JPH0367459U - - Google Patents
Info
- Publication number
- JPH0367459U JPH0367459U JP12838089U JP12838089U JPH0367459U JP H0367459 U JPH0367459 U JP H0367459U JP 12838089 U JP12838089 U JP 12838089U JP 12838089 U JP12838089 U JP 12838089U JP H0367459 U JPH0367459 U JP H0367459U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting chip
- emitting diode
- flat part
- step part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838089U JPH0367459U (zh) | 1989-10-31 | 1989-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838089U JPH0367459U (zh) | 1989-10-31 | 1989-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367459U true JPH0367459U (zh) | 1991-07-01 |
Family
ID=31676088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12838089U Pending JPH0367459U (zh) | 1989-10-31 | 1989-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367459U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006103295A (ja) * | 2004-10-06 | 2006-04-20 | Fukuhara Co Ltd | インラインスクリュー式成形機の不良発生防止装置 |
| WO2008126696A1 (ja) * | 2007-04-05 | 2008-10-23 | Rohm Co., Ltd. | 半導体発光装置 |
-
1989
- 1989-10-31 JP JP12838089U patent/JPH0367459U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006103295A (ja) * | 2004-10-06 | 2006-04-20 | Fukuhara Co Ltd | インラインスクリュー式成形機の不良発生防止装置 |
| WO2008126696A1 (ja) * | 2007-04-05 | 2008-10-23 | Rohm Co., Ltd. | 半導体発光装置 |