JPH0370134A - Solvent vapor driver and drying method - Google Patents
Solvent vapor driver and drying methodInfo
- Publication number
- JPH0370134A JPH0370134A JP20598889A JP20598889A JPH0370134A JP H0370134 A JPH0370134 A JP H0370134A JP 20598889 A JP20598889 A JP 20598889A JP 20598889 A JP20598889 A JP 20598889A JP H0370134 A JPH0370134 A JP H0370134A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- chamber
- preliminary chamber
- drying
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 title claims abstract description 77
- 239000002904 solvent Substances 0.000 title claims description 14
- 239000007789 gas Substances 0.000 claims abstract description 77
- 239000003960 organic solvent Substances 0.000 claims abstract description 51
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000001301 oxygen Substances 0.000 claims abstract description 17
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 17
- 239000011261 inert gas Substances 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000009423 ventilation Methods 0.000 claims description 13
- 238000005406 washing Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims 2
- 239000002352 surface water Substances 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 244000201986 Cassia tora Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000037406 food intake Effects 0.000 description 1
- NCAIGTHBQTXTLR-UHFFFAOYSA-N phentermine hydrochloride Chemical compound [Cl-].CC(C)([NH3+])CC1=CC=CC=C1 NCAIGTHBQTXTLR-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要部
半導体ウェーハなどである被処理物の水洗後の乾燥に用
いる溶剤蒸気乾燥装置及びそれを用いた乾燥方法に関し
、
使用する有機溶剤を引火性の高いものにしても火災を起
こす恐れのないようにすることを目的とし、
装置においては、乾燥室と予備室と蓋とガスカーテン機
構とガス換気手段とガス検知手段とを有し、乾燥室は、
被処理物を出し入れする開口を有して、内部において有
機溶剤を加熱蒸発させその蒸気により被処理物表面の水
を除去するものであり、予備室は、上記開口で乾燥室に
連通し且つ大気に向いた開口を有して、被処理物の乾燥
室への出し入れ通路となるものであり、蓋は、予備室の
大気に向いた開口を開閉自在に閉塞するものであり、ガ
スカーテン機構は、乾燥室と予備室との間を仕切る不活
性ガスのガスカーテンを形成するものであり、ガス換気
手段は、予備室内を不活性ガスで換気するものであり、
ガス検知手段は、予備室内に混入した酸素及び有機溶剤
ガスを上記換気の排気から検知するものであるように構
成し、方法においては、請求項１または請求項２記載の
溶剤蒸気乾燥装置を用いて、水洗後の被処理物を予備室
に搬入して蓋を閉じ、ガス検知手段により検知される酸
素がほぼ消失するまで該被処理物を予備室に留め、その
後、該被処理物を乾燥室に移して表面の水を除去し、そ
の後、該被処理物を予備室に移して、ガス検知手段によ
り検知される有機溶剤ガスがほぼ消失するまで咳被処理
物を予備室に留め、その後に該被処理物を搬出するよう
に構成する。[Detailed Description of the Invention] [Summary] Regarding a solvent vapor drying device and a drying method using the device used for drying a workpiece such as a semiconductor wafer after washing with water, the organic solvent used is highly flammable. The equipment has a drying chamber, an auxiliary chamber, a lid, a gas curtain mechanism, a gas ventilation means, and a gas detection means.
The pre-chamber has an opening for taking in and out the material to be treated, heats and evaporates the organic solvent inside, and uses the vapor to remove water on the surface of the material to be treated. The lid has an opening facing toward the drying chamber, and serves as a passageway for taking in and out of the drying chamber.The lid can open and close the opening facing the atmosphere in the preliminary chamber, and the gas curtain mechanism is , which forms an inert gas gas curtain separating the drying room and the preliminary chamber, and the gas ventilation means ventilates the preliminary chamber with an inert gas,
The gas detection means is configured to detect oxygen and organic solvent gas mixed into the preliminary chamber from the ventilation exhaust gas, and the method includes using the solvent vapor drying apparatus according to claim 1 or claim 2. After washing with water, the object to be processed is carried into the preliminary chamber, the lid is closed, and the object to be treated is kept in the preliminary chamber until the oxygen detected by the gas detection means has almost disappeared, and then the object to be treated is dried. The object to be treated is moved to a chamber to remove water on the surface, and then the object to be treated is moved to a preliminary chamber, and the object to be treated is kept in the preliminary chamber until the organic solvent gas detected by the gas detection means has almost disappeared. The structure is such that the object to be processed is transported out.
本発明は、半導体ウェーハなとである被処理物の水洗後
の乾燥に用いる溶剤蒸気乾燥装置及びそれを用いた乾燥
方法に関する。The present invention relates to a solvent vapor drying apparatus used for drying an object to be processed, such as a semiconductor wafer, after washing with water, and a drying method using the same.
半導体装置製造のウェーハプロセスでは、ウェーハの加
工後の清浄化に純水による水洗が多用されている。そし
てその水洗後の乾燥は、表面の水をそのまま蒸発させる
とその水が純水であってもウォータマークと称する汚れ
が残るので、上記溶剤蒸気乾燥装置を用い有機溶剤の蒸
気で水を積極的に除去するようにしている。その場合の
有機溶剤としては、フレオンなどが使用されているが、
乾燥後の品質などの点からＩＰＡ（イソプロピルアルコ
ール）の使用が望まれている。In wafer processes for manufacturing semiconductor devices, washing with pure water is often used to clean wafers after processing. When drying after washing with water, if the water on the surface is evaporated as it is, a stain called a watermark will remain even if the water is pure water, so use the above-mentioned solvent vapor dryer to actively remove the water with organic solvent vapor. I am trying to remove it. In this case, Freon is used as an organic solvent.
The use of IPA (isopropyl alcohol) is desired from the viewpoint of quality after drying.
第３図は上述した溶剤蒸気乾燥装置の従来例の要部を示
す側面図である。FIG. 3 is a side view showing the main parts of the conventional solvent vapor drying apparatus described above.
同図において、Ｓは乾燥の対象となる被処理物（ここで
は半導体ウェーハ）、１は上方が開口している乾燥室、
２は乾燥室１内に入れられて乾燥に用いる有機溶剤、３
は有機溶剤２を加熱蒸発させるヒータ、である。In the figure, S denotes the object to be dried (in this case, a semiconductor wafer), 1 denotes a drying chamber that is open at the top,
2 is an organic solvent placed in the drying chamber 1 and used for drying; 3
is a heater that heats and evaporates the organic solvent 2.
乾燥は、乾燥室１内を有機溶剤２の蒸気（ガス）で充満
させたところへ被処理物Ｓを乾燥室１の上部開口から持
ち込んで行う。有機溶剤２の蒸気が被処理物Ｓの表面で
結露し、被処理物Ｓ表面の水と一体になって滴下するこ
とにより乾燥が実行される。Drying is performed by bringing the object S to be processed through the upper opening of the drying chamber 1 into a place where the interior of the drying chamber 1 is filled with vapor (gas) of the organic solvent 2 . Drying is performed by the vapor of the organic solvent 2 condensing on the surface of the object S and dropping together with the water on the surface of the object S.
図中、４は被処理物Ｓから滴下する有機溶剤を受は止め
て乾燥室１外に排出する受皿であり、５は乾燥室１の上
部に配置されて冷却水を通す冷却コイルである。受皿４
は蒸発源の有機溶剤２に水分が混入しないようし、冷却
コイル５は有機溶剤２蒸気の散逸を仰える。In the figure, numeral 4 is a tray that receives and stops the organic solvent dripping from the object to be treated S and discharges it to the outside of the drying chamber 1, and numeral 5 is a cooling coil arranged above the drying chamber 1 through which cooling water passes. saucer 4
The cooling coil 5 is designed to prevent moisture from being mixed into the organic solvent 2 as an evaporation source, and the cooling coil 5 is designed to dissipate the organic solvent 2 vapor.
しかしながらこの乾燥装置は、使用する有機溶剤２をＩ
ＰＡにすると、ＩＰＡが引火性の強いものであることか
ら火災を起こす恐れが極めて高くなる。However, in this drying device, the organic solvent 2 used is
If PA is used, there is an extremely high risk of causing a fire because IPA is highly flammable.
そこで本発明は、半導体ウェーハなとである被処理物の
水洗後の乾燥に用いる溶剤蒸気乾燥装置及びそれを用い
た乾燥方法に関し、使用する有機溶剤を引火性の高いも
のにしても火災を起こす恐れのないようにすることを目
的とする。Therefore, the present invention relates to a solvent vapor drying device and a drying method using the device used for drying processed objects such as semiconductor wafers after washing with water, and even if the organic solvent used is highly flammable, it may cause a fire. The purpose is to be fearless.
〔課題を解決するための手段］
上記目的は、乾燥室と予備室と蓋とガスカーテン機構と
ガス換気手段とガス検知手段とを有し、乾燥室は、被処
理物を出し入れする開口を有して、内部において有ａ溶
剤を加熱蒸発させその蒸気により被処理物表面の水を除
去するものであり、予備室は、上記開口で乾燥室に連通
し且つ大気に向いた開口を有して、被処理物の乾燥室へ
の出し入れ通路となるものであり、蓋は、予備室の大気
に向いた開口を開閉自在に閉塞するものであり、ガスカ
ーテン機構は、乾燥室と予備室との間を仕切る不活性ガ
スのガスカーテンを形成するものであり、ガス換気手段
は、予備室内を不活性ガスで換気するものであり、ガス
検知手段は、予備室内に混入した酸素及び有機溶剤ガス
を上記換気の排気から検知するものである本発明の溶剤
蒸気乾燥装置によって達成される。[Means for Solving the Problems] The above object has a drying chamber, a preliminary chamber, a lid, a gas curtain mechanism, a gas ventilation means, and a gas detection means, and the drying chamber has an opening for taking in and out the processed material. The aqueous solvent is heated and evaporated inside, and the water on the surface of the workpiece is removed by the vapor, and the preparatory chamber has an opening that communicates with the drying chamber through the opening and faces the atmosphere. , which serves as a passageway for taking the materials to be processed into and out of the drying chamber, and the lid closes the opening facing the atmosphere in the preliminary chamber so that it can be opened and closed, and the gas curtain mechanism connects the drying chamber and the preliminary chamber. The gas ventilation means ventilates the preliminary chamber with inert gas, and the gas detection means detects oxygen and organic solvent gas mixed into the preliminary chamber. This is achieved by the solvent vapor drying apparatus of the present invention, which detects from the ventilation exhaust.
また本発明によれば、上記予備室は、加熱手段及び冷却
手段の少なくとも一方を有し、加熱手段は、予備室の上
部に配置されて予備室内のガスを加熱するものであり、
冷却手段は、予備室の下部に配置されて予備室内のガス
を冷却するものであるのが望ましい。Further, according to the present invention, the preliminary chamber has at least one of a heating means and a cooling means, and the heating means is arranged in an upper part of the preliminary chamber to heat the gas in the preliminary chamber,
Preferably, the cooling means is arranged at the lower part of the preliminary chamber to cool the gas within the preliminary chamber.
更に本発明によれば、上記溶剤蒸気乾燥装置を用いる場
合、水洗後の被処理物を予備室に搬入して蓋を閉じ、ガ
ス検知手段により検知される酸素がほぼ消失するまで該
被処理物を予備室に留め、その後、該被処理物を乾燥室
に移して表面の水を除去し、その後、該被処理物を予備
室に移して、ガス検知手段により検知される有機溶剤ガ
スがほぼ消失するまで該被処理物を予備室に留め、その
後に該被処理物を搬出する乾燥方法を採用するのが望ま
しい。Furthermore, according to the present invention, when using the above-mentioned solvent vapor drying apparatus, the object to be processed after being washed with water is carried into the preliminary chamber, the lid is closed, and the object to be processed is dried until the oxygen detected by the gas detection means has almost disappeared. is kept in the preliminary chamber, and then the object to be treated is transferred to a drying chamber to remove water on the surface.Then, the object to be treated is transferred to the preliminary chamber until almost all the organic solvent gas detected by the gas detection means is removed. It is desirable to adopt a drying method in which the object to be processed is kept in a preliminary chamber until it disappears, and then the object to be processed is taken out.
予備室、蓋及びガスカーテンの構成が大気と乾燥室内と
の間のガス流を遮断するため、乾燥室内の有機溶剤が引
火性の高いものであっても火災を起こす恐れがなくなる
。Since the configuration of the preliminary chamber, lid, and gas curtain blocks the gas flow between the atmosphere and the drying chamber, there is no risk of a fire even if the organic solvent in the drying chamber is highly flammable.
特に上記乾燥方法を採用すれば、大気中から予備室に搬
入された被処理物は、その搬入の際に大気から空気が予
備室に混入しても、上記の酸素検知によりその空気（酸
素）が除去されてから乾燥室に移され、また、乾燥室か
ら予備室に移された被処理物は、その移送の際に被処理
物に付着して有機溶剤が予備室に混入しても、上記有機
溶剤ガスの検知によりその有機溶剤が除去されてから大
気に搬出されるので、空気が乾燥室に入ったり有機溶剤
が大気に出たりすることが全くなくなる状態に近づく。In particular, if the drying method described above is adopted, even if air from the atmosphere mixes into the preliminary chamber when the workpiece is brought into the preliminary chamber from the atmosphere, the oxygen detection will detect the presence of air (oxygen). is removed and then transferred to the drying chamber, and even if the processed material is transferred from the drying chamber to the preparatory chamber, even if the organic solvent adheres to the processed material and mixes into the preparatory chamber during the transfer, By detecting the organic solvent gas, the organic solvent is removed and then discharged to the atmosphere, which approaches a state in which no air enters the drying chamber and no organic solvent exits to the atmosphere at all.
なお、予備室に上記加熱手段及び／又は上記冷却手段を
設けると、予備室内のガスの対流を防止することができ
て予備室内に混入した酸素や有機溶剤の除去が早まり、
更に加熱手段は被処理物に付着している有機溶剤の蒸発
を早めるように作用する。In addition, if the heating means and/or the cooling means are provided in the preliminary chamber, it is possible to prevent gas convection within the preliminary chamber, and the removal of oxygen and organic solvents mixed into the preliminary chamber is accelerated.
Furthermore, the heating means acts to hasten the evaporation of the organic solvent adhering to the object to be treated.
以下本発明の実施例について第１図及び第２図を用いて
説明する。第１図は装置実施例の要部を示す側面図、第
２図は方法実施例の手順を示す工程図、である。Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a side view showing the main parts of an embodiment of the apparatus, and FIG. 2 is a process diagram showing the procedure of the embodiment of the method.
第１図において、１１は乾燥室、１２は有機溶剤、１３
はヒータ、１４は受皿、２１は予備室、２２は蓋、２３
はガスカーテン機構、２４はガス換気手段、２５はガス
検知手段、２６は加熱手段、２７は冷却手段、である。In Figure 1, 11 is a drying chamber, 12 is an organic solvent, and 13 is a drying chamber.
is a heater, 14 is a saucer, 21 is a preliminary chamber, 22 is a lid, 23
24 is a gas curtain mechanism, 24 is a gas ventilation means, 25 is a gas detection means, 26 is a heating means, and 27 is a cooling means.
そして、第１の装置実施例は加熱手段２６及び冷却手段
２７を有しないものであり、第２の装置実施例は加熱手
段２６及び冷却手段２７を有するものである。The first device embodiment does not have heating means 26 and cooling means 27, and the second device embodiment has heating means 26 and cooling means 27.
乾燥室１１、有機溶剤１２、ヒータ１３、受皿１４は、
それぞれ従来例の、乾燥室１、有機溶剤２、ヒータ３、
受皿４、に相当する。但しここでは有機溶剤１２にＩＰ
Ａを用いる。従来例に５として設けた冷却コイルは不要
である。The drying chamber 11, the organic solvent 12, the heater 13, and the saucer 14 are
The drying chamber 1, organic solvent 2, heater 3, respectively, are conventional examples.
This corresponds to saucer 4. However, here, IP is applied to organic solvent 12.
Use A. The cooling coil provided as 5 in the conventional example is unnecessary.
予備室２１は、乾燥室１１に被処理物Ｓを出し入れする
際の通路となるものであり、下側が乾燥室１１上部の開
口で乾燥室１１に連通し、上側に大気に向いた開口を有
しており、その開口は蓋２２により開閉自在に閉塞され
る。Ｍ２２は閉じているのが常態である。なお図中の２
２ａは蓋２２を閉じた際の隙間を塞ぐパツキンである。The preparatory chamber 21 serves as a path for taking the processed material S into and out of the drying chamber 11, and has an opening at the top of the drying chamber 11 on the lower side that communicates with the drying chamber 11, and an opening on the upper side facing the atmosphere. The opening is closed by a lid 22 so as to be openable and closable. M22 is normally closed. Note that 2 in the diagram
2a is a gasket that closes the gap when the lid 22 is closed.
ガスカーテン機構２３は、予備室２１下端部の一側面に
設けたスリット状開口２３ａから反対側面に設けたスリ
ット状開口２３ｂに向けて窒素−などの不活性ガスを吹
き出し、乾燥室１１と予備室２１との間を仕切るガスカ
ーテンを形成する。The gas curtain mechanism 23 blows out an inert gas such as nitrogen from a slit-shaped opening 23a provided on one side of the lower end of the preliminary chamber 21 toward a slit-shaped opening 23b provided on the opposite side, thereby separating the drying chamber 11 and the preliminary chamber. 21 to form a gas curtain that separates the
ガス換気手段２４は、予備室２１の上部に設けた送気口
２４ａから予備室２１内に窒素などの不活性ガスを送り
込み、予備室２１の上部に設けた排気口２４ｂから排気
するようにして、予備室２１内に換気による不活性ガス
流を形成する。送気口２４ａ及び排気口２４ｂの上下関
係は逆であっても良い。The gas ventilation means 24 sends an inert gas such as nitrogen into the preliminary chamber 21 through an air supply port 24a provided at the top of the preliminary chamber 21, and exhausts it through an exhaust port 24b provided at the top of the preliminary chamber 21. , an inert gas flow is created in the preliminary chamber 21 by ventilation. The vertical relationship between the air supply port 24a and the exhaust port 24b may be reversed.
ガス検知手段２５は、酸素及び有機溶剤ガスを検知する
もので、検知部２５ａを排気口２４ｂからの排気中に配
置して、予備室２１内に混入した酸素及び有機溶剤を検
知する。その酸素は被処理物Ｓの大気からの搬入などで
蓋２２を開けた際に大気から空気として混入するもの、
また有機溶剤は乾燥室１１で乾燥した被処理物Ｓを取り
出す際に被処理物Ｓに付着している有機溶剤２として混
入するものである。従って有機溶剤の検知には通常の可
燃性ガス検知器を用いることができる。また酸素検知器
は一般的なものである。The gas detection means 25 detects oxygen and organic solvent gas, and detects oxygen and organic solvent mixed into the preliminary chamber 21 by disposing a detection part 25a in the exhaust gas from the exhaust port 24b. The oxygen is mixed in as air from the atmosphere when the lid 22 is opened when the object to be processed S is brought in from the atmosphere, etc.
Further, the organic solvent is mixed as the organic solvent 2 adhering to the processed material S when the processed material S dried in the drying chamber 11 is taken out. Therefore, a normal combustible gas detector can be used to detect organic solvents. Oxygen detectors are also common.
これらを有する第１の装置実施例は、水洗後の被処理物
Ｓの乾燥を後述のように行うが、乾燥室１１と予備室２
１との間のガス流がガスカーテンで遮断され、且つ予備
室２工がＭ２２により大気と遮断されて予備室２１内が
不活性ガスで換気されているので、有機溶剤１２が引火
性の高いＩＰＡであっても火災を起こす恐れがない。In the first embodiment of the apparatus having these, the object to be processed S after being washed with water is dried as described below.
The organic solvent 12 is highly flammable because the gas flow between the auxiliary chamber 1 and the auxiliary chamber 21 is blocked by a gas curtain, and the auxiliary chamber 21 is isolated from the atmosphere by M22 and the interior of the auxiliary chamber 21 is ventilated with inert gas. Even IPA does not pose a risk of causing a fire.
水洗した被処理物Ｓの乾燥は、次の工程手順によって行
う。Drying of the processed material S that has been washed with water is performed by the following process procedure.
（Ａ） ！２２を開け、被処理物Ｓを予備室２１に搬入
し、１２２を閉じる。(A)! 22 is opened, the workpiece S is carried into the preliminary chamber 21, and 122 is closed.
（Ｂ）被処理物Ｓを予備室２１からガスカーテン突き抜
けで乾燥室１１に移す。これによって被処理物Ｓ表面の
水の除去が開始される。(B) The object to be processed S is transferred from the preliminary chamber 21 to the drying chamber 11 by passing through the gas curtain. As a result, removal of water from the surface of the object S to be treated is started.
（Ｃ）水が除去された後、被処理物Ｓを乾燥室１１から
ガスカーテン突き抜けで予備室２１に移す。(C) After the water has been removed, the object to be treated S is transferred from the drying chamber 11 to the preliminary chamber 21 by passing through the gas curtain.
ＣＤ） １２２を開け、被処理物Ｓを予備室２１から搬
出し、蓋２２を閉じる。CD) 122 is opened, the object to be processed S is carried out from the preliminary chamber 21, and the lid 22 is closed.
その際、先に述べたように、 （Ａ）工程において予備
室２１に空気が混入し、（Ｃ）工程において予備室２工
に有機溶剤２が混入するので、第２図に示す方法実施例
のようにすることにより、火災に対する安全性をより完
全にすることができる。ガス検知手段２５は、この実施
例を行い得るように設置されたものである。At that time, as mentioned earlier, air gets mixed into the preliminary chamber 21 in step (A), and organic solvent 2 gets mixed into the preliminary chamber 2 in step (C), so the method embodiment shown in FIG. By doing this, the safety against fire can be further improved. The gas detection means 25 is installed so that this embodiment can be carried out.
即ち、上記（Ａ）工程を行い（Ｂ）工程に移る前に、（
Ａ、）工程として、ガス検知手段２５により検知される
酸素がほぼ消失するまで被処理物Ｓを予備室２■に滞留
させる。That is, after performing step (A) above and before moving on to step (B), (
In step A,), the object to be processed S is allowed to stay in the preliminary chamber 2 until the oxygen detected by the gas detection means 25 is almost completely eliminated.
また、上記（Ｃ）工程を行い（Ｄ）工程に移る前に、（
Ｃ５）工程として、ガス検知手段２５により検知される
有機溶剤ガスがほぼ消失するまで被処理物Ｓを予備室２
１に滞留させる。In addition, before performing the above step (C) and moving on to step (D), (
In step C5), the workpiece S is kept in the preliminary chamber 2 until the organic solvent gas detected by the gas detection means 25 almost disappears.
1.
このようにすることにより、被処理物Ｓを乾燥室１１に
出し入れする際に、空気が乾燥室１１に入ったり乾燥室
１１内の有機溶剤１２が大気に出たりすることが全くな
くなる状態に近づく。By doing this, when the object to be treated S is taken in and out of the drying chamber 11, a state is approached in which no air enters the drying chamber 11 and no organic solvent 12 inside the drying chamber 11 comes out to the atmosphere. .
再び第１図を参照して、第２の装置実施例は、先に述べ
たように上記第１の装置実施例に加熱手段２６及び冷却
手段２７を付加したものである。その使用方法及び火災
に対する安全性は第１の装置実施例と同じである。Referring again to FIG. 1, the second device embodiment is the same as the first device embodiment described above with the addition of heating means 26 and cooling means 27. Its usage and fire safety are the same as in the first device embodiment.
加熱手段２６は、予備室２工の上部外周に配置されたヒ
ータであり、予備室２１内のガスを加熱する。The heating means 26 is a heater disposed on the outer periphery of the upper part of the auxiliary chamber 2, and heats the gas in the auxiliary chamber 21.
冷却手段２７は、予備室２１の下部外周に配置されて冷
却水を通す冷却管であり、予備室２１内のガスを冷却す
る。The cooling means 27 is a cooling pipe arranged at the lower outer periphery of the preliminary chamber 21 and through which cooling water passes, and cools the gas within the preliminary chamber 21 .
これらを設置することにより、予備室２１内を換気する
不活性ガスが対流を起こすのを防止することができて、
予備室２１内に混入した酸素や有機溶剤ガスの除去が早
まり、更に加熱手段２６は被処理物Ｓに付着している有
機溶剤２の蒸発を早めて、被処理物Ｓが予備室２１内に
滞留する時間を短縮さセることかできる。By installing these, it is possible to prevent the inert gas ventilating the preliminary chamber 21 from causing convection,
The removal of oxygen and organic solvent gas mixed into the preliminary chamber 21 is accelerated, and the heating means 26 also accelerates the evaporation of the organic solvent 2 adhering to the workpiece S, so that the workpiece S enters the preliminary chamber 21. It is possible to shorten the residence time.
上記対流の防止に関しては、加熱手段２６または冷却手
段２７の一方のみの設置で可なりの効果を期待すること
ができる。Regarding the prevention of convection, a considerable effect can be expected by installing only one of the heating means 26 and the cooling means 27.
なお、上記の装置実施例は、使用する有機溶剤１２がＩ
ＰＡ以外の引火性のものであっても火災に対して安全で
あり、また非引火性のものであっても何ら支障ない。In addition, in the above device embodiment, the organic solvent 12 used is I
Flammable materials other than PA are safe against fire, and non-flammable materials do not pose any problem.
更に、上記の装置実施例では予備室２工を乾燥室１１の
上に配置しであるが、予備室２１の配置は、乾燥室１１
の側面など適宜な箇所にしても良い。Furthermore, in the above-described apparatus embodiment, the two preliminary chambers are arranged above the drying chamber 11, but the preliminary chamber 21 is arranged above the drying chamber 11.
It may be placed at an appropriate location such as the side of the
〔発明の効果］
以上説明したように本発明の構成によれば、半導体ウェ
ーハなとである被処理物の水洗後の乾燥に用いる溶剤蒸
気乾燥装置及びそれを用いた乾燥方法に関し、使用する
有機溶剤を引火性の高いものにしても火災を起こす恐れ
のないようにすることができて、有機溶剤として使用が
望まれている引火性の高いＩＰＡを安全に使用すること
を可能にさせる効果がある。[Effects of the Invention] As explained above, according to the configuration of the present invention, the organic solvent used in Even if the solvent is highly flammable, there is no risk of causing a fire, and this has the effect of making it possible to safely use highly flammable IPA, which is desired to be used as an organic solvent. be.
第１図は装置実施例の要部を示す側面図、第２図は方法
実施例の手順を示す工程図、第３図は装置従来例の要部
を示す側面図、である。
図において、
１．１１は乾燥室、
２．１２は有機溶剤、
３．１３はヒータ、
４．１４は受皿、
５は冷却コイル、
２１は予備室、
２２は蓋、
２３はガスカーテン機構、
２３ａ 、２３ｂはスリット状開口、
２４はガス換気手段、
２４ａは送気口、
２４ｂは排気口、
２５はガス検知手段、
２５ａは検知部、
２６は加熱手段、
２７は冷却手段、
Ｓは被処理物、
である。
弧
ｌ！二較＃に宣
３：ヒータ
２１：予備室
１２ ： ’ｆｆ＠嗜剤
１４：受皿
２２：葺
袋ｆｆ寅施例の嬰卸を示す側向図
′！Ｊ １ 図
２１５−
−ｒ須１施例の手順をネ丁工程園
：乾燥室
３：ヒータ
５：冷却フィル
２ ：ｆ（ツＨ；咎−ＰＩ
４：受皿
Ｓ：被処理物
ｖＬ３ｉ従来例の嬰舒を示す側面囚
第 ３ 図FIG. 1 is a side view showing the main parts of an embodiment of the apparatus, FIG. 2 is a process diagram showing the procedure of the method embodiment, and FIG. 3 is a side view showing the main parts of a conventional apparatus. In the figure, 1.11 is a drying chamber, 2.12 is an organic solvent, 3.13 is a heater, 4.14 is a saucer, 5 is a cooling coil, 21 is a preliminary chamber, 22 is a lid, 23 is a gas curtain mechanism, 23a , 23b is a slit-shaped opening, 24 is a gas ventilation means, 24a is an air supply port, 24b is an exhaust port, 25 is a gas detection means, 25a is a detection part, 26 is a heating means, 27 is a cooling means, S is a processed object , is. Arc l! Second comparison # 3: Heater 21: Preliminary room 12: 'ff @ drug 14: saucer 22: thatched bag ff Side view showing the ingestion of the tora example'! J 1 Figure 215--r-1 Example procedure Process garden: Drying room 3: Heater 5: Cooling filter 2: f(TSH; 咎-PI 4: Receiver S: Workpiece vL3i Conventional example) Figure 3: Side view showing the infant
Claims (3)
ガスカーテン機構（２３）とガス換気手段（２４）とガ
ス検知手段（２５）とを有し、 乾燥室（１１）は、被処理物（Ｓ）を出し入れする開口
を有して、内部において有機溶剤を加熱蒸発させその蒸
気により被処理物（Ｓ）表面の水を除去するものであり
、 予備室（２１）は、上記開口で乾燥室（１１）に連通し
且つ大気に向いた開口を有して、被処理物（Ｓ）の乾燥
室（１１）への出し入れ通路となるものであり、蓋（２
２）は、予備室（２１）の大気に向いた開口を開閉自在
に閉塞するものであり、 ガスカーテン機構（２３）は、乾燥室（１１）と予備室
（２１）との間を仕切る不活性ガスのガスカーテンを形
成するものであり、 ガス換気手段（２４）は、予備室（２１）内を不活性ガ
スで換気するものであり、 ガス検知手段（２５）は、予備室（２１）内に混入した
酸素及び有機溶剤ガスを上記換気の排気から検知するも
のであって、 被処理物（Ｓ）の水洗後の乾燥に用いることを特徴とす
る溶剤蒸気乾燥装置。(1) The drying chamber (11) has a drying chamber (11), a preliminary chamber (21), a lid (22), a gas curtain mechanism (23), a gas ventilation means (24), and a gas detection means (25). The pre-chamber (21) has an opening for putting in and taking out the object to be treated (S), heats and evaporates the organic solvent inside, and uses the vapor to remove water on the surface of the object to be treated (S). , the opening communicates with the drying chamber (11) and faces the atmosphere, and serves as a passage for taking the object (S) into and out of the drying chamber (11), and the lid (2
2) is to open and close the opening facing the atmosphere of the preliminary chamber (21), and the gas curtain mechanism (23) is a partition that partitions the drying chamber (11) and the preliminary chamber (21). A gas curtain of active gas is formed, a gas ventilation means (24) is used to ventilate the inside of the preliminary chamber (21) with an inert gas, and a gas detection means (25) is configured to ventilate the inside of the preliminary chamber (21). 1. A solvent vapor drying device for detecting oxygen and organic solvent gas mixed in the air from the ventilation exhaust gas, and for use in drying a processed material (S) after washing with water.
室（２１）は、加熱手段（２６）及び冷却手段（２７）
の少なくとも一方を有し、 加熱手段（２６）は、予備室（２１）の上部に配置され
て予備室（２１）内のガスを加熱するものであり、冷却
手段（２７）は、予備室（２１）の下部に配置されて予
備室（２１）内のガスを冷却するものであることを特徴
とする溶剤蒸気乾燥装置。(2) In the solvent vapor drying apparatus according to claim 1, the preliminary chamber (21) includes a heating means (26) and a cooling means (27).
The heating means (26) is arranged in the upper part of the preliminary chamber (21) to heat the gas in the preliminary chamber (21), and the cooling means (27) is arranged in the upper part of the preliminary chamber (21). A solvent vapor drying device characterized in that it is disposed at the lower part of the preliminary chamber (21) to cool the gas in the preliminary chamber (21).
を用いて、 水洗後の被処理物（Ｓ）を予備室（２１）に搬入して蓋
（２２）を閉じ、ガス検知手段（２５）により検知され
る酸素がほぼ消失するまで該被処理物（Ｓ）を予備室（
２１）に留め、 その後、該被処理物（Ｓ）を乾燥室（１１）に移して表
面の水を除去し、 その後、該被処理物（Ｓ）を予備室（２１）に移して、
ガス検知手段（２５）により検知される有機溶剤ガスが
ほぼ消失するまで該被処理物（Ｓ）を予備室に留め、 その後に該被処理物（Ｓ）を搬出することを特徴とする
乾燥方法。(3) Using the solvent vapor drying apparatus according to claim 1 or 2, the object to be treated (S) after being washed with water is carried into the preliminary chamber (21), the lid (22) is closed, and the gas detection means ( 25) The object to be processed (S) is kept in the preliminary chamber (
21), then the object to be treated (S) is transferred to a drying chamber (11) to remove surface water, and then the object to be treated (S) is transferred to a preliminary chamber (21),
A drying method characterized in that the object to be treated (S) is kept in a preliminary chamber until the organic solvent gas detected by the gas detection means (25) has almost disappeared, and then the object to be treated (S) is taken out. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20598889A JPH0370134A (en) | 1989-08-09 | 1989-08-09 | Solvent vapor driver and drying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20598889A JPH0370134A (en) | 1989-08-09 | 1989-08-09 | Solvent vapor driver and drying method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0370134A true JPH0370134A (en) | 1991-03-26 |
Family
ID=16516042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20598889A Pending JPH0370134A (en) | 1989-08-09 | 1989-08-09 | Solvent vapor driver and drying method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0370134A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0833376A2 (en) * | 1996-09-27 | 1998-04-01 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| EP0855736A2 (en) * | 1997-01-24 | 1998-07-29 | Tokyo Electron Limited | Apparatus for and method of cleaning object to be processed |
| US5956859A (en) * | 1997-05-22 | 1999-09-28 | Ryoden Semiconductor System Emgineering Corporation | Drying apparatus for processing surface of substrate |
| US5996242A (en) * | 1997-04-04 | 1999-12-07 | Ryoden Semiconductor System Engineering Corporation | Drying apparatus and method |
| US6032382A (en) * | 1997-05-22 | 2000-03-07 | Mitsubishi Denki Kabushiki Kaisha | Drying apparatus and method using IPA of a semiconductor wafer |
| US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| US6158449A (en) * | 1997-07-17 | 2000-12-12 | Tokyo Electron Limited | Cleaning and drying method and apparatus |
| WO2001046994A1 (en) * | 1999-12-20 | 2001-06-28 | Steag Microtech Gmbh | Device and method for treating substrates |
| EP1160839A2 (en) * | 2000-06-01 | 2001-12-05 | Canon Kabushiki Kaisha | Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus |
| JP2008049036A (en) * | 2006-08-28 | 2008-03-06 | San Technos Kk | Pedestal for indirect moxibustion and indirect moxibustion |
| CN112622123A (en) * | 2020-10-23 | 2021-04-09 | 浙江中科玖源新材料有限公司 | Transparent polyimide curtain coating film drying equipment |
-
1989
- 1989-08-09 JP JP20598889A patent/JPH0370134A/en active Pending
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6050275A (en) * | 1996-09-27 | 2000-04-18 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| US6746543B2 (en) | 1996-09-27 | 2004-06-08 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| EP0833376A2 (en) * | 1996-09-27 | 1998-04-01 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| US6413355B1 (en) * | 1996-09-27 | 2002-07-02 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| US6342104B1 (en) | 1996-09-27 | 2002-01-29 | Tokyo Electron Limited | Method of cleaning objects to be processed |
| EP0833376A3 (en) * | 1996-09-27 | 2001-03-07 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
| US6491045B2 (en) | 1997-01-24 | 2002-12-10 | Tokyo Electron Limited | Apparatus for and method of cleaning object to be processed |
| EP0855736A2 (en) * | 1997-01-24 | 1998-07-29 | Tokyo Electron Limited | Apparatus for and method of cleaning object to be processed |
| US6319329B1 (en) | 1997-01-24 | 2001-11-20 | Tokyo Electron Limited | Method of cleaning objects to be processed |
| EP0855736A3 (en) * | 1997-01-24 | 1998-08-19 | Tokyo Electron Limited | Apparatus for and method of cleaning object to be processed |
| KR100385037B1 (en) * | 1997-01-24 | 2003-08-21 | 동경 엘렉트론 주식회사 | Cleaning device and cleaning method |
| US5996242A (en) * | 1997-04-04 | 1999-12-07 | Ryoden Semiconductor System Engineering Corporation | Drying apparatus and method |
| DE19749649C2 (en) * | 1997-04-04 | 2002-09-19 | Ryoden Semiconductor Syst Eng | Drying device and drying process |
| US6032382A (en) * | 1997-05-22 | 2000-03-07 | Mitsubishi Denki Kabushiki Kaisha | Drying apparatus and method using IPA of a semiconductor wafer |
| US5956859A (en) * | 1997-05-22 | 1999-09-28 | Ryoden Semiconductor System Emgineering Corporation | Drying apparatus for processing surface of substrate |
| KR100361331B1 (en) * | 1997-05-22 | 2003-02-11 | 료덴 세미컨덕터 시스템 엔지니어링 (주) | Drying device |
| US6158449A (en) * | 1997-07-17 | 2000-12-12 | Tokyo Electron Limited | Cleaning and drying method and apparatus |
| WO2001046994A1 (en) * | 1999-12-20 | 2001-06-28 | Steag Microtech Gmbh | Device and method for treating substrates |
| EP1160839A2 (en) * | 2000-06-01 | 2001-12-05 | Canon Kabushiki Kaisha | Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus |
| EP1160839A3 (en) * | 2000-06-01 | 2004-07-14 | Canon Kabushiki Kaisha | Exposure apparatus, coating/developing apparatus, method of transferring a substrate, method of producing a device, semiconductor production factory, and method of maintaining an exposure apparatus |
| JP2008049036A (en) * | 2006-08-28 | 2008-03-06 | San Technos Kk | Pedestal for indirect moxibustion and indirect moxibustion |
| CN112622123A (en) * | 2020-10-23 | 2021-04-09 | 浙江中科玖源新材料有限公司 | Transparent polyimide curtain coating film drying equipment |
| CN112622123B (en) * | 2020-10-23 | 2022-06-10 | 浙江中科玖源新材料有限公司 | Transparent polyimide curtain coating film drying equipment |
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