JPH0369228U - - Google Patents

Info

Publication number
JPH0369228U
JPH0369228U JP13080589U JP13080589U JPH0369228U JP H0369228 U JPH0369228 U JP H0369228U JP 13080589 U JP13080589 U JP 13080589U JP 13080589 U JP13080589 U JP 13080589U JP H0369228 U JPH0369228 U JP H0369228U
Authority
JP
Japan
Prior art keywords
circuit board
integrated circuit
holder
recess
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13080589U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13080589U priority Critical patent/JPH0369228U/ja
Publication of JPH0369228U publication Critical patent/JPH0369228U/ja
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１実施例による冷却装置の
断面図、第２図は本考案の第２実施例による冷却
装置の断面図、第３図は本考案の第３実施例によ
る冷却装置の断面図、第４図は従来の冷却装置の
断面図である。 １，１Ａ……冷却台、１ａ……冷却面、２，２
Ａ……ホルダ、３，３Ａ……集積回路基板、４，
４Ａ……凹所、５，５Ａ……貫通孔、６……粘性
グリース、９……粘着テープ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 集積回路基板を取付けた状態で冷却台上に載置
    される冷却用ホルダにおいて、ホルダの下面に集
    積回路基板を落し込める凹所を形成し、ホルダの
    上面側から集積回路基板を突き出すことができる
    貫通孔を同凹所の中央部に穿ち、粘性部材または
    粘着部材により前記凹所の内部に集積回路基板を
    保持させることを特徴とする集積回路基板の冷却
    用ホルダ。
JP13080589U 1989-11-09 1989-11-09 Pending JPH0369228U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13080589U JPH0369228U (ja) 1989-11-09 1989-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13080589U JPH0369228U (ja) 1989-11-09 1989-11-09

Publications (1)

Publication Number Publication Date
JPH0369228U true JPH0369228U (ja) 1991-07-09

Family

ID=31678353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13080589U Pending JPH0369228U (ja) 1989-11-09 1989-11-09

Country Status (1)

Country Link
JP (1) JPH0369228U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010025688A (ja) * 2008-07-17 2010-02-04 Dainippon Printing Co Ltd マイクロチップの製造方法
JP2010025685A (ja) * 2008-07-17 2010-02-04 Dainippon Printing Co Ltd マイクロチップの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010025688A (ja) * 2008-07-17 2010-02-04 Dainippon Printing Co Ltd マイクロチップの製造方法
JP2010025685A (ja) * 2008-07-17 2010-02-04 Dainippon Printing Co Ltd マイクロチップの製造方法

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