JPH0369636B2 - - Google Patents

Info

Publication number
JPH0369636B2
JPH0369636B2 JP62040777A JP4077787A JPH0369636B2 JP H0369636 B2 JPH0369636 B2 JP H0369636B2 JP 62040777 A JP62040777 A JP 62040777A JP 4077787 A JP4077787 A JP 4077787A JP H0369636 B2 JPH0369636 B2 JP H0369636B2
Authority
JP
Japan
Prior art keywords
laser
pulse
switch
peak value
waveform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62040777A
Other languages
Japanese (ja)
Other versions
JPS63207484A (en
Inventor
Junya Suehiro
Katsuhiro Minamida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP62040777A priority Critical patent/JPS63207484A/en
Priority to DE3850330T priority patent/DE3850330T2/en
Priority to EP88902201A priority patent/EP0308512B1/en
Priority to PCT/JP1988/000194 priority patent/WO1988006504A1/en
Publication of JPS63207484A publication Critical patent/JPS63207484A/en
Priority to US07/305,121 priority patent/US4947023A/en
Publication of JPH0369636B2 publication Critical patent/JPH0369636B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355Texturing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ光を利用したロールのダル加工
に用いるQスイツチレーザのパルス波形の制御法
に関する。 〔従来の技術〕 ロールのダル加工法には、シヨツトブラスト
法、放電加工法やレーザを用いてロール表面を加
工する方法などがある。レーザを用いてロール表
面のダル加工を行なう装置については特公昭58−
25557、特公昭60−2156により公告されている。
特公昭60−2156の装置はYAGレーザ、ルビーレ
ーザなどの光源をQスイツチを用いてパルスレー
ザを発生させてロール表面にダル加工を行う装置
である。 ロールのダル加工においては所定の周波数、パ
ルス幅、尖頭値などをもつパルスレーザを用い
て、ロール表面に周期的な加工を施す必要があ
る。このようなパルスレーザ出力を得る方法とし
ては第2図に示したように連続発振(CW)レー
ザ出力を機械的光学装置(チヨツパー、シヤツタ
ー等)でパルス化する方法とパルス励起あるいは
Qスイツチパルス(第3図)などのパルスレーザ
を使用する方法がある。 Qスイツチパルスは機械装置を必要としないた
め前者に比較して装置を小型、簡素化出来ると同
時に周波数制御が容易でかつ制御範囲が広いとい
う特徴を有している。しかしながらQスイツチは
第4a図、第4b図に示しているように周波数を
変化させると発振励起条件が変化するためパルス
波形や尖頭出力などが同時に変化し安定したダル
加工が出来ない。また第1a図に示したように先
頭パルスの尖頭値(P1)が後続のパルス(P2
P3、P4…)よりも極度に大きくなる。更に、一
般的に通常のQスイツチパルスは尖頭値が105
103ワツト(W)、半値幅(tp)が1μ秒以下であ
り、尖頭値をパワー強度(W/cm2)に換算したも
のを第5図に示したがダル加工に適した加工(穴
あけ)領域ではないなどの短所を有している。ま
た特公昭60−2156に於ても上記短所の解決法につ
いて示されていない。 〔発明が解決しようとする問題点〕 そこで本発明は上記に示したQスイツチパルス
レーザの短所であるパルス波形の不均一性および
尖頭値、半値幅の値をロールダル加工に適した領
域に制御しようとするものである。 〔問題点を解決するための手段〕 Qスイツチパルスレーザの発生の機構について
第3図を用いて説明する。即ち反射鏡3,4の中
間に位置したレーザロツド1に所望の励起エネル
ギー(光源)を連続的に付加しておき、レーザロ
ツド1と反射鏡4との間にレーザ発振光軸に対し
或る角度をもつて配置された溶融石英、吸収体、
電気音響素子からなるQスイツチ素子2に、高周
波信号源(RF)5を与えると溶融石英内部に回
折格子が形成され回折光6が発生する。 その結果共振器7内部における損失が増大し、
レーザロツド1にエネルギーが蓄積される。次に
Qスイツチ素子2に印加していたRFをOFFにす
ると溶融石英内の回折格子が消滅、回折光6が消
失し、共振器7の損失が減少する。その結果、レ
ーザロツド1に蓄積されたエネルギーが瞬時に放
光され高い尖頭値を有するレーザパルスが得られ
る。即ち第6図に示したように共振器1にEmax
のエネルギーが蓄積されており、これがEmin(≒
o w)に瞬時に放出されるとレーザ出力は
PminからPmaxの高い尖頭値を有するレーザパ
ルスを形成する。 そこで本発明者等は共振器1のエネルギー蓄積
状態(Emax)を制御することにより、後続パル
スの尖頭値および半値幅等を制御できると考え以
下の具体的な手段を検討した。 共振器1を励起させる光源励起エネルギーを
減少させる方法;この方法は最も簡単な方法で
あるが第1a図、第1b図のように複数のパル
スをグルーピングして発生させる場合は励起エ
ネルギー低下とともに後続パルスP2〜P4が消
失し、加工に必要なパルス数を確保出来ないこ
とが判明した。 パルスオフ時の共振器損失を低減させレーザ
ロツド1内のエネルギーの過剰な蓄積を抑制す
る方法;この方法は第6図のEmax−Emin(≒
o w)の値を減少させる、即ちEmaxを小さ
くする方法であるが、これは次の3つの方法が
考えられる。 −1:Qスイツチ素子2の取付け角度、位置
を変える方法。 −2:レーザロツド1への励起エネルギーを
Qスイツチ素子2の透過阻止上限以上に高め
る方法。 −3:Qスイツチ素子2に印加するRFのパ
ワーを低下する方法。 実験の結果上記3つのいずれの方法によつて
も、第1b図のような定常的な連続出力PL′が発
生し、全出力PTに対するPLの比率はこれらの方
法によつて調整出来ること、先頭パルスP1′の尖
頭値が減少し(P1′<P1)、これに伴いグループ内
パルス尖頭値P1′〜Pi′を同レベルに調整すること
が可能となること、パルス半値幅tp′が広くなる
(tp′>tp)ことを見い出した。尚−1の方法は
角度、位置の調整に非常に高度の技術を要するこ
と、−2の方法はエネルギーの消費量が多くな
るなどの欠点であり、−3の方法が最も簡単で
望ましい方法である。 以下−3の方法を用いた実施例について示
す。 〔実施例〕 本発明および従来の手法を用いた場合のYAG
レーザQスイツチパルスの特性を表に比較して
示す。表および第5図を比較することにより、
本発明の手法を用い、Qスイツチパルス波形をダ
ル加工に適した領域に制御できることが判る。 このQスイツチパルスを用いてロールのダル加
工を行つた場合、ロール表面には第7図に示した
ようなクレータ状の穴11および、もれ出力によ
る熱影響部12が形成される。このクレータ状穴
の凸部により、圧延鋼板に所定の粗度を付与でき
る。また熱影響部12は凹凸を伴わないので鋼板
圧延に支障はない。 〔発明の効果〕 本発明により、連続励起固体レーザのQスイツ
チパルス波形をダル加工に適した条件に制御する
ことが可能となつた。 【表】
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of controlling the pulse waveform of a Q-switch laser used for dulling a roll using laser light. [Prior Art] Roll dulling methods include shot blasting, electrical discharge machining, and a method of processing the roll surface using a laser. A device for dulling the surface of a roll using a laser was published in 1983.
25557, published by Special Publication No. 60-2156.
The device disclosed in Japanese Patent Publication No. 60-2156 uses a light source such as a YAG laser or a ruby laser to generate a pulsed laser using a Q switch to dull the roll surface. In the dull processing of a roll, it is necessary to perform periodic processing on the roll surface using a pulsed laser having a predetermined frequency, pulse width, peak value, etc. As shown in Figure 2, there are two ways to obtain such a pulsed laser output: one is to pulse continuous wave (CW) laser output using a mechanical optical device (chopper, shutter, etc.), the other is to pulse excitation or Q-switch pulse ( There is a method using a pulsed laser such as the one shown in Fig. 3). Since the Q-switch pulse does not require any mechanical equipment, it has the characteristics that the equipment can be made smaller and simpler than the former, and at the same time, frequency control is easy and the control range is wide. However, as shown in FIGS. 4a and 4b, with the Q switch, when the frequency is changed, the oscillation excitation conditions change, so the pulse waveform, peak output, etc. change simultaneously, making stable dull processing impossible. Also, as shown in Figure 1a, the peak value (P 1 ) of the first pulse is the same as that of the subsequent pulses (P 2 ,
P 3 , P 4 ...). Furthermore, a normal Q-switch pulse generally has a peak value of 10 5 ~
10 3 watts (W), half-width (tp) is less than 1 μsec, and the peak value converted to power intensity (W/cm 2 ) is shown in Figure 5, which is suitable for dull processing ( It has disadvantages such as not being suitable for drilling (drilling). Furthermore, Japanese Patent Publication No. 60-2156 does not disclose any solutions to the above-mentioned disadvantages. [Problems to be Solved by the Invention] Therefore, the present invention aims to control the non-uniformity of the pulse waveform and the values of the peak value and half-width, which are the disadvantages of the Q-switch pulse laser shown above, to a range suitable for rolled dull processing. This is what I am trying to do. [Means for solving the problem] The mechanism for generating a Q-switch pulse laser will be explained using FIG. 3. That is, a desired excitation energy (light source) is continuously applied to the laser rod 1 located between the reflecting mirrors 3 and 4, and a certain angle is set between the laser rod 1 and the reflecting mirror 4 with respect to the laser oscillation optical axis. fused silica, absorber,
When a high frequency signal source (RF) 5 is applied to the Q switch element 2, which is an electroacoustic element, a diffraction grating is formed inside the fused silica, and diffracted light 6 is generated. As a result, the loss inside the resonator 7 increases,
Energy is stored in the laser rod 1. Next, when the RF applied to the Q-switch element 2 is turned off, the diffraction grating in the fused silica disappears, the diffracted light 6 disappears, and the loss in the resonator 7 decreases. As a result, the energy stored in the laser rod 1 is emitted instantaneously, resulting in a laser pulse having a high peak value. That is, as shown in Fig. 6, Emax is applied to resonator 1.
energy is accumulated, and this is Emin (≒
o w), the laser output is
Form a laser pulse with a high peak value from Pmin to Pmax. Therefore, the inventors thought that by controlling the energy accumulation state (Emax) of the resonator 1, the peak value, half-width, etc. of the subsequent pulse could be controlled, and studied the following specific means. A method of reducing the excitation energy of the light source that excites the resonator 1; this method is the simplest method, but when multiple pulses are generated in groups as shown in Figures 1a and 1b, the excitation energy decreases and the subsequent It was found that pulses P 2 to P 4 disappeared and it was not possible to secure the number of pulses necessary for processing. A method of reducing resonator loss during pulse-off and suppressing excessive accumulation of energy in the laser rod 1; this method is based on Emax−Emin (≒
The method is to reduce the value of ow), that is, to reduce Emax, and the following three methods can be considered. -1: Method of changing the mounting angle and position of Q switch element 2. -2: A method of increasing the excitation energy to the laser rod 1 to a level higher than the transmission blocking upper limit of the Q switch element 2. -3: Method of reducing the RF power applied to the Q switch element 2. As a result of experiments, any of the above three methods generates a steady continuous output P L ' as shown in Figure 1b, and the ratio of P L to the total output P T can be adjusted by these methods. In other words, the peak value of the first pulse P 1 ′ decreases (P 1 ′<P 1 ), and accordingly, it becomes possible to adjust the intra-group pulse peak values P 1 ′ to Pi′ to the same level. It was found that the pulse half-width tp' becomes wider (tp'>tp). Note that method -1 requires very advanced techniques to adjust the angle and position, method -2 requires a large amount of energy, and method -3 is the simplest and most desirable method. be. An example using method-3 will be described below. [Example] YAG using the present invention and conventional methods
The characteristics of the laser Q switch pulses are shown in a table for comparison. By comparing the table and Figure 5,
It can be seen that the Q-switch pulse waveform can be controlled to a range suitable for dull processing using the method of the present invention. When the roll is dulled using this Q-switch pulse, a crater-shaped hole 11 as shown in FIG. 7 and a heat-affected zone 12 due to leakage output are formed on the roll surface. The convex portion of the crater-shaped hole can impart a predetermined roughness to the rolled steel plate. Furthermore, since the heat affected zone 12 does not have any irregularities, there is no problem in rolling the steel plate. [Effects of the Invention] According to the present invention, it has become possible to control the Q-switch pulse waveform of the continuous excitation solid-state laser to conditions suitable for dull processing. 【table】

【図面の簡単な説明】[Brief explanation of drawings]

第1a図および第1b図はそれぞれ通常法およ
び本発明によるQスイツチパルス波形の比較を示
す波形図、第2図は機械装置(チヨツパー)によ
る連続レーザ光のパルス化の方法を示す斜視図、
第3図はQスイツチ素子を含む固体レーザ発振器
の構成を示すブロツク図、第4a図および第4b
図はそれぞれQスイツチパルスの周波数とパルス
波形の相関を示すグラフ、第5図はレーザ照射条
件と加工現象の相関を示すグラフ、第6図はQス
イツチパルス波形の形成機構を示す波形図、第7
図は本発明手法によるロール表面レーザ加工状態
を示す断面図および平面図である。 1:レーザロツド、2:Qスイツチ素子、3,
4:反射鏡、5:高周波信号源、6:回折光、
7:共振器、11:穴、12:熱影響部。
1a and 1b are waveform diagrams showing a comparison of Q-switch pulse waveforms according to the conventional method and the present invention, respectively; FIG. 2 is a perspective view showing a method of pulsing continuous laser light using a mechanical device (chopper);
Figure 3 is a block diagram showing the configuration of a solid-state laser oscillator including a Q-switch element, Figures 4a and 4b
The figures are graphs showing the correlation between the frequency of the Q switch pulse and the pulse waveform, Figure 5 is a graph showing the correlation between laser irradiation conditions and processing phenomena, Figure 6 is a waveform diagram showing the formation mechanism of the Q switch pulse waveform, and Figure 6 is a graph showing the correlation between the Q switch pulse frequency and the pulse waveform. 7
The figures are a sectional view and a plan view showing the state of laser processing of the roll surface by the method of the present invention. 1: Laser rod, 2: Q switch element, 3,
4: Reflector, 5: High frequency signal source, 6: Diffracted light,
7: resonator, 11: hole, 12: heat affected zone.

Claims (1)

【特許請求の範囲】[Claims] 1 連続励起固体レーザをQスイツチを用いてパ
ルスレーザを連続的に出力する方法において、パ
ルスオフ時の共振器損失を低減させ、レーザ発振
媒体内の励起状態分子の過剰な蓄積を抑制するこ
とによりパルス波形の不均一性及び尖頭値、半値
幅をダル加工に適した領域、パワー密度P=5×
105〜5×106W/cm2、半値幅tp=5×1/107〜1/1
sec、に制御することを特徴とするロールダル
加工に適したQスイツチパルスレーザのパルス波
形制御法。
1 In a method of continuously outputting pulsed laser from a continuously pumped solid-state laser using a Q switch, the pulsed Waveform non-uniformity, peak value, half width suitable for dull processing, power density P = 5 ×
10 5 ~5×10 6 W/cm 2 , half width tp=5×1/10 7 ~1/1
A pulse waveform control method for a Q-switch pulse laser suitable for rolled dull processing, characterized by controlling the pulse waveform to 0.05 sec.
JP62040777A 1987-02-24 1987-02-24 Method for controlling pulse waveform of q switching pulse laser suitable for roll dulling process Granted JPS63207484A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62040777A JPS63207484A (en) 1987-02-24 1987-02-24 Method for controlling pulse waveform of q switching pulse laser suitable for roll dulling process
DE3850330T DE3850330T2 (en) 1987-02-24 1988-02-24 DEVICE FOR FINISHING A ROLL WITH IMPULSE LASER.
EP88902201A EP0308512B1 (en) 1987-02-24 1988-02-24 Apparatus for dull finish of roll with pulse laser
PCT/JP1988/000194 WO1988006504A1 (en) 1987-02-24 1988-02-24 Method and apparatus for dull finish of roll with pulse laser
US07/305,121 US4947023A (en) 1987-02-24 1988-10-18 Method and apparatus for roll dulling by pulse laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62040777A JPS63207484A (en) 1987-02-24 1987-02-24 Method for controlling pulse waveform of q switching pulse laser suitable for roll dulling process

Publications (2)

Publication Number Publication Date
JPS63207484A JPS63207484A (en) 1988-08-26
JPH0369636B2 true JPH0369636B2 (en) 1991-11-01

Family

ID=12590058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62040777A Granted JPS63207484A (en) 1987-02-24 1987-02-24 Method for controlling pulse waveform of q switching pulse laser suitable for roll dulling process

Country Status (1)

Country Link
JP (1) JPS63207484A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4610059B2 (en) * 2000-08-25 2011-01-12 株式会社アマダエンジニアリングセンター Laser processing method and apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030594A (en) * 1983-07-29 1985-02-16 Sumitomo Metal Ind Ltd Laser working method of rolling roll

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030594A (en) * 1983-07-29 1985-02-16 Sumitomo Metal Ind Ltd Laser working method of rolling roll

Also Published As

Publication number Publication date
JPS63207484A (en) 1988-08-26

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