JPH0365272U - - Google Patents
Info
- Publication number
- JPH0365272U JPH0365272U JP12686689U JP12686689U JPH0365272U JP H0365272 U JPH0365272 U JP H0365272U JP 12686689 U JP12686689 U JP 12686689U JP 12686689 U JP12686689 U JP 12686689U JP H0365272 U JPH0365272 U JP H0365272U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- circuit device
- film circuit
- wiring pattern
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009966 trimming Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12686689U JPH0751806Y2 (ja) | 1989-10-30 | 1989-10-30 | 厚膜回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12686689U JPH0751806Y2 (ja) | 1989-10-30 | 1989-10-30 | 厚膜回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0365272U true JPH0365272U (pt-PT) | 1991-06-25 |
| JPH0751806Y2 JPH0751806Y2 (ja) | 1995-11-22 |
Family
ID=31674656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12686689U Expired - Lifetime JPH0751806Y2 (ja) | 1989-10-30 | 1989-10-30 | 厚膜回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751806Y2 (pt-PT) |
-
1989
- 1989-10-30 JP JP12686689U patent/JPH0751806Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0751806Y2 (ja) | 1995-11-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |