反射
面6によって反射されてすべて外部へ放射される。これ
に対して、第3図の点線で示すように反射型LEDに入
射した外光は、600nw以下の波長の光が光透過性材
料5によって吸収され、残りの光のみが反射面6によっ
て反射されて外部に放射されるので、反射型LEDに入
射した外光のうち外部に放射される光は1割以下となる
Now, for example, the light emitting element 1 is made of GaAlAs and has 660 n
When the light emitting element 1 has a peak emission wavelength at s, most of the wavelengths of the light emitted by the light emitting element 1 are within the range of ±20 to 30n with respect to the peak value of 660n. Therefore, in this case, if a material that selectively transmits light with a wavelength of 600 nm or more is used as the optical i3-transmissive material 5, the light with a wavelength of 660 nm±20 to 30 nm emitted by the light emitting element 1 will be The light is not absorbed by the transparent material 5, but is reflected by the reflective surface 6 and is all emitted to the outside. On the other hand, as shown by the dotted line in FIG. 3, when external light enters the reflective LED, light with a wavelength of 600 nw or less is absorbed by the light-transmitting material 5, and only the remaining light is reflected by the reflective surface 6. Therefore, less than 10% of the external light incident on the reflective LED is radiated to the outside.

上記の構成によれば、光透過性材料5は、発光素子1の
発する波長の光を選択的に透過させるので、発光素子l
が発した光の外部への放射効率を下げることなく、外光
の反射量を抑えることができ、この結果点灯時と消灯時
のコントラストを大きくできる。
According to the above configuration, the light-transmitting material 5 selectively transmits light of the wavelength emitted by the light-emitting element 1, so that the light-emitting element l
It is possible to suppress the amount of external light reflected without lowering the radiation efficiency of the light emitted to the outside, and as a result, the contrast between when the light is on and when the light is off can be increased.

尚、上記の実施例では、反射型LEDを単品で使用した
場合について説明したが、反射型LEDは複数個をケー
ス等に組み込んだものでもよい。
In the above embodiment, a case where a single reflective LED is used has been described, but a plurality of reflective LEDs may be assembled in a case or the like.

この際、発光色の異なる反射型LEDを組み合わせても
よい。
At this time, reflective LEDs emitting light of different colors may be combined.

更に、複数個の反射型LEDを使用する場合、視認角を
広げるべく、各反射型LEDの放射方向を変えて配置し
てもよく、この場合でも外光の反射面による反射の影響
を極めて小さく抑えることができる。
Furthermore, when using multiple reflective LEDs, the radiation direction of each reflective LED may be changed and arranged in order to widen the viewing angle. Even in this case, the influence of reflection of external light from the reflective surface can be minimized. It can be suppressed.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、光透過性材料は発
光素子が発する波長の光を選択的に透過させるので、発
光素子が発した光の外部への放射効率を下げることなく
外光の反射量を抑え、点灯時と消灯時のコントラストを
大きくすることができ、看者にとって見易い反射型L4
Dを提供することができる。
As explained above, according to the present invention, the light-transmitting material selectively transmits the light of the wavelength emitted by the light-emitting element, so that external light can be transmitted without reducing the radiation efficiency of the light emitted by the light-emitting element to the outside. Reflective type L4 that suppresses the amount of reflection and increases the contrast between when the light is on and when the light is off, making it easier for viewers to see.
D can be provided.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の1実施例である反射型LEDの概略断
面図及びその発光素子が発する光の光路図、第2図はそ
の反射型LEDの概略正面図、第3図は本発明の1実施
例の反射型LEDの概略断面図及び外光の光路図、第4
図は従来の反射型LEDの概略断面図及びその発光素子
が発する光の光路図、第5図は従来の反射型LEDの概
略断面図及びその反射型LEDに入射する外光の光路ム
第6図はその反射型LEDの概略正面図、第7図は従来
の反射型LEDを複数個配置したときの概略断面図であ
る。 1・・・発光素子、2.3・・・リードフレーム、4・
・・ワイヤ、5・・・光透過性材料、5a・・・放射面
、6・・・反射面。
FIG. 1 is a schematic cross-sectional view of a reflective LED according to an embodiment of the present invention and an optical path diagram of light emitted by its light emitting element. FIG. 2 is a schematic front view of the reflective LED. Schematic sectional view of reflective LED of Example 1 and optical path diagram of external light, 4th
5 is a schematic sectional view of a conventional reflective LED and an optical path diagram of light emitted from its light emitting element. FIG. 5 is a schematic sectional diagram of a conventional reflective LED and an optical path diagram of external light incident on the reflective LED. The figure is a schematic front view of the reflective LED, and FIG. 7 is a schematic cross-sectional view when a plurality of conventional reflective LEDs are arranged. 1... Light emitting element, 2.3... Lead frame, 4...
... Wire, 5... Light-transmitting material, 5a... Emitting surface, 6... Reflecting surface.

Claims (2)

【特許請求の範囲】[Claims] (1)発光素子と、該発光素子に電力を供給するリード
部と、前記発光素子の発光面に対向して設けられた反射
面と、前記発光素子を封止する光透過性材料とを有し、
前記発光素子が発する光を前記反射面で反射した後に外
部に放射する反射型発光ダイオードにおいて、 前記光透過性材料は、前記発光素子が発する波長の光を
選択的に透過させる材料であることを特徴とする反射型
発光ダイオード。
(1) It has a light-emitting element, a lead portion that supplies power to the light-emitting element, a reflective surface provided opposite to the light-emitting surface of the light-emitting element, and a light-transmitting material that seals the light-emitting element. death,
In a reflective light emitting diode that emits light to the outside after reflecting the light emitted by the light emitting element on the reflective surface, the light transmitting material is a material that selectively transmits light having a wavelength emitted by the light emitting element. Features a reflective light emitting diode.
(2)前記光透過性材料によって、前記発光素子と前記
リード部の一部とが封止されると共に、前記発光素子と
前記反射面との空間が埋められている請求項1記載の反
射型発光ダイオード。
(2) The reflective type according to claim 1, wherein the light-transmitting material seals the light-emitting element and a part of the lead part, and fills a space between the light-emitting element and the reflective surface. light emitting diode.
JP1206538A 1989-08-09 1989-08-09 Reflection-type light-emitting diode Pending JPH0370187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1206538A JPH0370187A (en) 1989-08-09 1989-08-09 Reflection-type light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1206538A JPH0370187A (en) 1989-08-09 1989-08-09 Reflection-type light-emitting diode

Publications (1)

Publication Number Publication Date
JPH0370187A true JPH0370187A (en) 1991-03-26

Family

ID=16525030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1206538A Pending JPH0370187A (en) 1989-08-09 1989-08-09 Reflection-type light-emitting diode

Country Status (1)

Country Link
JP (1) JPH0370187A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6906459B2 (en) 1999-12-28 2005-06-14 Toyoda Gosei Co., Ltd. Light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6906459B2 (en) 1999-12-28 2005-06-14 Toyoda Gosei Co., Ltd. Light emitting diode

Similar Documents

Publication Publication Date Title
US6900587B2 (en) Light-emitting diode
JP4172196B2 (en) Light emitting diode
JP4173556B2 (en) Ultraviolet / blue LED-phosphor device that efficiently converts ultraviolet / blue light into visible light
US9385258B2 (en) Optoelectronic semiconductor device with protective and reflective sheaths
JP2002314137A (en) Reflection type light emitting diode
JP2001345483A (en) Light emitting diode
JP2014222705A (en) LED light-emitting device
JPH0436590B2 (en)
JP4218493B2 (en) LED lights
JPH01143366A (en) Led face light emitting source
KR100769718B1 (en) Reflective element for light emitting device and light emitting diode package using it
JPH0611365U (en) Light emitting diode
JP2556821Y2 (en) Light emitting device
JPH0370187A (en) Reflection-type light-emitting diode
JP3152238B2 (en) Light emitting diode
JP2629985B2 (en) Light emitting diode
JP4135528B2 (en) Lighting device
JP2001168396A (en) Light emitting display device and light emitting display unit
JP5183247B2 (en) Light emitting device
US20030133300A1 (en) Light absorbing wall for LED package
JP2003303998A (en) Light-emitting diode with enhanced visual uniformity
JPH01143368A (en) Led display element
JP2000252525A (en) Light emitting diode lamp
JPH06350140A (en) Light emitting diode
CN111201618A (en) LED chip, LED, array and LED packaging method