JPH0367473U - - Google Patents
Info
- Publication number
- JPH0367473U JPH0367473U JP12900189U JP12900189U JPH0367473U JP H0367473 U JPH0367473 U JP H0367473U JP 12900189 U JP12900189 U JP 12900189U JP 12900189 U JP12900189 U JP 12900189U JP H0367473 U JPH0367473 U JP H0367473U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- soldered
- electronic component
- prevention structure
- short prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12900189U JPH0367473U (id) | 1989-11-02 | 1989-11-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12900189U JPH0367473U (id) | 1989-11-02 | 1989-11-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0367473U true JPH0367473U (id) | 1991-07-01 |
Family
ID=31676668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12900189U Pending JPH0367473U (id) | 1989-11-02 | 1989-11-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0367473U (id) |
-
1989
- 1989-11-02 JP JP12900189U patent/JPH0367473U/ja active Pending