JPH0369035A - Epoxy substrate for optical disk and production thereof - Google Patents
Epoxy substrate for optical disk and production thereofInfo
- Publication number
- JPH0369035A JPH0369035A JP1204815A JP20481589A JPH0369035A JP H0369035 A JPH0369035 A JP H0369035A JP 1204815 A JP1204815 A JP 1204815A JP 20481589 A JP20481589 A JP 20481589A JP H0369035 A JPH0369035 A JP H0369035A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- phenoxy resin
- resin
- substrate
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 239000004593 Epoxy Substances 0.000 title claims abstract description 19
- 230000003287 optical effect Effects 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 28
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 5
- 125000006850 spacer group Chemical group 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 4
- 238000005266 casting Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- -1 benzyl dimethyl ketal Chemical compound 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Manufacturing Optical Record Carriers (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、生産性に優れた光ディスク用エポキシ基板に
関するものでる。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an epoxy substrate for optical discs with excellent productivity.
（従来の技術）
光ディスク用エポキシ基板は、一般にエポキシ樹脂と酸
無水物からなる組成物を、鏡面加工したキャビティ内で
硬化させるいわゆる注型法により製造される。このとき
用いられる金型に対してエポキシ樹脂は離型性が悪く、
何らかの形で離型処理を施さなければならない、その離
型処理方法は、金型の鏡面性を維持し、且つ基板への移
行を防がなければならない、そのための有効な処理方法
としては、スパッタリング、蒸着法等により、表面エネ
ルギーの小さな材料からなる薄膜を形成する方法が知ら
れている。しかしこの方法で大量生産するには大規模な
設備が必要であり問題があった。(Prior Art) Epoxy substrates for optical disks are generally manufactured by a so-called casting method in which a composition made of an epoxy resin and an acid anhydride is cured in a mirror-finished cavity. Epoxy resin has poor mold releasability for the mold used at this time,
Some form of mold release treatment must be performed, and the mold release treatment method must maintain the specularity of the mold and prevent migration to the substrate. Sputtering is an effective treatment method for this purpose. 2. Description of the Related Art There are known methods of forming thin films made of materials with low surface energy by , vapor deposition, and the like. However, mass production using this method requires large-scale equipment, which poses a problem.
また、光ディスク用エポキシ基板は、レーザー光をトラ
ッキン゛グさせるための案内溝を、案内溝の母型が形成
されたスタンパ上に紫外線硬化樹脂を塗布し、その上に
基板を載置し基板側より紫外線を照射し樹脂を硬化して
、スタンパより剥離し基板に案内溝を形成する。ところ
が一般にエポキシ基板は紫外線硬化樹脂との密着性に乏
しいため、予めプライマー等の密着性付与剤をコートす
る必要があり、工数、設備の面で問題があった。In addition, in the epoxy substrate for optical disks, guide grooves for tracking laser light are formed by applying ultraviolet curable resin onto a stamper on which a matrix of the guide grooves is formed, and then placing the substrate on top of the stamper. The resin is cured by irradiation with ultraviolet rays, and then peeled off from the stamper to form a guide groove on the substrate. However, since epoxy substrates generally have poor adhesion to ultraviolet curing resins, it is necessary to coat them with an adhesion agent such as a primer in advance, which poses problems in terms of man-hours and equipment.
（発明が解決しようとする課題〉
本発明は、光ディスク用エポキシ基のこのような問題を
一挙に解決するため鋭意検討した結果、完成させるに至
ったもので、その目的とするところは、型の離型処理を
しなくても硬化後のエポキシ基板が容易に剥離でき、さ
らに紫外線硬化樹脂による案内溝の形成に際してブライ
マー処理をしなくても十分な密着性を得ることのできる
エポキシ基板を提供する事にある。(Problems to be Solved by the Invention) The present invention was completed as a result of intensive studies aimed at solving all of these problems with epoxy groups for optical discs. To provide an epoxy substrate from which a cured epoxy substrate can be easily peeled off without a mold release treatment, and furthermore, sufficient adhesion can be obtained without a brimer treatment when forming guide grooves using an ultraviolet curable resin. It's true.
（課題を解決するための手段〉
すなわち本発明は、エポキシ樹脂硬化物層の片面もしく
は両面にフェノキシ樹脂層を形成させ、２Ｎもしくは３
層構造としたことを特徴とする光ディスク用エポキシ基
板、及び鏡面研磨した２枚の平板の少なくとも１枚の表
面にフェノキシ樹脂溶液を塗布し、フェノキシ樹脂溶液
を塗布した面を内側にして前記２枚の平板を対向させス
ペーサーを介して組立てたキャビティ内に、エポキシ樹
脂と酸無水物から主としてなる＆［ｌ放物を注入し、樹
脂を硬化させた後、脱型することを特徴とする光ディス
ク用エポキシ基板の製造方法である。(Means for Solving the Problem) That is, the present invention forms a phenoxy resin layer on one or both sides of a cured epoxy resin layer, and
An epoxy substrate for an optical disk, characterized in that it has a layered structure, and a phenoxy resin solution is applied to the surface of at least one of two mirror-polished flat plates, and the two plates are placed with the surface coated with the phenoxy resin solution inside. For optical discs, a parabolite mainly consisting of an epoxy resin and an acid anhydride is injected into a cavity assembled with flat plates facing each other via a spacer, and after the resin is cured, the mold is removed. This is a method for manufacturing an epoxy board.
本発明において用いられるフェノキシ樹脂とは、ビスフ
ェノールＡ型エポキシ樹脂の線状高分子であり、構造は
次に示す通りである。The phenoxy resin used in the present invention is a linear polymer of bisphenol A type epoxy resin, and the structure is as shown below.
ｊレ
セロソツ゛系等の溶剤で希釈する。この溶液を注型底形
用のキャビティを形成するための鏡面研磨した平板面上
に均一に塗布する。塗布厚みは、５μｍ以上１００μｍ
以下が好ましい、この範囲を超えると注型硬化物の型面
からの離型が困難になるからである。さらに、フェノキ
シ樹脂溶液は予め濾過梢製して使用するのが好ましく、
具体的には０．２μ程度のフィルターで濾過するのが良
い。Dilute with a solvent such as resin. This solution is uniformly applied onto the surface of a mirror-polished flat plate for forming a cavity for the bottom of the mold. Coating thickness is 5μm or more and 100μm
The following is preferable, because if it exceeds this range, it becomes difficult to release the cast cured product from the mold surface. Furthermore, it is preferable to use the phenoxy resin solution after filtering it in advance.
Specifically, it is preferable to filter with a filter of about 0.2μ.
また、エポキシ樹脂組成物は、硬化剤としての酸無水物
の他に硬化促進剤等の添加剤を適宜含んでいても何ら差
しつかえない、エポキシ樹脂と酸無水物がフェノキシ樹
脂の側鎖水酸基と反応し、フェノキシ樹脂層とエポキシ
樹脂層とが強固に密着する。尚、硬化したエポキシ基板
上にフェノキシ樹脂溶液を塗布しても密着性はほとんど
得られない。In addition, the epoxy resin composition may contain appropriate additives such as a curing accelerator in addition to the acid anhydride as a curing agent. The reaction occurs, and the phenoxy resin layer and the epoxy resin layer are firmly adhered to each other. Incidentally, even if the phenoxy resin solution is applied onto a cured epoxy substrate, almost no adhesion can be obtained.
次に、本発明によるエポキシ基板の製造方法について述
べる。先ず、前記のフェノキシ樹脂溶液をガラス板等の
平板の一方の面に塗布し、第１図に示したように、平！
ｌ）のフェノキシ樹脂の塗膜（２）が形成された面を内
側にして、もう１枚の平板（４）と対向させ、その間に
スペーサー（３）を挟んで、注型底形用の型を組立てる
。このとき、平板（４）の型の内側になる面にもフェノ
キシ樹脂溶液が塗布してあっても良い。Next, a method for manufacturing an epoxy substrate according to the present invention will be described. First, the phenoxy resin solution described above is applied to one side of a flat plate such as a glass plate, and as shown in FIG.
Place the surface with the phenoxy resin coating (2) inward and face it with another flat plate (4), sandwiching the spacer (3) between them, and place the mold for the bottom shape of the casting. Assemble. At this time, the phenoxy resin solution may also be applied to the surface of the flat plate (4) that will be inside the mold.
このようにして組立てた型のキャビティ中に、第２図に
示したように、デイスペンサ（５）等を用いさせる。こ
れによりフェノキシ樹脂の塗膜（２）がエポキシ樹脂（
６）の層と一体化され、２層構造の基板が形成される。A dispenser (5) or the like is used in the cavity of the mold thus assembled, as shown in FIG. As a result, the coating film (2) of phenoxy resin becomes epoxy resin (
It is integrated with layer 6) to form a two-layer structure substrate.
硬化後は、フェノキシ樹脂と型面との密着性がほとんど
ないため、平板（１）と塗膜（２）の間で容易に剥離す
るので、容易に脱型することができる。なお、注型成形
における硬化条件は、エポキシ樹脂の硬化前はフェノキ
シ樹脂の融点以下にすることが好ましい。これはフェノ
キシ樹脂がエポキシ樹脂と混合すると、型面からの離型
が困難になるからである。After curing, since there is almost no adhesion between the phenoxy resin and the mold surface, the flat plate (1) and the coating film (2) are easily peeled off, so that the mold can be easily removed. Note that the curing conditions in cast molding are preferably below the melting point of the phenoxy resin before the epoxy resin is cured. This is because when a phenoxy resin is mixed with an epoxy resin, it becomes difficult to release it from the mold surface.
以上の工程で得られたエポキシ基板に対して、スタンパ
の母型面に塗布した紫外線硬化樹脂を転写して基板上に
案内溝を形成させる。この場合、基板表面がフェノキシ
樹脂層であるため、プライマー処理をしなくても紫外線
硬化樹脂層を形成することかできる。Guide grooves are formed on the epoxy substrate obtained in the above steps by transferring the ultraviolet curing resin applied to the mold surface of the stamper. In this case, since the surface of the substrate is a phenoxy resin layer, an ultraviolet curable resin layer can be formed without primer treatment.
（実施例）
ガラス製の平板に、フェノキシ樹脂（東部化或製、商品
名「フェノトート」）をメチルエチルケトン／エチルセ
ロソルブ＝Ｖ４（重量比）の混合溶剤に２０％溶解した
ものをスピンコード法により塗布し、厚み約１０μｍの
フェノキシ樹脂層を形成した。(Example) A 20% solution of phenoxy resin (manufactured by Tobu Kaisha, trade name "Phenotote") in a mixed solvent of methyl ethyl ketone/ethyl cellosolve = V4 (weight ratio) was placed on a glass flat plate using the spin code method. The coating was applied to form a phenoxy resin layer with a thickness of about 10 μm.
次に、このガラス製平板を第２図のように組立てたキャ
ビティ型中に、ビスフェノール Ａ型エポキシ樹脂（エ
ポキシ当量１８８）、メチルテトラヒドロフタル酸無水
物、２−エチル−４−メチルイミダゾールをそれぞれ１
００：８６：１の割合で混合し、脱泡した液状組成物を
流し込み、７０゛Ｃ５６時間でゲル化した後、１３０°
Ｃ５時間硬化させた。得られた基板の取り出しは容易で
あった。Next, in a cavity mold in which this glass flat plate was assembled as shown in Figure 2, 1 volume each of bisphenol A type epoxy resin (epoxy equivalent: 188), methyltetrahydrophthalic anhydride, and 2-ethyl-4-methylimidazole were added.
The defoamed liquid composition was mixed at a ratio of 00:86:1 and gelled at 70°C for 56 hours, then heated at 130°C.
Cured for C5 hours. The obtained substrate was easy to take out.
次に所定の大きさに加工した後、紫外線硬化樹脂として
エポキシアクリレ−）／Ｎ−ビニルピロリドン／ベンジ
ルジメチルケタル＝５０１５０／３のさらに７０°Ｃ５
８０％ＫＨ１１０００時間処理後も密着性に変化がなか
った。Next, after processing to a predetermined size, a UV-curable resin of epoxy acrylate)/N-vinylpyrrolidone/benzyl dimethyl ketal = 50150/3 was further added to 70°C5.
There was no change in adhesion even after treatment with 80% KH for 11,000 hours.
（発明の効果）
本発明によると、エポキシ樹脂の注型成形用の型を離型
処理をせずに使用することができ、更には、得られたエ
ポキシ基板に対してブライマー処理をせずに紫外線硬化
樹脂による案内溝層を形成することができ、生産性が格
段に向上し、工業的に極めて有意義である。更に特筆す
べきことは、基板表面層が可とう性の優れたフェノキシ
樹脂層よりなるため、機械特性の改良、紫外線硬化樹脂
を硬化する際の収縮緩和の他、従来のエポキシ基板の屈
折率に比べてフェノキシ樹脂層の屈折率が高いため、レ
ーザーの収光性が高まり高密度記録用途にも適する等の
利点が得られる。(Effects of the Invention) According to the present invention, a mold for cast molding of epoxy resin can be used without a mold release treatment, and furthermore, the obtained epoxy substrate can be used without a brimer treatment. The guide groove layer can be formed using an ultraviolet curable resin, which greatly improves productivity and is extremely meaningful industrially. What is also noteworthy is that the surface layer of the substrate is made of a highly flexible phenoxy resin layer, which not only improves mechanical properties and alleviates shrinkage when curing ultraviolet curable resin, but also improves the refractive index of conventional epoxy substrates. In comparison, since the refractive index of the phenoxy resin layer is high, it has advantages such as improved laser light convergence and suitability for high-density recording applications.
第１図は基板の注型に用いられる型の組立、構成を示す
図で、第２図は第１図で組立てた型にエポキシ樹脂を注
入する工程を示す図である。FIG. 1 is a diagram showing the assembly and configuration of a mold used for casting a substrate, and FIG. 2 is a diagram showing the process of injecting epoxy resin into the mold assembled in FIG. 1.
Claims (2)
ノキシ樹脂層を形成させ、２層もしくは３層構造とした
ことを特徴とする光ディスク用エポキシ基板。(1) An epoxy substrate for an optical disk, characterized in that a phenoxy resin layer is formed on one or both sides of a cured epoxy resin layer, resulting in a two-layer or three-layer structure.
にフェノキシ樹脂溶液を塗布し、フェノキシ樹脂溶液を
塗布した面を内側にして前記２枚の平板を対向させスペ
ーサーを介して組立てたキャビティ内に、エポキシ樹脂
と酸無水物から主としてなる組成物を注入し、樹脂を硬
化させた後、脱型することを特徴とする光ディスク用エ
ポキシ基板の製造方法。(2) A cavity in which a phenoxy resin solution is applied to at least one surface of two mirror-polished flat plates, and the two flat plates are assembled via a spacer with the surface coated with the phenoxy resin solution facing inside. 1. A method for manufacturing an epoxy substrate for an optical disk, which comprises injecting a composition mainly consisting of an epoxy resin and an acid anhydride into the substrate, curing the resin, and then removing the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1204815A JPH0369035A (en) | 1989-08-09 | 1989-08-09 | Epoxy substrate for optical disk and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1204815A JPH0369035A (en) | 1989-08-09 | 1989-08-09 | Epoxy substrate for optical disk and production thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369035A true JPH0369035A (en) | 1991-03-25 |
Family
ID=16496838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1204815A Pending JPH0369035A (en) | 1989-08-09 | 1989-08-09 | Epoxy substrate for optical disk and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369035A (en) |
-
1989
- 1989-08-09 JP JP1204815A patent/JPH0369035A/en active Pending
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