JPH0369219U - - Google Patents
Info
- Publication number
- JPH0369219U JPH0369219U JP13034289U JP13034289U JPH0369219U JP H0369219 U JPH0369219 U JP H0369219U JP 13034289 U JP13034289 U JP 13034289U JP 13034289 U JP13034289 U JP 13034289U JP H0369219 U JPH0369219 U JP H0369219U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- dip
- exterior
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案による一実施例の側面図
及びそのＡ−Ａ′断面図、第２図は第１図を製造
するに際しパラフインの滴下状態を示す側面図、
第３図は第２図に樹脂材を外装被着した状態を示
す側面図、第４図は従来技術の側面図、第５図は
第４図の樹脂垂れ部をスルーホールに当接挿入し
た状態の一部拡大側面図である。
図において、１……リード付電子部品（コンデ
ンサ）、２……リード、２ａ……付け根、４……
樹脂材、４ａ……樹脂垂れ部、４ａ−１……通気
用溝（スリツト）を示す。
1A and 1B are side views and A-A' cross-sectional views thereof of an embodiment according to the present invention, FIG. 2 is a side view showing the dripping state of paraffin when manufacturing FIG.
Figure 3 is a side view showing a state in which resin material is applied to the exterior of Figure 2, Figure 4 is a side view of the conventional technology, and Figure 5 is a state in which the resin dripping part shown in Figure 4 is inserted into the through hole. It is a partially enlarged side view of the state. In the figure, 1... electronic component with lead (capacitor), 2... lead, 2a... base, 4...
Resin material, 4a... Resin dripping portion, 4a-1... Ventilation groove (slit).
Claims (1)
であつて、 前記リード２の付け根２ａの樹脂垂れ部４ａに
通気用溝４ａ−１を備えることを特徴とする樹脂
デイツプ形リード付電子部品。[Claims for Utility Model Registration] A lead-equipped electronic component having a resin material 4 as a dip exterior, the resin dip being characterized in that a resin dripping portion 4a at the base 2a of the lead 2 is provided with a ventilation groove 4a-1. Electronic components with shaped leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13034289U JPH0369219U (en) | 1989-11-07 | 1989-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13034289U JPH0369219U (en) | 1989-11-07 | 1989-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369219U true JPH0369219U (en) | 1991-07-09 |
Family
ID=31677926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13034289U Pending JPH0369219U (en) | 1989-11-07 | 1989-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369219U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009136270A (en) * | 2007-12-06 | 2009-06-25 | Ryukan Challenge:Kk | Assistance for piton |
| JP2011004700A (en) * | 2009-06-29 | 2011-01-13 | Tatsuo Kiryu | Support holding device for plant cultivation |
-
1989
- 1989-11-07 JP JP13034289U patent/JPH0369219U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009136270A (en) * | 2007-12-06 | 2009-06-25 | Ryukan Challenge:Kk | Assistance for piton |
| JP2011004700A (en) * | 2009-06-29 | 2011-01-13 | Tatsuo Kiryu | Support holding device for plant cultivation |
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